The Global Market
完整報告名稱與涵蓋範圍
The Global Market for Active, Passive and Solid-State Cooling 2026-2036
報告摘要
The global cooling market is undergoing a fundamental transformation driven by escalating thermal management demands across virtually every sector of the modern economy. From AI data centers pushing power densities beyond 100 kW per rack to electric vehicles requiring sophisticated battery thermal management, and from 6G communications infrastructure operating at terahertz frequencies to quantum computers demanding millikelvin cryogenic environments, the need for advanced cooling solutions has never been more urgent.
This comprehensive market research report provides an in-depth analysis of the global market for active, passive, and solid-state cooling technologies and materials for the period 2026–2036, with extended forecasts to 2046. The report examines the full spectrum of cooling approaches, from established passive cooling materials such as thermal interface materials (TIMs), phase change materials (PCMs), heat pipes, vapor chambers, and radiative cooling coatings, through to next-generation solid-state technologies including thermoelectric (Peltier) cooling, magnetocaloric, electrocaloric, elastocaloric, LED-based thermophotonic, phononic, and advanced thermionic cooling systems.
The market is being reshaped by powerful converging forces: electrification and energy efficiency mandates are tightening performance standards; and emerging technology sectors—AI computing, electric vehicles, 6G communications, and quantum computing—are creating entirely new thermal management challenges that conventional vapor compression systems cannot address.
Emerging materials are central to the market's evolution. Carbon nanomaterials including graphene, carbon nanotubes, and nanodiamonds are enabling step-change improvements in thermal conductivity. Metal-organic frameworks (MOFs) are opening new pathways for solid-state air conditioning. Metamaterials and metasurfaces are enabling passive daytime radiative cooling and precision thermal management at the chip level. Hydrogels and aerogels are finding applications from building cooling to electronics thermal buffering.
The report delivers granular market forecasts segmented by technology type, material category, end-use application, and geography. It covers passive cooling materials, solid-state cooling modules and systems, cryogenic cooling for quantum computing, semiconductor packaging thermal management, data center cooling, EV thermal management, and 6G communications thermal materials. With over 315 company profiles, detailed technology roadmaps, and application suitability mapping from 2025 through 2046, this report is an essential strategic resource for materials suppliers, device manufacturers, system integrators, and investors navigating the rapidly evolving advanced cooling landscape.
The Global Market for Active, Passive and Solid-State Cooling 2026–2036 report delivers comprehensive market intelligence on the advanced cooling technologies and thermal management materials market, projected to experience significant growth driven by AI data centers, electric vehicles, 6G telecommunications, and quantum computing infrastructure demands.
Report coverage includes:
Passive cooling materials market analysis — thermal interface materials (TIMs), phase change materials (PCMs), graphene and carbon nanotube thermal solutions, heat pipes and vapor chambers, radiative cooling paints and coatings, aerogels, hydrogels, and metal-organic frameworks (MOFs)
Solid-state cooling technology assessment — thermoelectric (Peltier) cooling, magnetocaloric, electrocaloric, elastocaloric, barocaloric, LED-based thermophotonic cooling, phononic cooling, quantum dot cooling, photonic crystal cooling, and advanced thermionic cooling
Metamaterials and metasurfaces for thermal management — passive daytime radiative cooling (PDRC), thermal cloaking, metamaterial heat spreaders, and cooling films with global market forecasts to 2036
Quantum computing cryogenic cooling solutions — dilution refrigeration, adiabatic demagnetization refrigeration (ADR), He-3 free solutions, and cryogenic component market sizing
Semiconductor packaging thermal management — TIM1 and TIM1.5 materials, advanced 2.5D and 3D IC thermal solutions, liquid cooling for HPC, diamond substrates, and AI-enhanced thermal design
6G communications thermal materials — vapor chambers, PDRC for infrastructure, thermoelectric cooling/harvesting, metamaterial thermal management, hydrogel cooling, and ionogels
