報告摘要
Photonics packaging has undergone a quiet but decisive transformation, emerging from an engineering sub-discipline confined to the back end of optical transceiver manufacturing into one of the most strategically consequential sectors in global technology infrastructure. The convergence of three powerful forces — the insatiable bandwidth demands of AI-scale computing, the maturation of silicon photonics as a high-volume foundry platform, and the proliferation of new end markets from augmented reality to quantum computing — has elevated photonics packaging to a central role in the hardware stack that underpins the digital economy.
The current market is dominated by optical transceiver module packaging, which has been refined across three decades of datacom standardisation. Today's 800G coherent and direct-detection modules represent the peak of conventional pluggable transceiver packaging — cost-optimised, high-yield, and increasingly commoditised at the module assembly level by contract manufacturers such as Fabrinet, Jabil, and Luxshare. Yet this mature segment is being disrupted in real time by co-packaged optics, which requires fundamentally different packaging approaches: flip-chip bonding of silicon photonics PICs with 5nm CMOS EICs on silicon interposers, detachable fibre connectors qualified to CPO-FC interface standards, and thermal co-management with switch ASICs consuming hundreds of watts.
The CPO transition is being driven by an inescapable physics constraint. AI training and inference clusters now demand aggregate switch bandwidths exceeding 51.2 terabits per second per switch, a target that conventional PCB-level SerDes electrical interfaces cannot meet within acceptable power budgets. NVIDIA's NVLink Optical interconnect and Broadcom's Tomahawk 6 and 7 CPO switch families are the first commercial deployments of a technology that will reshape the entire photonics packaging supply chain through the 2030s. TSMC's CoWoS platform and ASE Group's VIPack co-packaging service have repositioned foundries and advanced OSATs as the new centre of gravity in a supply chain that previously revolved around module assemblers.
Looking further ahead, augmented reality display engines represent the second major growth frontier. MicroLED die transfer at sub-5 micron pixel pitch, mass transfer throughput exceeding 100 million dies per hour, and CMOS backplane integration are packaging challenges of comparable complexity to CPO, with unit economics that must reach consumer price points. Quantum technology photonics packaging — encompassing cryogenic fibre couplers, single-photon detector integration, and ultra-low-loss silicon nitride waveguide assembly — adds a further long-cycle but structurally significant growth vector.
The Global Photonics Packaging Market 2027–2037 provides a rigorous bottom-up forecast of revenues, unit shipments, and technology adoption across six major application segments over an eleven-year horizon to 2037. The report's central thesis is that photonics packaging has crossed an inflection point. The AI infrastructure build-out has made optical interconnect packaging a limiting constraint on compute cluster performance, forcing the semiconductor industry's most powerful foundries, OSAT providers, and system OEMs to rethink the design, assembly, and supply chain of photonic components from first principles. CPO is treated with particular depth, with detailed analysis of Type I, Type II, and Type III packaging structures, optical engine architectures, and a fully modelled forecast distinguishing scale-out Ethernet switch applications from scale-up GPU optical I/O, with separate unit and revenue trajectories through 2037.
Beyond AI data centres, the report provides equal rigour in its treatment of augmented reality display packaging — covering the LCoS-to-MicroLED technology transition, mass transfer yield economics, and display engine packaging revenue by technology type — as well as FMCW LiDAR for automotive, quantum photonics packaging across four hardware platforms, and a broad other-applications segment covering medical, defence, and industrial sensing. The ecosystem and supply chain chapter maps the full value chain from SOI wafer supply through system integration, with dedicated regional analyses of the Taiwanese, North American, European, and Asia-Pacific ecosystems. A competitive landscape chapter assesses vertical integration trends and M&A dynamics, and 79 company profiles provide detailed intelligence on participants spanning every tier of the value chain.
