New Packages and Materials for Power Devices Market
完整報告名稱與涵蓋範圍
New Packages and Materials for Power Devices Market Research Report by Product Type [Chip-On-Board (COB), Wire Bonding Packaging, Silicon Carbide (SIC), Gallium Nitride (GaN), Gallium Arsenide (GaAs), Others], by Application (Automotive, Consumer Electronics, IT & Telecommunications, Military & Aerospace, Industrial, Others), and by Region (North America, Europe, Asia Pacific, Latin America, Middle East & Africa) Forecast till 2032
報告摘要
New Packages and Materials for Power Devices Market Research Report by Product Type [Chip-On-Board (COB), Wire Bonding Packaging, Silicon Carbide (SIC), Gallium Nitride (GaN), Gallium Arsenide (GaAs), Others], by Application (Automotive, Consumer Electronics, IT & Telecommunications, Military & Aerospace, Industrial, Others), and by Region (North America, Europe, Asia Pacific, Latin America, Middle East & Africa) Forecast till 2032
Market Overview
The global new packages and materials for power devices market is projected to reach USD 5,928.7 million by 2032, growing at a CAGR of 9.44% from 2024 to 2032. New packages and materials for power devices refer to advanced semiconductor packaging techniques and innovative materials like wide bandgap semiconductors (SiC, GaN) that enhance performance. These developments improve efficiency, thermal management, and reliability of power electronics used in industries such as automotive, renewable energy, and consumer electronics.
One major factor among the most trending topics in the New Packages and Materials for Power Devices Market is the need for energy-efficient solutions across the industries. Power demands that are efficient and fast, but small, are leading to the penetration of new packaging technologies such as chip-scale packages (CSP) and system-in-package (SiP).
Key Company Development
Microchip Technology (Nasdaq: MCHP) has extended its scope through expansion and new partnerships to gain a greater hold over the global semiconductor market. In March 2023, it commissioned a milestone in its $800 million project that will see the Oregon factory's output increase threefold. One was a design center in Cambridge, created in December 2023. In April 2024, a partnership with TSMC in Japan was designed to further 40nm capacity, supply chain resilience, manufacturing diversity, and advanced technology development.
Major Players
Key players in the global new packages and materials for power devices market are Infineon Technologies AG, STMicroelectronics, ROHM Semiconductor, Texas Instruments, Mitsubishi Electric Corporation, NXP Semiconductors, Analog Devices, ON Semiconductor, Microchip Technology Inc., and Wolfspeed.
Report Attribute Details
• Market Size 2023: USD 2,500 Million
• Market Size 2032: USD 5,928.7 Million
• CAGR (2024-2032): 9.44%
• Base Year: 2023
• Market Forecast Period: 2024-2032
Market Segmentations
• By Product Type: Chip-On-Board (COB) – 9.66%, Wire Bonding Packaging – 8.56%.
• By Application: Automotive – 8.49%, Consumer Electronics – 10.18%.
Regional Insights
The market prospects for new packages and materials for power devices in North America are positive. The region's growth is led by technological breakthroughs in electric mobility, consumer electronics, and industrial automation. In 2023, North America recorded USD 469.17 million from the U.S. and USD 32.08 million from Canada, highlighting steady growth in advanced power device adoption.
Europe is making steady progress, with it being forecasted to increase from USD 472.50 million in 2023 to USD 1,152.54 million by 2032, at a 9.79% CAGR. The continent is benefiting from severe sustainability rules and a good automotive and industrial sectors, which are embracing such suppliers as SiC and GaN. Europe’s market reached notable figures with Germany at USD 125.73 million, France at USD 88.40 million, and the UK at USD 92.94 million, reflecting strong demand across key economies.
The Asia-Pacific region is the largest market holder and will keep its dominance. The presence of leading semiconductor foundries, large-scale industrial growth, and government initiatives supporting 5G, EVs, and renewable energy are the main contributors to the region's growth. Asia-Pacific dominated with China at USD 738.29 million, Japan at USD 104.37 million, and India at USD 29.20 million, underscoring its role as the global growth leader.