Data center cooling market — liquid cooling, immersion cooling, chip-level cooling, thermoelectric integration, and heat recovery systems
Electric vehicle thermal management — battery cooling, power electronics, cabin comfort, and ADAS sensor thermal management
Active cooling innovations — electrochromic smart windows, MEMS micro-fan cooling, air conditioner alternatives, and energy storage thermal management
Global market forecasts 2025–2046 segmented by technology, material type, end-use application, and region (North America, Europe, Asia-Pacific, Rest of World)
Technology roadmaps — passive cooling, active cooling, and solid-state cooling development timelines with TRL assessments and commercialization projections
240+ company profiles spanning established thermal management leaders and innovative startups across the global cooling value chain. Companies profiled include: 3M, ABIS Aerogel Co., Accelcius, ADA Technologies, Advanced Thermal Solutions, AegiQ, Aerofybers Technologies, aerogel-it GmbH, Aerogel Technologies, Aerogel UK, AI Technology, Aismalibar, Akash Systems, Anyon Systems, Barocal, Carbice, Corintis, Eaton, Frore Systems, Krosslinker, Magnotherm, Phononic, Sophia Space more
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目錄 Table of Contents
1 EXECUTIVE SUMMARY 32
1.1 Market Overview 32
1.1.1 The Global Cooling Market Landscape 32
1.1.2 Key Materials and Technologies in Passive Cooling 32
1.1.3 Global Solid-State Cooling Market Size and Growth Projections 2025–2046 33
1.1.4 Emerging Technologies Cooling Market Opportunity Assessment 33
1.2 Market Drivers 33
1.2.1 Electrification and Energy Efficiency Mandates 33
1.2.2 AI Data Centres and High-Performance Computing 33
1.2.3 Electric Vehicles and Zero-Emission Transportation 34
1.2.4 6G Communications Infrastructure 34
1.2.5 Quantum Computing Growth 34
1.3 Emerging Materials Overview 35
1.3.1 Types and Formats of Emerging Carbon Materials for Thermal Cooling 35
1.3.2 Types and Formats of Emerging Inorganic Compounds 36
1.3.3 Emerging Polymer and Hybrid Materials 38
1.4 Passive Versus Active Cooling 38
1.4.1 Definitions, Operating Principles, and Energy Requirements 38
1.4.2 Comparative Performance 39
1.4.3 Cooling People Versus Cooling Things 39
1.5 Technology Landscape 42
1.5.1 Established Versus Emerging Solid-State Cooling Technologies 42
1.5.2 Cooling Toolkit and Potential Winners 43
1.5.3 Technology Readiness Levels and Commercialisation Timelines 44
1.5.4 LED-Based Thermophotonic Cooling Performance Benchmarks 45
1.5.5 Quantum Cryogenic Cooling Requirements and Market Applications 45
1.6 Applications Roadmap 2025–2046 47
1.6.1 Near-Term Applications (2025–2030) 47
1.6.2 Medium-Term Applications (2030–2036) 48
1.6.3 Long-Term Applications (2036–2046) 49
1.7 Market Forecasts 2025–2046 50
1.7.1 Passive Cooling Materials and Technologies 50
1.7.2 Active Cooling Technologies and Systems 52
1.7.3 Solid-State Cooling Technologies 53
1.7.4 Cryogenic Equipment Market 55
1.7.5 Combined Advanced Cooling Market Summary 56
1.8 Technology Roadmaps 57
1.8.1 Passive Cooling Roadmap by Market and by Technology 57
1.8.2 Active Cooling and Thermal Management Roadmap 69
1.8.3 Solid-State Cooling Roadmap 2025–2046 79
2 PASSIVE COOLING MATERIALS AND TECHNOLOGIES 89
2.1 Principles Employed for Cooling or Prevention of Heating 89
2.1.1 Conduction 89
2.1.2 Convection 89
2.1.3 Radiation 89
2.1.4 Evaporation 89
2.1.5 Insulation 89
2.1.6 Phase Change 90
2.2 Thermal Interface Materials (TIMs) 90
2.2.1 What Are TIMs? 90
2.2.2 Types of TIMs 92
2.2.3 Thermal Conductivity of TIM Fillers 92
2.2.4 Comparative Properties of TIMs 93
2.2.5 Advantages and Disadvantages of TIMs, by Type 94
2.2.6 Thermal Greases and Pastes 95
2.2.7 Thermal Gap Pads 97
2.2.8 Thermal Gap Fillers 98
2.2.9 Thermal Adhesives and Potting Compounds 99
2.2.10 Metal-Based TIMs 100
2.2.10.1 Overview 100
2.2.10.2 Solders and Low Melting Temperature Alloy TIMs 100
2.2.10.3 Liquid Metals 101
2.2.10.4 Solid Liquid Hybrid (SLH) Metals 102
2.2.10.5 Hybrid Liquid Metal Pastes 102
2.2.10.6 SLH Created During Chip Assembly (m2TIMs) 102
2.2.11 TIM Fillers: Trends, Chemistry, and Selection 103
2.3 Phase Change Materials (PCMs) 104
2.3.1 Key Properties 104
2.3.2 Classification 104
2.3.3 PCM Types and Properties 106
2.3.4 Organic PCMs 107
2.3.4.1 Paraffin Wax 107
2.3.4.2 Non-Paraffins (Fatty Acids, Esters, Alcohols) 107
2.3.4.3 Bio-Based Phase Change Materials 107
2.3.5 Inorganic PCMs 108
2.3.5.1 Salt Hydrates 108
2.3.5.2 Metal and Metal Alloy PCMs (High-Temperature) 108
2.3.6 Eutectic PCMs 109