Report Contents:
Executive Summary: key findings, market at a glance ($4.1B in 2026 to >$30B by 2037, 21.9% CAGR), and strategic implications
Market Context and Background: historical evolution from discrete module assembly to wafer-level heterogeneous integration; the role of AI-driven bandwidth demand as a structural growth catalyst
Technology Landscape: light source integration (hybrid, heterogeneous, MicroLED-on-Si); wafer-level packaging (WLP, FOWLP, fan-out); 2.5D and 3D packaging (silicon interposer, glass interposer, organic substrate); hybrid bonding (Cu–Cu bumpless direct bonding); fibre-to-chip coupling technologies (V-groove FAU, detachable CPO-FC, grating and edge couplers); EIC/PIC integration approaches (2D, 2.5D, 3D); module-level packaging; long-term technology roadmap 2026–2037
Co-Packaged Optics (CPO): definition, optical engine architecture, CPO vs pluggable comparison, AI data centre network architecture (scale-out and scale-up), NVIDIA vs Broadcom strategic analysis, CPO packaging structure types I/II/III, and full market forecast (units and revenue) to 2037 covering GPU optical I/O and switch CPO separately
Application Segments: optical transceivers (datacom and telecom); AI data centres; augmented reality displays (LCoS to MicroLED transition, microdisplay supply chain); automotive FMCW LiDAR; quantum technologies (photonic QC, trapped-ion, neutral atom); other applications (medical, defence, industrial)
Ecosystem and Supply Chain: full value chain map from die to system; supply chain analysis by segment; regional ecosystem analysis — Taiwan, NVIDIA ecosystem, Europe, North America, Asia-Pacific
Global Market Forecasts 2026–2037: total market, by application segment, by packaging technology, by region; segment-level forecasts with unit and revenue data for CPO, optical transceivers, AR, LiDAR, quantum, and other
Competitive Landscape: market share analysis, vertical integration trends, M&A activity, future competitive dynamics
79 Company Profiles across the full photonics packaging value chain, each covering company description, recent news and funding, products and technology, and strategic significance. Companies Profiled spanning the full photonics packaging value chain include Aeva, AIM Photonics, Alcyon Photonics SL, Amkor Technology, Anello Photonics, Applied Materials, ASE Group, ASM AMICRA, ASMPT, Aurora Innovation, AyarLabs, Bay Photonics, Broadcom, CCRAFT SA, Cisco, Coherent Corp., Corning Incorporated, Diamond Photonics, DustPhotonics, Eoptolink, EV Group, Fabrinet, FEMTOprint, Ficontec, Finetech, FOXCONN, GIS (General Interface Solution), GlobalFoundries, Goertek, Google, ICON Photonics, IMEC, Innolight, IonQ, izmomicro (izmo Microsystems Private Limited), Jabil, JBD (Jade Bird Display), LAM Research, Lightmatter, LightSpeed Photonics, LioniX International, Luceda Photonics, Lumentum Holdings, Luxshare, Marvell Technology, Meta Platforms, MicroVision, Mixx Technologies, MPI Corporation, Nanoscribe, Nanosystec and more
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| Single User | $1,100 GBP |
目錄 Table of Contents
1. EXECUTIVE SUMMARY
1.1 Report Overview and Key Findings 16
1.2 Market Definition and Scope 17
1.2.1 Definition of Photonics Packaging 17
1.2.2 Boundary Between Photonics Packaging and Broader Semiconductor Packaging 18
1.2.3 Scope: Applications Addressed in This Report 18
1.3 Key Market Drivers and Restraints 18
1.4 Market Size and Growth 19
1.5 Photonics Packaging: From Backend Activity to Strategic Enabler 21
1.6 Photonics Packaging in the AI Era 22