The Middle East & Africa market is set to experience remarkable growth. Global players like Infineon Technologies and ON Semiconductor are targeting high-potential areas such as energy, telecommunications, and defense, capitalizing on the growing need for reliable, efficient power devices in emerging economies.
South America’s market value is estimated to grow from USD 157.75 million in 2023 to USD 331.41 million by 2032, at a CAGR of 7.97%. Companies, including STMicroelectronics and ON Semiconductor, are focusing on building stronger distribution and localized manufacturing networks. These initiatives position South America as a promising market for modern packaging technologies and advanced power device materials.
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目錄 Table of Contents
TABLE OF CONTENTS
1 EXECUTIVE SUMMARY ...... 17
2 MARKET INTRODUCTION ........ 19
2.1 DEFINITION ....... 19
2.2 SCOPE OF THE STUDY ....... 19
2.3 RESEARCH OBJECTIVE ..... 19
2.4 MARKET STRUCTURE ....... 20
3 RESEARCH METHODOLOGY ....... 21
3.1 OVERVIEW .... 21
3.2 DATA FLOW ....... 23
3.2.1 DATA MINING PROCESS ..... 23
3.3 PURCHASED DATABASE: ....... 24
3.4 SECONDARY SOURCES: ..... 25
3.4.1 SECONDARY RESEARCH DATA FLOW: ..... 26
3.5 PRIMARY RESEARCH: ........ 27
3.5.1 PRIMARY RESEARCH DATA FLOW: .... 28
3.5.2 PRIMARY RESEARCH: NUMBER OF INTERVIEWS CONDUCTED ........ 29
3.5.3 PRIMARY RESEARCH: REGIONAL COVERAGE .... 29
3.6 APPROACHES FOR MARKET SIZE ESTIMATION: ...... 30
3.6.1 REVENUE ANALYSIS APPROACH .... 30
3.7 DATA FORECASTING..... 31
3.7.1 DATA FORECASTING TECHNIQUE .... 31
3.8 DATA MODELING ....... 32
3.8.1 MICROECONOMIC FACTOR ANALYSIS: .... 32
3.8.2 DATA MODELING: ........ 33
3.9 TEAMS AND ANALYST CONTRIBUTION ....... 35
4 MARKET DYNAMICS ...... 36
4.1 INTRODUCTION ..... 36
4.2 DRIVERS .... 37
4.2.1 DEMAND OF BETTER EFFICIENCY AND SPEED ....... 37
4.2.2 COLLABORATION AND PARTNERSHIPS AMONG PLAYERS ..... 38
4.3 RESTRAINTS ..... 40
4.3.1 INTEGRATION OF NEW MATERIAL AND PACKAGES INTO POWER DEVICES ..... 40
4.4 OPPORTUNITIES ........ 41
4.4.1 RISING DEMAND OF SUSTAINABLE AND SCALABLE POWER PRODUCTS ........ 41
5 MARKET FACTOR ANALYSIS ....... 43
5.1 SUPPLY CHAIN ANALYSIS ........ 43
5.1.1 RAW MATERIAL SOURCING ....... 44
5.1.2 MANUFACTURING .... 44
5.1.3 ASSEMBLY AND TESTING ........ 44
5.1.4 PACKAGING AND DISTRIBUTION ..... 44
5.2 PORTER FIVE FORCES ....... 45
5.2.1 BARGAINING POWER OF SUPPLIERS ...... 45
5.2.2 BARGAINING POWER OF BUYERS .... 46
5.2.3 THREAT OF NEW ENTRANTS ...... 46
5.2.4 THREAT OF SUBSTITUTES .... 46
5.2.5 INTENSITY OF RIVALRY ........ 47
5.3 IMPACT OF CORONAVIRUS OUTBREAK ON THE GLOBAL NEW PACKAGES AND MATERIALS FOR
POWER DEVICES MARKET ..... 48
5.4 PRICING ANALYSIS OF THE GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET ..... 50
6 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY PRODUCT TYPE . 52
6.1 INTRODUCTION ..... 52
6.2 CHIP-ON-BOARD (COB) ....... 54
6.3 WIRE BONDING PACKAGING ..... 55
6.4 GALLIUM ARSENIDE (GAAS) ..... 57
6.5 GALLIUM NITRIDE (GAN) ...... 59
6.6 SILICON CARBIDE (SIC) ...... 60
6.7 OTHER PACKAGES/ MATERIALS ...... 62
7 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY APPLICATION ...... 63
7.1 INTRODUCTION ..... 63
7.2 AUTOMOTIVE ........ 65
7.3 CONSUMER ELECTRONICS ........ 66