2.3.7 Encapsulation of PCMs 109
2.3.7.1 Macroencapsulation 109
2.3.7.2 Micro/Nanoencapsulation 110
2.3.7.3 Shape-Stabilised PCMs 110
2.3.7.4 Self-Assembly Encapsulation 110
2.3.8 SWOT Analysis for Phase Change Materials for Passive Cooling 110
2.4 Carbon Materials for Thermal Management 112
2.4.1 Comparison: Silicone Versus Carbon-Based Polymers 112
2.4.2 Graphene 112
2.4.2.1 Graphene as TIM Fillers 112
2.4.2.2 Graphene Foam and 3D Structures 113
2.4.2.3 Graphene Films and Heat Spreaders 113
2.4.3 Carbon Nanotubes (CNTs) 113
2.4.3.1 Vertically Aligned CNT Arrays 113
2.4.3.2 CNT Buckypapers 113
2.4.4 Fullerenes 114
2.4.5 Nanodiamonds 114
2.4.6 SWOT analysis for carbon materials for passive cooling 114
2.5 Metal Organic Frameworks (MOFs) 116
2.5.1 Structure and Properties 116
2.5.2 Water Adsorption Cooling Cycles 116
2.5.3 MOF-Based Adsorption Cooling Systems 116
2.5.4 Development Stage and Commercialisation Outlook 116
2.6 Heat Pipes and Vapour Chambers 117
2.6.1 Technology Description and Operating Principle 117
2.6.2 Loop Heat Pipes 117
2.6.3 Vapour Chambers 118
2.6.4 Flat Plate and Pulsating Derivatives 118
2.6.5 Emerging Heat Pipe Designs 118
2.7 Radiative Cooling 118
2.7.1 Heat Sinks 118
2.7.1.1 Conventional Heat Sinks 118
2.7.1.2 Advanced Heat Sinks 118
2.7.1.3 PCM-Enhanced Latent Heat Sinks 119
2.7.2 Traditional Radiative Cooling 119
2.7.3 Building Radiative Cooling 119
2.7.4 Passive Daytime Radiative Cooling (PDRC) 119
2.7.4.1 Overview and Mechanism 119
2.7.4.2 Materials Innovations 119
2.7.4.3 Commercialisation Requirements 119
2.7.4.4 Nano-Photonic Film Example 119
2.7.5 Thermal Louvers 120
2.7.6 Anti-Stokes Fluorescence Cooling 120
2.8 Hydrogels for Cooling 120
2.8.1 Structure 120
2.8.2 Classification 120
2.8.3 Formulations and Benefits 122
2.8.4 Cooling Systems and Applications 123
2.8.4.1 Evaporative Hydrogel Cooling 123
2.8.4.2 Hydroceramic Systems 123
2.8.4.3 Solar Panel Cooling 123
2.8.4.4 Electronics and Data Centre Cooling 123
2.8.4.5 Moisture Thermal Battery 123
2.8.4.6 Smart Windows 123
2.8.4.7 Aerogel + Hydrogel Combined Systems 123
2.9 Passive Cooling Paints and Coatings 124
2.9.1 Super-White Paints 124
2.9.2 Metamaterial-Enhanced Coatings 124
2.9.3 Self-Cleaning Cooling Coatings 124
2.9.4 Application Markets 124
2.10 Aerogels 125
2.10.1 Silica Aerogels 125
2.10.1.1 Properties 125
2.10.1.2 Chemical Precursors 126
2.10.1.3 Product Forms 126
2.10.2 SWOT Analysis 127
3 METAMATERIALS AND METASURFACES FOR THERMAL MANAGEMENT 128
3.1 Introduction to Metamaterials 128
3.1.1 Definition and Fundamental Principles 128
3.1.2 Types of Metamaterials 128
3.1.3 Metamaterial Landscape by Wavelength 128
3.1.4 Passive vs Active Metamaterials 129
3.1.5 Manufacturing Methods 129
3.2 Thermal Metamaterials 130
3.2.1 Overview 130
3.2.2 Types of Thermal Management Metamaterials 130
3.2.3 Advanced 3D Printing for Thermal Metamaterials 131
3.2.4 Functionally Graded Materials 131
3.2.5 Thermoelectric Enhancement via Metamaterials 131
3.3 Thermal Metamaterial Applications 131
3.3.1 Static Radiative Cooling Materials 131
3.3.2 Photonic Cooling 131
3.3.3 Ultra-Conductive Thermal Metamaterials 132
3.3.4 Thermal Convective Metamaterials 132
3.3.5 Thermal Cloaking Metamaterials 132
3.3.6 Thermal Concentrators 132
3.3.7 Thermal Diodes 132
3.3.8 Thermal Expanders and Rotators 132
3.3.9 Greenhouses and Windows 133
3.3.10 Industrial Heat Harvesting 133
3.3.11 Thermal Metalenses 133
3.3.12 Microchip Cooling 133
3.3.13 Photovoltaics Cooling 133
3.3.14 Space Applications 134
3.3.15 Electronic Packaging 134
3.3.16 Advanced Cooling Textiles 134
3.3.17 Automotive Thermal Management 134
3.4 Passive Daytime Radiative Cooling (PDRC) Metamaterials 135
3.4.1 Principles and Performance 135
3.4.2 PDRC Technology Comparison 135
3.4.3 Transparent PDRC for Buildings 136
3.4.4 Cooling Films for Power Plants and Industry 136
3.4.5 Optical Solar Reflection Coatings 136
3.5 Tunable Metamaterials for Thermal Applications 137
3.5.1 Overview 137
3.5.2 Tunable Electromagnetic Metamaterials 137
3.5.3 Tunable THz Metamaterials 137
3.5.4 Tunable Optical Metamaterials 137
3.5.5 Applications of Tunable Metamaterials for Thermal Management 138
3.6 Thermal Metamaterial Technology Roadmap 138
3.6.1 Development Timeline 138
3.6.2 Technology Readiness Levels 139
3.7 Global Market for Metamaterials 139
3.7.1 Market Overview 139
3.7.2 SWOT Analysis 139
3.7.3 Global Revenues by End-Use Market 140
3.7.4 Market Opportunity Assessment 141
3.7.5 Companies in Thermal Metamaterials 141
3.7.6 Market and Technology Challenges 142
4 SOLID-STATE COOLING TECHNOLOGIES 143