1.7 The Shift to Advanced Packaging: From Module-Level to Wafer-Level Integration 22
1.8 Competitive and Ecosystem Snapshot 23
1.9 Key Conclusions and Strategic Implications 24
2. MARKET CONTEXT AND BACKGROUND
2.1 Photonics Packaging: Historical Evolution 26
2.1.1 Origins in Optical Transceivers for Datacom and Telecom 26
2.1.2 The Shift Toward Heterogeneous Integration 26
2.1.3 AI-Driven Bandwidth Demand as a Structural Growth Catalyst 26
2.2 Photonics in the AI Era 28
2.2.1 The Explosive Growth of Generative AI and LLMs 28
2.2.2 Compute Demand Scaling and Network Bottlenecks 29
2.2.3 The Role of Optical Interconnects in AI Infrastructure 30
2.3 Semiconductor Packaging Technology Overview 30
2.3.1 Conventional Packaging Approaches 30
2.3.2 Advanced Packaging Approaches 30
2.3.3 From 1D to 3D Integration: The Packaging Evolution Continuum 30
2.4 Why Photonics Packaging Differs from Conventional Semiconductor Packaging 31
2.5 The Standardization Imperative 32
2.5.1 PDK and ADK-Driven Design Environments 32
2.5.2 Role of Standards Bodies and Industry Consortia 32
2.5.3 Barriers to High-Volume Photonics Packaging Deployment 32
3. TECHNOLOGY LANDSCAPE
3.1 Light Source Integration Technologies 35
3.1.1 Integration Approach Overview 35
3.1.2 Hybrid Integration 38
3.1.3 Heterogeneous Integration 38
3.1.4 Heterogeneously Integrated Light Sources on Silicon Photonics (for Pluggables) 38
3.1.5 MicroLED-on-Si Hybridization 39
3.2 Advanced Packaging Technologies for Photonics 39
3.2.1 Wafer-Level Packaging (WLP) 39
3.2.1.1 Wafer-Level Chip Scale Packaging (WLCSP) 40
3.2.1.2 Fan-Out Wafer-Level Packaging (FO-WLP) 40
3.2.1.3 WLP Manufacturing Processes 40
3.2.2 2.5D and 3D Packaging 41
3.2.2.1 Silicon Interposer 2.5D (Through-Silicon Via) 41
3.2.2.2 Organic-Based 2.5D Packaging 41
3.2.2.3 Glass-Based 2.5D Packaging 41
3.2.2.4 3D Stacked Packages 41
3.2.3 Hybrid Bonding 42
3.2.3.1 Fusion Bond and Direct Molecular Bonding 42
3.2.3.2 Cu-Cu Bumpless Hybrid Bonding 43
3.2.3.3 Devices Using Hybrid Bonding 43
3.2.4 Photonics-Compatible Advanced Packaging Platform Comparison 43
3.3 Interconnection Techniques in Photonics Packaging 44
3.3.1 Wire Bonding 44
3.3.2 Flip-Chip Bumping 44
3.3.3 Micro-Bumping 44
3.3.4 Through-Silicon Via (TSV) 44
3.3.5 Redistribution Layer (RDL) 45
3.3.6 Photonic Wire Bonding 45
3.4 Fiber-to-Chip Coupling 45
3.4.1 Fiber-to-Chip Coupling Modalities Overview 46
3.4.2 V-Groove Technology: From 260μm to 130μm Pitch 46
3.4.3 Detachable Fiber-to-Chip Couplers 48
3.4.4 Serviceability and Detachability Design Considerations 48
3.4.5 Fiber Array Units (FAUs) and Connectorization 48
3.5 EIC/PIC Integration 49
3.5.1 Photonic Integrated Circuits (PICs) — Key Concepts 49
3.5.1.1 What are PICs? Material Platforms and Integration Levels 49
3.5.1.2 PICs vs Silicon Photonics — Differences and Overlap 49
3.5.2 Electronic-Photonic Integration Requirements 50
3.5.3 2D EIC/PIC Integration 50
3.5.4 2.5D EIC/PIC Integration 50
3.5.5 3D EIC/PIC Integration 50
3.5.6 3D Optical Engine Configuration Examples 51
3.5.6.1 Configuration 1: EIC-on-PIC with Micro-Bumps 51
3.5.6.2 Configuration 2: PIC-on-EIC with Through-Silicon Vias 51
3.5.6.3 Configuration 3: 3D SoIC with Hybrid Bonding 51
3.5.7 TSMC's Role in Heterogeneous EIC/PIC Integration 52
3.6 Module-Level Packaging 52
3.6.1 Optical Transceiver Module Architecture 52
3.6.2 Typical Process Steps and Major Equipment Suppliers 53
3.6.3 Which Packaging Approach for Which Application? 54
3.6.4 Solutions for Quantum Packaging 55
3.7 Technology Roadmap 56
3.7.1 Long-Term Technology Evolution Roadmap 2026–2037 56