7.4 INDUSTRIAL ...... 67
7.5 IT AND TELECOMMUNICATIONS ...... 68
7.6 MILITARY & AEROSPACE ...... 69
7.7 OTHER APPLICATIONS ...... 70
8 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY REGION ...... 71
8.1 OVERVIEW .... 71
8.2 NORTH AMERICA ...... 73
8.2.1 U.S...... 75
8.2.2 CANADA ....... 76
8.3 EUROPE ..... 77
8.3.1 GERMANY ..... 79
8.3.2 U.K. .... 80
8.3.3 FRANCE ........ 81
8.3.4 RUSSIA .... 81
8.3.5 SPAIN ...... 82
8.3.6 NETHERLANDS ........ 83
8.3.7 REST OF EUROPE ..... 83
8.4 ASIA-PACIFIC .... 85
8.4.1 CHINA ...... 87
8.4.2 JAPAN ..... 88
8.4.3 INDIA ....... 89
8.4.4 SOUTH KOREA .... 89
8.4.5 SINGAPORE ........ 90
8.4.6 AUSTRALIA AND NEW ZEALAND ....... 91
8.4.7 REST OF ASIA-PACIFIC ...... 91
8.5 MIDDLE EAST AND AFRICA ....... 93
8.5.1 SOUTH AFRICA ........ 95
8.5.2 GCC COUNTRIES...... 96
8.5.3 TURKEY .... 97
8.5.4 ISRAEL ..... 97
8.5.5 REST OF MIDDLE EAST & AFRICA ...... 98
8.6 LATIN AMERICA ........ 99
8.6.1 BRAZIL ..... 101
8.6.2 MEXICO ........ 102
8.6.3 ARGENTINA ....... 103
8.6.4 REST OF LATIN AMERICA ........ 103
9 COMPETITIVE LANDSCAPE .... 105
9.1 MARKET SHARE ANALYSIS...... 105
9.2 COMPARATIVE ANALYSIS: KEY PLAYERS FINANCIAL ........ 106
9.3 COMPETITOR DASHBOARD........ 107
9.4 KEY DEVELOPMENTS ........ 108
10 COMPANY PROFILES .... 122
10.1 INFINEON TECHNOLOGIES ........ 122
10.1.1 COMPANY OVERVIEW ........ 122
10.1.2 FINANCIAL OVERVIEW ....... 123
10.1.3 PRODUCTS OFFERED..... 123
10.1.4 KEY DEVELOPMENTS .... 124
10.1.5 SWOT ANALYSIS ..... 126
10.1.6 KEY STRATEGY ....... 126
10.2 STMICROELECTRONICS .... 128
10.2.1 COMPANY OVERVIEW ........ 128
10.2.2 FINANCIAL OVERVIEW ....... 129
10.2.3 PRODUCTS OFFERED..... 130
10.2.4 KEY DEVELOPMENTS .... 131
10.2.5 SWOT ANALYSIS ..... 132
10.2.6 KEY STRATEGY ....... 132
10.3 TEXAS INSTRUMENTS ..... 134
10.3.1 COMPANY OVERVIEW ........ 134
10.3.2 FINANCIAL OVERVIEW ....... 135
10.3.3 PRODUCTS OFFERED..... 136
10.3.4 KEY DEVELOPMENTS .... 137
10.3.5 SWOT ANALYSIS ..... 138
10.3.6 KEY STRATEGY ....... 138
10.4 MITSUBISHI ELECTRIC CORPORATION ..... 139
10.4.1 COMPANY OVERVIEW ........ 139
10.4.2 FINANCIAL OVERVIEW ....... 140
10.4.3 PRODUCTS OFFERED..... 141
10.4.4 KEY DEVELOPMENTS .... 142
10.4.5 SWOT ANALYSIS ..... 143
10.4.6 KEY STRATEGY ....... 144
10.5 ROHM SEMICONDUCTOR ....... 145
10.5.1 COMPANY OVERVIEW ........ 145
10.5.2 FINANCIAL OVERVIEW ....... 146
10.5.3 PRODUCTS OFFERED..... 147
10.5.4 KEY DEVELOPMENTS .... 148
10.5.5 SWOT ANALYSIS ..... 150
10.5.6 KEY STRATEGY ....... 150
10.6 NXP SEMICONDUCTORS N.V. .... 151
10.6.1 COMPANY OVERVIEW ........ 151
10.6.2 FINANCIAL OVERVIEW ....... 152
10.6.3 PRODUCTS OFFERED..... 153
10.6.4 KEY DEVELOPMENTS .... 154
10.6.5 SWOT ANALYSIS ..... 155
10.6.6 KEY STRATEGY ....... 155
10.7 ANALOG DEVICES...... 157
10.7.1 COMPANY OVERVIEW ........ 157
10.7.2 FINANCIAL OVERVIEW ....... 158
10.7.3 PRODUCTS OFFERED..... 159
10.7.4 KEY DEVELOPMENTS .... 159
10.7.5 SWOT ANALYSIS ..... 160
10.7.6 KEY STRATEGY ....... 160
10.8 ON SEMICONDUCTORS ...... 161
10.8.1 COMPANY OVERVIEW ........ 161
10.8.2 FINANCIAL OVERVIEW ....... 162
10.8.3 PRODUCTS OFFERED..... 163
10.8.4 KEY DEVELOPMENTS .... 163
10.8.5 SWOT ANALYSIS ..... 165
10.8.6 KEY STRATEGY ....... 165
10.9 MICROCHIP TECHNOLOGY .... 167
10.9.1 COMPANY OVERVIEW ........ 167
10.9.2 FINANCIAL OVERVIEW ....... 168