4.1 Introduction and Technology Classification 143
4.2 Value Chain Analysis 144
4.3 Thermoelectric (Peltier) Cooling 146
4.3.1 Technology Principles 146
4.3.2 Thermoelectric Materials 147
4.3.2.1 Bismuth Telluride 147
4.3.2.2 Alternative Thermoelectric Materials 148
4.3.3 Performance Characteristics and Limitations 149
4.3.4 Applications and Market Penetration 150
4.3.5 Thermoelectric Market Size 151
4.3.6 SWOT Analysis 152
4.4 Magnetocaloric Cooling 153
4.4.1 Technology Principles and Development Status 153
4.4.2 Magnetocaloric Materials 154
4.4.3 Performance Comparison 155
4.4.4 Commercial Applications and Development Status 156
4.4.5 Commercialisation Challenges 157
4.4.6 SWOT Analysis 158
4.5 Electrocaloric Cooling 159
4.5.1 Technology Fundamentals 159
4.5.2 Electrocaloric Materials 159
4.5.3 Development Status and Commercialisation Timeline 160
4.5.4 SWOT Analysis 162
4.6 Elastocaloric and Barocaloric Cooling 163
4.6.1 Caloric Effects Comparison 163
4.6.2 Elastocaloric Cooling 163
4.6.3 Barocaloric Cooling 163
4.6.4 Engineering Challenges 163
4.7 LED-Based Thermophotonic Cooling 164
4.7.1 Principles 164
4.7.2 Development Status 164
4.8 Other Emerging Technologies 165
4.8.1 Phononic Cooling 165
4.8.2 Advanced Thermionic Cooling 165
4.8.3 Ionic Wind Cooling 165
4.9 Comparative Technology Analysis 165
4.9.1 Technology Roadmap 165
4.10 Overall Market Segmentation and Sizing 166
4.10.1 Global Solid-State Cooling Market Overview 166
4.11 Comparative Technology Analysis 167
4.11.1 Performance Benchmarking Matrix Across All Technologies 167
4.11.2 Cost Competitiveness Analysis by Application Segment 169
4.11.3 Application Suitability Mapping and Temperature Ranges 169
4.11.4 Technology Roadmap and Convergence Trends 170
4.11.5 Quantum Technology Integration Capabilities 170
4.12 Market Forecasts by Technology 171
4.13 Market Forecasts by End User 172
4.14 Price Performance Evolution 173
4.15 Regional Market Analysis 173
4.16 Market Drivers and Growth Catalysts 174
4.17 Application-Based Market Segmentation 176
4.17.1 Cryogenic Applications (sub-100K) 176
4.17.2 Ultra-Low Temperature Applications (100–150K) 176
4.17.3 Moderate Cooling Applications (>150K) 177
4.17.4 Semiconductor Sensor Cooling 178
4.17.5 Scientific Instrumentation 178
4.17.6 Medical Devices and Diagnostics 178
4.17.7 Defence and Aerospace 179
4.17.8 Consumer Electronics Thermal Management 179
4.17.9 Data Centre and IT Cooling 179
4.17.10 Automotive Thermal Systems 180
4.17.11 Cost Sensitivity and Value Drivers 180
4.17.12 Technology Adoption Criteria and Decision Factors 180
5 QUANTUM COMPUTING CRYOGENIC COOLING SOLUTIONS 182
5.1 Quantum Cryogenic Cooling Technologies 182
5.1.1 Adiabatic Demagnetisation Refrigeration (ADR) 183
5.1.1.1 Single-Stage and Continuous ADR (cADR) Systems 184
5.1.1.2 Paramagnetic Salt Cooling Media 185
5.1.1.3 Applications in Quantum Computing and Sensing 185
5.1.2 Dilution Refrigeration 186
5.1.2.1 Helium-3 Supply and Alternatives 187
5.1.2.2 Quantum Device Operation Requirements 188
5.2 Superconducting Cooling Technologies 188
5.2.1 Josephson Junction Cooling Applications 188
5.2.2 Trapped-Ion Quantum Computer Cooling 189
5.2.3 Superconducting Qubit Thermal Management 189
5.3 Quantum Sensing and Communication Cooling 190
5.3.1 Single-Photon Detector Cooling Requirements 190
5.3.2 NV Centre and Quantum Sensor Thermal Management 190
5.3.3 Optical Quantum Device Cooling Challenges 190
5.4 Cryogenic Infrastructure and Scaling Challenges 191
5.5 Cryogenic Component Market Analysis 192
5.5.1 Market Overview and TAM/SAM/SOM Framework 192
5.5.2 Component Market Segmentation 193
5.5.3 Regional Market and Competitive Landscape 194
5.5.4 Export Controls and Strategic Considerations 194
5.5.5 SWOT Analysis — Quantum Cryogenic Market 195
6 THERMAL MANAGEMENT FOR ADVANCED SEMICONDUCTOR PACKAGING 197
6.1 Advanced Semiconductor Packaging Overview 197
6.1.1 Evolution of Semiconductor Packaging (2D to Advanced 2.5D and 3D) 197
6.1.2 Thermal Design Power (TDP) Trends for HPC Chips 200
6.1.2.1 2.5D and 3D Packaging in GPUs 200
6.1.3 Power Delivery Challenges 201
6.2 Thermal Management of High-Power Advanced Packages 201
6.2.1 Die-Attach Technology 201
6.2.2 TIM1 and TIM1.5 in 3D Semiconductor Packaging 202
6.2.3 Liquid Cooling Technologies for HPC 203
6.2.4 Hybrid Cooling Systems (Air + Liquid) 204
6.3 Emerging Thermal Technologies for Semiconductor Packaging 204
6.3.1 Carbon Nanotube Thermal Interface Materials 204
6.3.2 Graphene for Thermal Management 204
6.3.2.1 Graphene Manufacturing Methods 204