3.7.2 Long-Term Evolution of Co-Packaged Optics 58
4. CO-PACKAGED OPTICS (CPO)
4.1 Introduction to Co-Packaged Optics 60
4.1.1 Definition and Core Concepts 60
4.1.1.1 Concept 1: Proximity Integration 60
4.1.1.2 Concept 2: Functional Partitioning 60
4.1.1.3 Concept 3: Coherent Ecosystem Development 60
4.1.2 What is an Optical Engine (OE)? 60
4.1.2.1 Optical Engine Composition and Components 60
4.1.2.2 Optical Engine vs Pluggable Transceiver 61
4.1.2.3 Critical Performance Parameters 61
4.1.3 Key Technology Building Blocks for CPO 61
4.1.3.1 Silicon Photonics PIC 61
4.1.3.2 Electronic IC (EIC) 61
4.1.3.3 External Laser Sources and Optical Power Supply 62
4.2 CPO vs Pluggable Optics 62
4.2.1 Pluggable Optics — Current Status, Bottlenecks and Limitations 62
4.2.1.1 Form Factor Constraints 62
4.2.1.2 Electrical Interface and SerDes Limitations 62
4.2.1.3 Thermal Management Challenges 63
4.2.1.4 On-Board Optics (OBO) as a Transitional Step 63
4.2.2 Power Efficiency Comparison: CPO vs Pluggable vs Copper 64
4.2.3 Design Decisions: Choosing Between CPO and Pluggables 64
4.3 Data Centre Architecture and CPO Applications 64
4.3.1 Modern High-Performance AI Data Centre Architecture 64
4.3.1.1 Physical Infrastructure Hierarchy 64
4.3.1.2 Network Architecture: Scale-Out and Scale-Up 64
4.3.1.3 Power and Cooling Considerations 65
4.3.2 Switches: Key Components in AI Data Centres 65
4.3.2.1 Switch Architecture Evolution 65
4.3.2.2 Switch ASIC Technology and Bandwidth Scaling 65
4.3.3 Scale-Out Network Switching Applications 65
4.3.4 Scale-Up Computing Optical I/O Applications 66
4.3.5 NVIDIA vs Broadcom: Strategic Comparison in AI Infrastructure and CPO 66
4.3.5.1 NVIDIA's CPO Strategy: Vertical Integration 66
4.3.5.2 Broadcom's CPO Strategy: Open Ecosystem 66
4.3.5.3 Competitive Dynamics 66
4.3.6 L2 Frontside Network Architecture: CPO vs Non-CPO 67
4.3.7 Migration from Copper to Optical Interconnects in AI Systems 68
4.4 CPO Packaging Structures 71
4.4.1 Types of CPO + XPU/Switch ASIC Packaging Structures 71
4.4.1.1 Type I: Optical Engines on Package Periphery 71
4.4.1.2 Type II: Optical Engines Co-Located with ASIC on Interposer 71
4.4.1.3 Type III: 3D Stacked Optical Engines 71
4.4.2 System Integration of Network Switches by Packaging Technologies 72
4.4.3 System Integration of Optical I/O by Packaging Technologies 73
4.5 CPO Market Forecasts 2026–2037 74
4.5.1 Server Boards, CPUs and GPUs/Accelerators Shipment Forecast 74
4.5.2 Optical I/O for AI Interconnect CPO Forecast (Units Shipped) 75
4.5.3 Optical I/O for AI Interconnect CPO Forecast (Revenue) 75
4.5.4 CPO Network Switches for AI Accelerators (Units Shipped) 76
4.5.5 CPO Network Switches for AI Accelerators (Market Size) 77
4.5.6 Total CPO Market Overview 78
4.5.7 CPO by EIC/PIC Integration Technology (Unit Shipments) 78
4.5.8 CPO Roadmap: Scale-Out Networks 81
4.6 CPO Challenges and Future Potential 84
4.6.1 Technical Challenges 84
4.6.2 Commercial and Standardization Challenges 84
4.6.3 Future Potential and Outlook 84
5. APPLICATION SEGMENTS
5.1 Telecom and Datacom 86
5.1.1 Optical Transceiver Market Overview 86
5.1.2 Photonics Packaging for Optical Transceivers 86
5.1.3 Market Forecast: Optical Transceivers 2026–2037 88
5.1.4 Transition from Pluggable to Co-Packaged: Hybrid Period 2026–2030 88
5.1.5 Supply Chain Concentration and Verticality Trends 91
5.2 AI Data Centres 91
5.2.1 AI Data Centre Photonics Packaging Demand 91
5.2.2 Hyperscaler Capex and Photonics Intensity 91
5.2.3 Current AI System Architecture: NVIDIA DGX/HGX Platforms 92
5.2.4 Future AI Architecture (Short to Mid-Term: 2026–2030) 92