10.9.3 PRODUCTS OFFERED..... 169
10.9.4 KEY DEVELOPMENTS .... 169
10.9.5 SWOT ANALYSIS ..... 170
10.9.6 KEY STRATEGY ....... 170
10.10 WOLFSPEED, INC. ...... 172
10.10.1 COMPANY OVERVIEW ........ 172
10.10.2 FINANCIAL OVERVIEW ....... 173
10.10.3 PRODUCTS OFFERED..... 174
10.10.4 KEY DEVELOPMENTS .... 174
10.10.5 SWOT ANALYSIS ..... 175
10.10.6 KEY STRATEGY ....... 175
10.11 DATA CITATIONS ...... 177
圖表清單 List of Tables & Figures
LIST OF TABLES
TABLE 1 QFD MODELING FOR MARKET SHARE ASSESSMENT 33
TABLE 2 PRICING ANALYSIS 50
TABLE 3 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 53
TABLE 4 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR CHIP-ON-BOARD (COB), BY REGION, 2018-2032 (USD MILLION) 55
TABLE 5 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR WIRE BONDING PACKAGING, BY REGION, 2018-2032 (USD MILLION) 57
TABLE 6 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR GALLIUM ARSENIDE (GAAS), BY REGION, 2018-2032 (USD MILLION) 58
TABLE 7 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR GALLIUM NITRIDE (GAN), BY REGION, 2018-2032 (USD MILLION) 60
TABLE 8 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR SILICON CARBIDE (SIC), BY REGION, 2018-2032 (USD MILLION) 61
TABLE 9 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR OTHER PACKAGES/ MATERIALS, BY REGION, 2018-2032 (USD MILLION) 62
TABLE 10 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 64
TABLE 11 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR AUTOMOTIVE, BY REGION, 2018-2032 (USD MILLION) 65
TABLE 12 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR CONSUMER ELECTRONICS, BY REGION, 2018-2032 (USD MILLION) 66
TABLE 13 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR INDUSTRIAL, BY REGION, 2018-2032 (USD MILLION) 67
TABLE 14 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR IT AND TELECOMMUNICATIONS, BY REGION, 2018-2032 (USD MILLION) 68
TABLE 15 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR MILITARY & AEROSPACE, BY REGION, 2018-2032 (USD MILLION) 69
TABLE 16 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR OTHER APPLICATIONS, BY REGION, 2018-2032 (USD MILLION) 70
TABLE 17 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY REGION, 2018-2032 (USD MILLION) 71
TABLE 18 NORTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION) 74
TABLE 19 NORTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 75
TABLE 20 NORTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 75
TABLE 21 U.S.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 75
TABLE 22 U.S.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 76
TABLE 23 CANADA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 76
TABLE 24 CANADA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 76
TABLE 25 EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION) 78
TABLE 26 EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 79
TABLE 27 EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 79
TABLE 28 GERMANY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 79
TABLE 29 GERMANY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 80
TABLE 30 U.K.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 80
TABLE 31 U.K.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 80
TABLE 32 FRANCE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 81