6.3.2.2 Graphene Composites and Structures 205
6.3.3 Aerogel-Based Thermal Solutions 205
6.3.4 Metamaterial Heat Spreaders 205
6.3.5 Bio-Inspired Thermal Management Approaches 206
6.4 Thermal Modelling and Simulation 206
6.4.1 Multi-Physics Simulation Requirements 206
6.4.2 AI-Enhanced Thermal Design Optimisation 206
6.4.3 Real-Time Thermal Monitoring Integration 206
6.5 Cooling Systems for Data Centres 207
6.5.1 Liquid Cooling and Immersion Cooling 207
6.5.2 Chip-Level Cooling Approaches 208
6.5.3 Thermoelectric Cooling Integration 208
6.5.4 Heat Recovery and Reuse Systems 209
6.6 Market Forecasts 209
6.6.1 TIM1 and TIM1.5 Market for Advanced Semiconductor Packaging 209
6.6.2 Thermal Management Market by Package Type 210
6.6.3 Geographic Market Distribution 211
6.6.4 SWOT Analysis — Advanced Semiconductor Packaging Thermal Management 211
7 THERMAL INTERFACE MATERIALS 213
7.1 TIM Market by End-Use Sector 213
7.1.1 Consumer Electronics 213
7.1.2 Electric Vehicles 214
7.1.3 Data Centres 219
7.1.4 5G/6G Communications 221
7.1.5 ADAS Sensors 222
7.1.6 Aerospace and Defence 222
7.1.7 Industrial Electronics 224
7.1.8 Renewable Energy 224
7.1.9 Medical Electronics 224
7.2 Global TIM Market Forecasts, 2022–2036, by Type 226
7.2.1 Market Overview 226
7.2.2 Market by Material Type 226
7.2.3 Geographic Market Analysis 227
7.2.4 Key Market Trends and Drivers 228
8 ACTIVE COOLING TECHNOLOGIES AND SYSTEMS 229
8.1 Emerging Opportunities 229
8.1.1 Buildings, Windows, and Greenhouses 229
8.1.2 Electric Vehicles and Large Batteries 230
8.1.3 Long-Duration Energy Storage 231
8.1.4 Processors and Telecommunications 232
8.2 Active Cooling Reinvented 232
8.2.1 Conditioning Alternatives 232
8.2.2 Powered Windows and Facades 234
8.2.3 Fan Cooling Reinvented 234
8.3 Active Cooling for Batteries and Energy Storage 236
8.3.1 Battery Thermal Management Systems 236
8.3.2 Compressed Air and Liquid Air Energy Storage Thermal Opportunities 236
8.4 Multi-Mode Integrated Cooling 237
8.4.1 Integrated Cooling and Energy Recovery (ICER) 237
8.4.2 Smart Windows and Dynamic Building Envelopes 238
8.4.3 Super-White Paint and Radiative Cooling Coatings 238
8.4.4 Electronics Integration 239
9 6G COMMUNICATIONS THERMAL MATERIALS 241
9.1 6G Thermal Management Challenges 241
9.1.1 Phase One (Incremental) and Phase Two (Disruptive) 6G 241
9.1.2 Severe New Microchip Cooling Requirements 243
9.1.3 Cooling 6G Smartphones, Base Stations, and Infrastructure 244
9.2 PDRC for 6G Infrastructure 245
9.3 Phase Change and Caloric Cooling for 6G 246
9.4 Thermoelectric Cooling and Harvesting for 6G 247
9.5 Evaporative, Heat Pipe and Hydrogel Cooling for 6G 248
9.5.1 Heat Pipes and Vapour Chambers 248
9.5.2 Hydrogel Cooling for 6G 249
9.6 TIMs and Conductive Cooling for 6G 249
9.6.1 Conductive Cooling for 6G 250
9.7 Advanced Heat Shielding, Thermal Insulation and Ionogels for 6G 252
9.7.1 Ionogels for 6G 252
9.8 Thermal Metamaterials for 6G 253
9.8.1 Reconfigurable Intelligent Surfaces (RIS) and Thermal Management 254
10 COMPANY PROFILES 255 (244 company profiles)
11 APPENDIX 504
11.1 Report Scope and Objectives 504
11.1.1 Markets and Technologies Covered 504
11.1.2 Geographic Scope and Regional Definitions 504
11.1.3 Forecast Period and Base-Year Assumptions 504
11.2 Research Methodology 505
11.2.1 Primary Research: Expert Interviews and Industry Questionnaires 505
11.2.2 Secondary Research: Patent Analysis, Company Filings, Academic Literature 505
11.2.3 Bottom-Up and Top-Down Market Sizing Approach 505
11.2.4 Data Triangulation and Validation Procedures 505
11.3 Definitions and Terminology 506
11.3.1 Cooling Category Definitions 506
11.3.2 Temperature Regime Classifications 506
11.3.3 Technology Readiness Level (TRL) Definitions 506
12 REFERENCES 507
圖表清單 List of Tables & Figures
List of Tables
Table 1. Key materials and technologies in passive cooling. 32
Table 2. Passive cooling market drivers. 34
Table 3. Types and formats of emerging carbon materials and inorganic compounds for passive thermal cooling applications. 35
Table 4. Types and formats of emerging inorganic compounds for passive thermal cooling applications. 37
Table 5. Functions and materials format. 38
Table 6. Passive versus active cooling comparison. 39
Table 7. Established vs. emerging solid-state cooling technologies. 42
Table 8. LED-based thermophotonic cooling performance benchmarks. 45
Table 9. Quantum cryogenic cooling requirements by application. 45
Table 10. Solid-state cooling technologies compared. 46
Table 11. Global passive cooling materials market by end-use sector, 2022–2036 (billions USD). 50