5.2.5 Future AI Architecture (Long-Term: 2031–2037) 92
5.3 Augmented Reality Displays 93
5.3.1 Consumer AR Market Overview and Inflection Point (2026–2028) 93
5.3.2 Display Engine Technologies for AR 93
5.3.2.1 LCoS-Based Optical Engines 93
5.3.2.2 MicroLED-Based Optical Engines 93
5.3.2.3 Laser-Based Architectures and New Coupling Challenges 93
5.3.2.4 LCoS to MicroLED 2026–2037 94
5.3.3 AR Photonics Packaging: Form Factor as Key Differentiator 96
5.3.4 Market Forecast: AR Display Volumes 2026–2037 96
5.3.5 Market Forecast: AR Packaging Revenue 2026–2037 100
5.3.6 Microdisplay Supply Chain: MicroLED Focus 100
5.4 Automotive: FMCW LiDAR 105
5.4.1 FMCW LiDAR Technology and Photonics Packaging Requirements 105
5.4.2 FMCW LiDAR Photonics Integration Challenges 105
5.4.3 Market Forecast: FMCW LiDAR Volume and Packaging Revenue 2026–2037 106
5.5 Quantum Technologies 106
5.5.1 Photonics as the Hidden Bottleneck in Scalable Quantum Technologies 106
5.5.2 Photonics in Quantum Computer Architectures 107
5.5.2.1 Photonic Quantum Computers 107
5.5.2.2 Trapped-Ion Quantum Systems 107
5.5.2.3 Neutral Atom Quantum Systems 107
5.5.3 Photonics Packaging Requirements for Quantum 117
5.5.3.1 Ultra-Low-Loss Fiber Alignment 117
5.5.3.2 High-Density Laser Integration for Qubit Scaling 117
5.5.3.3 Extreme Precision Assembly 117
5.5.4 Quantum Photonics Packaging Solutions and Outlook 118
5.6 Other Application Segments 118
6. ECOSYSTEM AND SUPPLY CHAIN
6.1 Photonics Packaging Value Chain Overview 119
6.1.1 Generic Value Chain: From Die to System 119
6.1.2 Value Capture by Chain Segment 126
6.2 Supply Chain Analysis by Segment 127
6.2.1 PIC Design Segment 127
6.2.2 ASIC and xPU Design Segment 127
6.2.3 Laser Sources Segment 127
6.2.4 SOI Wafer and Epi-Wafer Segment 127
6.2.5 EIC, Retimers, SerDes and PHY Segment 127
6.2.6 Connectors and Fibers Segment 128
6.2.7 Foundries Segment 128
6.2.8 Packaging, Assembling and Testing Segment 128
6.2.9 System and Equipment Segment 128
6.2.10 End Customers (Hyperscalers) Segment 128
6.2.11 Ecosystem Interdependencies and Strategic Implications 128
6.3 Regional Ecosystem Analysis 147
6.3.1 The Taiwanese Ecosystem 147
6.3.2 NVIDIA's Ecosystem 151
6.3.3 The European Ecosystem 152
6.3.4 North American Ecosystem 152
6.3.5 Asia-Pacific (Excluding Taiwan) Ecosystem 152
7. GLOBAL MARKET FORECASTS 2026–2037
7.1 Overall Market Forecast 153
7.1.1 Total Global Photonics Packaging Market: Revenue ($M) 2026–2037 153
7.1.2 Market Revenue by Application Segment 153
7.1.3 Market Revenue by Packaging Technology 154
7.2 Segment Forecasts 155
7.2.1 Optical Transceivers (Datacom & Telecom) 155
7.2.2 Co-Packaged Optics (CPO) 155
7.2.3 Augmented Reality 156
7.2.4 Automotive LiDAR (FMCW) 157
7.2.5 Quantum Technologies 158
7.2.6 Other Applications (Medical, Defense, Industrial) 159
7.3 Regional Forecasts 160
7.3.1 Regional Analysis 160
8. COMPETITIVE LANDSCAPE
8.1 Competitive Environment Overview 161
8.2 Market Share Analysis 161
8.3 Positioning and M&A Activity 161
8.4 Vertical Integration Trends 162
8.5 Future Outlook: Competitive Dynamics 2026–2037 162
9. COMPANY PROFILES 164 (79 company profiles)
10. APPENDIX
10.1 Definitions & Terminology 321
10.2 Research Methodology 327
11. REFERENCES 330
圖表清單 List of Tables & Figures
List of Tables
Table 1. Photonics Packaging Market at a Glance — Revenue ($M) 2026–2037 16
Table 2. Key Market Metrics and CAGR Summary by Segment 17
Table 3. Application Segments and Packaging Value Chain Boundaries 18
Table 4. Market Drivers, Restraints, Opportunities and Threats (DROT Framework) 18