TABLE 33 FRANCE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 81
TABLE 34 RUSSIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 81
TABLE 35 RUSSIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 82
TABLE 36 SPAIN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 82
TABLE 37 SPAIN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 82
TABLE 38 NETHERLANDS: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 83
TABLE 39 NETHERLANDS: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 83
TABLE 40 REST OF EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 83
TABLE 41 REST OF EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 84
TABLE 42 ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION) 86
TABLE 43 ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 87
TABLE 44 ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 87
TABLE 45 CHINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 87
TABLE 46 CHINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 88
TABLE 47 JAPAN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 88
TABLE 48 JAPAN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 88
TABLE 49 INDIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 89
TABLE 50 INDIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 89
TABLE 51 SOUTH KOREA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 89
TABLE 52 SOUTH KOREA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 90
TABLE 53 SINGAPORE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 90
TABLE 54 SINGAPORE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 90
TABLE 55 AUSTRALIA AND NEW ZEALAND: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 91
TABLE 56 AUSTRALIA AND NEW ZEALAND: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 91
TABLE 57 REST OF ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 91
TABLE 58 REST OF ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 92
TABLE 59 MEA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION) 94
TABLE 60 MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 95
TABLE 61 MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 95
TABLE 62 SOUTH AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 95
TABLE 63 SOUTH AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 96
TABLE 64 GCC COUNTRIES: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 96
TABLE 65 GCC COUNTRIES: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 96
TABLE 66 TURKEY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 97
TABLE 67 TURKEY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 97
TABLE 68 ISRAEL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 97
TABLE 69 ISRAEL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 98
TABLE 70 REST OF MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 98
TABLE 71 REST OF MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 98
TABLE 72 SOUTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION) 100
TABLE 73 LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 101
TABLE 74 LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 101
TABLE 75 BRAZIL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 101
TABLE 76 BRAZIL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 102
TABLE 77 MEXICO: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 102