Table 12. Global passive cooling materials market by material type, 2022–2036 (billions USD). 52
Table 13. Global passive cooling materials market by region, 2022–2036 (billions USD). 52
Table 14. Global active cooling market by technology segment, 2022–2036 (billions USD). 53
Table 15. Data centre liquid cooling market by technology, 2022–2036 (billions USD). 53
Table 16. Global solid-state cooling market by technology, 2020–2036 (millions USD). 54
Table 17. Global solid-state cooling market by end user, 2020–2036 (millions USD). 55
Table 18. Cryogenic equipment TAM by category, 2024–2036 (millions USD). 55
Table 19. Combined advanced cooling market summary, 2024–2036 (billions USD). 56
Table 20. Thermal conductivities (κ) of common metallic, carbon, and ceramic fillers employed in TIMs. 92
Table 21. Commercial TIMs and their properties. 93
Table 22. Advantages and disadvantages of TIMs, by type. 94
Table 23. Commercial thermal paste products. 96
Table 24. Thermal adhesive tape products. 99
Table 25. Liquid metal challenges. 102
Table 26. TIM Prices and Supply Chain 103
Table 27. Classification of PCMs. 104
Table 28. PCM types and properties. 106
Table 29. Advantages and disadvantages of paraffin wax PCMs. 107
Table 30. Advantages and disadvantages of organic PCMs. 107
Table 31. Advantages and disadvantages of salt hydrate PCMs. 108
Table 32. Advantages and disadvantages of metal PCMs. 108
Table 33. Advantages and disadvantages of eutectic PCMs. 109
Table 34. Comparison of silicone versus carbon-based polymers for passive cooling. 112
Table 35. Properties of graphene, properties of competing materials, applications thereof. 112
Table 36. Properties of CNTs and comparable materials. 113
Table 37. Properties of nanodiamonds. 114
Table 38. Classification of hydrogels based on properties. 120
Table 39. Common hydrogel formulations for cooling applications. 122
Table 40. Benefits of hydrogels for cooling. 122
Table 41. Hydrogel cooling applications by sector. 123
Table 42. Passive Cooling Paints and Coatings 124
Table 43.Key properties of silica aerogels. 126
Table 44. Chemical precursors used to synthesise silica aerogels. 126
Table 45. Comparison of types of metamaterials — frequency ranges, key characteristics, and applications. 128
Table 46. Passive vs active metamaterials. 129
Table 47. Comparison of metamaterials manufacturing methods. 129
Table 48. Types of thermal management metamaterials by function. 130
Table 49. Radiative cooling technologies comparison. 135
Table 50. Types of tunable terahertz metamaterials and their tuning mechanisms. 137
Table 51. Types of tunable optical metamaterials and their tuning mechanisms. 137
Table 52. Markets and applications for tunable metamaterials in thermal management. 138
Table 53. Thermal metamaterial and cooling roadmap 2025–2035. 138
Table 54. Technology readiness level (TRL) of various metamaterial technologies. 139
Table 55. Global revenues for metamaterials, by market, 2020–2036 (millions USD). 140
Table 56. Market opportunity assessment matrix for metamaterials and metasurfaces applications. 141
Table 57. Applications and players in thermal metamaterials. 141
Table 58. Market and technology challenges in metamaterials and metasurfaces. 142
Table 59. Established vs. emerging solid-state cooling technologies — physical principles, maturity, and performance. 143
Table 60. Bismuth telluride material properties. 147
Table 61. Thermoelectric manufacturing methods — performance and scalability. 148
Table 62. Thermoelectric raw material supply chain. 148
Table 63. Alternative thermoelectric materials — performance and development status. 148
Table 64. Nanostructuring approaches for thermoelectric performance enhancement. 149
Table 65. Thermoelectric (Peltier) cooling performance characteristics. 150
Table 66. Thermoelectric cooling market penetration by application. 150
Table 67. Thermoelectric market by application segment, 2024–2036 (millions USD). 151
Table 68. Magnetocaloric material categories. 154
Table 69. Magnetocaloric cooling performance vs. conventional systems. 155
Table 70. Efficiency comparison in practical magnetocaloric systems. 155
Table 71. Magnetocaloric cooling commercial applications. 156
Table 72. Magnetocaloric development status by company. 156
Table 73. Magnetocaloric commercialisation challenges and solution paths. 157
Table 74. Electrocaloric materials and performance characteristics. 159
Table 75. Electrocaloric effect temperature changes by material type. 160
Table 76. Caloric effect comparison. 163
Table 77. Elastocaloric and barocaloric engineering challenges. 164
Table 78. Solid-state cooling technology roadmap. 165
Table 79. Global solid-state cooling market size, 2025–2036 ($M). 166
Table 80. Performance benchmarking matrix across all solid-state cooling technologies. 167
Table 81. Application suitability mapping and temperature ranges — current and projected best technology by application. 169
Table 82. Solid-state cooling technology roadmap, 2024–2036. 170
Table 83. Global solid-state cooling market size by technology, 2020–2036 (millions USD). 171
Table 84. Global solid-state cooling market size by end user market, 2020–2036 (millions USD). 172
Table 85. Price performance evolution by technology type, $/W of cooling capacity. 173
Table 86.Regional market analysis — solid-state cooling revenue by geography, 2022–2036 (millions USD). 173
Table 87. Regional market drivers and leading applications. 174
Table 88. Market drivers and growth catalysts for solid-state cooling. 174
Table 89. Growth catalyst probability and impact assessment. 175
Table 90. Cryogenic applications (sub-100K) — application, temperature range, technology, market size, growth rate. 176
Table 91. Ultra-low temperature applications (100–150K). 176
Table 92. Moderate cooling applications (>150K). 177
Table 93. Semiconductor sensor solid-state cooling. 178
Table 94. Solid-state cooling in consumer electronics thermal management. 179
Table 95. Solid-state cooling in automotive thermal systems. 180
Table 96. Quantum cooling requirements by application. 182
Table 97. Quantum device operating temperature requirements. 183
Table 98. ADR system characteristics. 184
Table 99. cADR performance by configuration. 184
Table 100. Dilution refrigerator characteristics. 186
Table 101. Dilution refrigerator suppliers. 187
Table 102. Multi-stage temperature environment requirements. 188
Table 103. Quantum computing scaling impact on cryogenic requirements. 191
Table 104. Quantum cryogenic market TAM analysis, 2024–2032. 192
Table 105. TAM market drivers. 192
Table 106. Cryogenic component market segmentation and competitive dynamics. 193
Table 107. Cryogenic component pricing ranges. 194
Table 108. Semiconductor packaging technology evolution. 197
Table 109. 2.5D and 3D packaging in GPUs. 200
Table 110. Die-attach materials comparison. 201
Table 111. TIM1 material selection for advanced packaging. 202
Table 112. Liquid cooling technologies comparison. 203
Table 113. Hybrid cooling system performance comparison. 204
Table 114. Graphene manufacturing for TIMs. 204
Table 115. Data centre liquid cooling market forecasts, 2022–2036 (billions USD). 207
Table 116. Liquid cooling market segmentation by end user. 208
Table 117. TIM1 and TIM1.5 market size forecast for advanced semiconductor packaging, 2026–2036 — by area share (%). 209
Table 118. TIM1 and TIM1.5 revenue forecast for advanced semiconductor packaging, 2026–2036 (millions USD). 210
Table 119. Package size impact analysis. 210
Table 120. Geographic market analysis for thermal management in advanced semiconductor packaging. 211
Table 121. Thermal management application areas in consumer electronics. 213
Table 122. Global market in consumer electronics, 2022–2036, by TIM type (millions USD). 213
Table 123. TIM suppliers for EV battery applications. 217
Table 124. Global market in electric vehicles, 2022–2036, by TIM type (millions USD). 218
Table 125. Global market in data centres, 2022–2036, by TIM type (millions USD). 220
Table 126. Global market in 5G, 2022–2036, by TIM type (millions USD). 221
Table 127. Global market for TIMs in aerospace and defence, 2022–2036, by TIM type (millions USD). 222
Table 128. Global market for TIMs in renewable energy, 2022–2036 (millions USD). 224
Table 129. Global market for TIMs in medical electronics, 2022–2036 (millions USD). 225
Table 130. Global TIM market summary by end-use sector, 2022–2036 (millions USD). 226
Table 131. Building cooling technology landscape comparison. 229
Table 132. EV thermal management subsystems and active cooling opportunities. 231
Table 133. Air cooling power consumption at various rack densities. 232
Table 134. Caloric effect comparison for HVAC applications. 233
Table 135. Battery thermal management system comparison. 236
Table 136. LDES thermal management requirements and material opportunities. 237
Table 137. Smart window technology comparison. 238
Table 138. Radiative cooling technology comparison. 238
Table 139. Multi-mode cooling system configurations for data centres. 240
Table 140. 6G development phases and thermal management implications. 241