TABLE 78 MEXICO: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 102
TABLE 79 ARGENTINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 103
TABLE 80 ARGENTINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 103
TABLE 81 REST OF LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION) 103
TABLE 82 REST OF LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION) 104
TABLE 83 COMPARATIVE ANALYSIS: KEY PLAYERS FINANCIAL 106
TABLE 84 KEY DEVELOPMENTS 108
TABLE 85 INFINEON TECHNOLOGIES: PRODUCTS OFFERED 123
TABLE 86 INFINEON TECHNOLOGIES: KEY DEVELOPMENTS 124
TABLE 87 STMICROELECTRONICS: PRODUCTS OFFERED 130
TABLE 88 STMICROELECTRONICS: KEY DEVELOPMENTS 131
TABLE 89 TEXAS INSTRUMENTS: PRODUCTS OFFERED AND MATERIAL USED 136
TABLE 90 TEXAS INSTRUMENTS: KEY DEVELOPMENTS 137
TABLE 91 MITSUBISHI ELECTRIC CORPORATION: PRODUCTS OFFERED AND MATERIAL USED
TABLE 92 MITSUBISHI ELECTRIC CORPORATION: KEY DEVELOPMENTS
TABLE 93 ROHM SEMICONDUCTOR: PRODUCTS OFFERED AND MATERIAL USED
TABLE 94 ROHM SEMICONDUCTOR: KEY DEVELOPMENTS
TABLE 95 NXP SEMICONDUCTORS N.V.: PRODUCTS OFFERED AND MATERIAL USED
TABLE 96 NXP SEMICONDUCTORS N.V.: KEY DEVELOPMENTS
TABLE 97 ANALOG DEVICES: PRODUCTS OFFERED AND MATERIAL USED
TABLE 98 ON SEMICONDUCTORS: PRODUCTS OFFERED AND MATERIAL USED
TABLE 99 ON SEMICONDUCTORS: KEY DEVELOPMENTS
TABLE 100 MICROCHIP TECHNOLOGY: PRODUCTS OFFERED AND MATERIAL USED
TABLE 101 MICROCHIP TECHNOLOGY: KEY DEVELOPMENTS
TABLE 102 WOLFSPEED, INC.: PRODUCTS OFFERED AND MATERIAL USED
TABLE 103 WOLFSPEED, INC.: KEY DEVELOPMENTS
LIST OF FIGURES
FIGURE 1 GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET: STRUCTURE 20
FIGURE 2 GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET: MARKET GROWTH FACTOR ANALYSIS (2023-2032) 36
FIGURE 3 OPPORTUNITY IMPACT FORECAST
FIGURE 4 SUPPLY CHAIN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
FIGURE 5 PORTER'S FIVE FORCES MODEL: GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
FIGURE 6 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY PRODUCT TYPE, SEGMENT ATTRACTIVENESS ANALYSIS 52
FIGURE 7 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY PRODUCT TYPE, 2023 (VALUE % SHARE)
FIGURE 8 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY APPLICATION, SEGMENT ATTRACTIVENESS ANALYSIS 63
FIGURE 9 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY APPLICATION, 2023 (VALUE % SHARE)
FIGURE 10 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY REGION, 2023 (VALUE % SHARE)
FIGURE 11 NORTH AMERICA: SWOT ANALYSIS
FIGURE 12 EUROPE: SWOT ANALYSIS
FIGURE 13 ASIA-PACIFIC: SWOT ANALYSIS
FIGURE 14 MEA: SWOT ANALYSIS
FIGURE 15 LATIN AMERICA: SWOT ANALYSIS
FIGURE 16 MARKET SHARE ANALYSIS, 2023
FIGURE 17 COMPETITOR DASHBOARD: GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
FIGURE 18 INFINEON TECHNOLOGIES: SWOT ANALYSIS
FIGURE 19 STMICROELECTRONICS: SWOT ANALYSIS
FIGURE 20 TEXAS INSTRUMENTS: SWOT ANALYSIS
FIGURE 21 MITSUBISHI ELECTRIC CORPORATION: SWOT ANALYSIS
FIGURE 22 ROHM SEMICONDUCTOR: SWOT ANALYSIS
FIGURE 23 NXP SEMICONDUCTORS N.V.: SWOT ANALYSIS
FIGURE 24 ANALOG DEVICES: SWOT ANALYSIS
FIGURE 25 ON SEMICONDUCTORS: SWOT ANALYSIS
FIGURE 26 MICROCHIP TECHNOLOGY: SWOT ANALYSIS
FIGURE 27 WOLFSPEED, INC.: SWOT ANALYSIS
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