Table 141. 6G frequency evolution and thermal impact. 242
Table 142. 6G chipset thermal requirements compared to 5G. 243
Table 143. 6G infrastructure thermal management requirements. 244
Table 144. PDRC applications in 6G infrastructure. 245
Table 145. PCM and caloric cooling applications for 6G. 246
Table 146. Thermoelectric applications in 6G infrastructure. 247
Table 147. Two-phase heat transfer technologies for 6G. 249
Table 148. TIM requirements for 6G compared to 5G. 250
Table 149. Advanced insulation and heat shielding for 6G. 252
Table 150. Thermal metamaterial applications for 6G communications. 253
Table 151. RIS thermal management approaches. 254
Table 152. CrodaTherm Range. 318
List of Figures
Figure 1. SWOT analysis for the passive cooling market. 42
Figure 2. Application suitability mapping — best technology by application and timeframe. 44
Figure 3. Technology readiness levels across all segments. 45
Figure 4. Near-term passive and solid-state cooling applications roadmap, 2025–2030. 48
Figure 5. Medium-term passive and solid-state cooling applications roadmap, 2030–2036. 49
Figure 6. Long-term passive and solid-state cooling applications roadmap, 2036–2046. 50
Figure 7. Global passive cooling materials market by end-use sector, 2022–2036 (billions USD). 51
Figure 8. Global solid-state cooling market by technology, 2020–2036 (millions USD). 54
Figure 9. Passive cooling technology maturation roadmap, 2025–2046. 67
Figure 10. Active cooling and thermal management technology maturation roadmap, 2025–2046. 77
Figure 11. Solid-state cooling technology maturation roadmap, 2025–2046. 87
Figure 12. Schematic of thermal interface material operation in electronic devices. 90
Figure 13. SWOT analysis for silicone-based TIMs. 92
Figure 14. Thermal pad product. 98
Figure 15. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module. 99
Figure 16. Typical IC package construction identifying TIM1 and TIM2. 101
Figure 17. Liquid metal TIM product. 102
Figure 18. SWOT Analysis for Phase Change Materials for Passive Cooling 111
Figure 19. SWOT analysis for carbon materials for passive cooling. 115
Figure 20. Fujitsu loop heat pipe product for notebook applications. 118
Figure 21. SWOT analysis for aerogels. 127
Figure 22. Radi-Cool metamaterial film product. 134
Figure 23. Schematic of dry-cooling technology using metamaterial film. 136
Figure 24. SWOT analysis for metamaterials and metasurfaces. 140
Figure 25. Solid-state cooling value chain. 146
Figure 26. Thermoelectric cooling operation. 146
Figure 27. Thermoelectric (Peltier) cooling systems SWOT analysis. 153
Figure 28. Magnetocaloric effect. 154
Figure 29. Magnetocaloric cooling SWOT analysis. 158
Figure 30. Electrocaloric cooling cycle. (Diagram showing four stages: adiabatic polarisation → heat rejection → adiabatic depolarisation → heat absorption.) 159
Figure 31. Electrocaloric cooling development timeline. 162
Figure 32. Electrocaloric cooling SWOT analysis. 162
Figure 33. Adiabatic Demagnetisation Refrigeration (ADR) process. 183
Figure 34. Quantum cryogenic market SWOT analysis. 196
Figure 35. Evolution roadmap of semiconductor packaging. 199
Figure 36. Data centre liquid cooling market by technology, 2022–2036 (billions USD). 207
Figure 37. Advanced semiconductor packaging thermal management SWOT analysis. 212
Figure 38. Application of thermal interface materials in automobiles. 217
Figure 39. Global market in electric vehicles, 2022–2036, by TIM type (millions USD). 219
Figure 40. Global market in data centres, 2022–2036, by TIM type (millions USD). 220
Figure 41. Global market for TIMs in aerospace and defence, 2022–2036, by TIM type (millions USD). 223
Figure 42. Global market for TIMs in medical electronics, 2022–2036 (millions USD). 225
Figure 43. Building cooling technology integration schematic. 230
Figure 44. Frore Systems AirJet solid-state active cooling architecture. 235
Figure 45. xMEMS µCooling fan-on-a-chip. (Microscale MEMS air mover showing silicon membrane structure and airflow direction.) 235
Figure 46. TIM evolution roadmap from 5G to 6G. 252
Figure 47. Transtherm® PCMs. 303
Figure 48. Internal structure of carbon nanotube adhesive sheet. 350
Figure 49. Carbon nanotube adhesive sheet. 351
Figure 50. HI-FLOW Phase Change Materials. 365
Figure 51. Parker Chomerics THERM-A-GAP GEL. 418
Figure 52. Metamaterial structure used to control thermal emission. 427
Figure 53. Shinko Carbon Nanotube TIM product. 466
Figure 54. VB Series of TIMS from Zeon. 501
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