Table 5. Global Photonics Packaging Market Revenue ($M), 2026–2037 19
Table 6. Market Revenue by Application Segment (%), 2026-2037 20
Table 7. Key Milestones in Photonics Packaging Technology Development 28
Table 8. Semiconductor Packaging Technology Landscape — Conventional to Advanced 30
Table 9. Conventional vs Advanced Packaging — Feature and Performance Comparison 31
Table 10. Key Differences Between Electronic and Photonic Packaging Requirements 31
Table 11. Integration Approach Comparison at a Glance 35
Table 12. WLP Variants — Characteristics, Benefits and Photonics Applications 40
Table 13. 2.5D vs 3D Packaging — Performance, Cost and Complexity Trade-offs 42
Table 14. Fan-Out vs Hybrid Bonding — Photonics-Compatible Platform Comparison 43
Table 15. Photonics-Compatible Advanced Packaging Platform Benchmark 44
Table 16. Interconnection Technique Comparison — Electrical and Optical Performance 45
Table 17. Fiber-to-Chip Coupling Modalities Comparison 46
Table 18. Fiber-to-Chip Coupling Methods — Edge Coupling vs Grating Coupling vs Lensed Fiber 46
Table 19. Coupling Technology Supplier Landscape 49
Table 20. Benchmark of Packaging Technologies for EIC/PIC Integration 51
Table 21. Typical Process Steps and Key Equipment Suppliers for Photonics Packaging 53
Table 22. Integrated Optics for Datacom — Process and Integration Roadmap 54
Table 23. Packaging Technology Selection Matrix by Application Segment 54
Table 24. CPO Key Technology Building Blocks — Specifications and Suppliers 62
Table 25. Transmission Losses in Pluggable vs CPO Connections 63
Table 26. Pluggable Optics vs CPO — Performance, Cost and Operational Comparison 63
Table 27. Power Consumption Breakdown — CPO vs Pluggable Optics vs Copper Interconnects 64
Table 28. Decision Framework — CPO vs Pluggables by Use Case 64
Table 29. Scale-Up vs Scale-Out — Volume Forecast 2026–2037 (Units) 65
Table 30. CPO Product Benchmark — NVIDIA vs Broadcom 66
Table 31. NVIDIA and Broadcom — Divergent CPO Ecosystem Strategies 67
Table 32. Supporting data — Copper vs Optical Benchmark by Parameter 70
Table 33. Copper vs Optical — Benchmark for High-Bandwidth AI Systems 70
Table 34. CPO Packaging Structure Benchmark by Integration Type 72
Table 35. System Integration of Optical I/O by Packaging Technology 2026–2037 73
Table 36. Server Board, CPU and GPU/Accelerator Shipment Forecast 2026–2037 74
Table 37. Optical I/O for AI Interconnect CPO — Units Shipped 2026–2037 75
Table 38. Optical I/O for AI Interconnect CPO — Revenue ($M) 2026–2037 76
Table 39. CPO Network Switches — Units Shipped Forecast 2026–2037 76
Table 40. CPO Network Switches — Revenue ($M) Forecast 2026–2037 77
Table 41. Total CPO Market Revenue ($M) and Units — 2026–2037 Overview 78
Table 42. Total CPO by EIC/PIC Integration Technology — Unit Shipments 2026–2037 79
Table 43. CPO Challenges — Technical and Commercial Assessment Matrix 84
Table 44. Optical Transceiver Market Segmentation 86
Table 45. Photonics Packaging for Optical Transceivers — Revenue Forecast ($M) 2026–2037 88
Table 46. Optical Transceiver Packaging Market Share by Key Players 2026 91
Table 47. AI Data Centre Photonics Packaging Demand by Segment 2026–2037 ($M) 92
Table 48. Display Engine Technology Comparison for AR Applications 96
Table 49. AR Market Forecast — Volume (Units) 2026–2037 97
Table 50. Display Engines for AR — Volume Forecast 2026–2037 98
Table 51. AR Display Engine Packaging Revenue Forecast ($M) by Technology 2026–2037 100
Table 52. FMCW LiDAR Photonics Packaging Revenue Forecast ($M) 2026–2037 106
Table 53. Key Players in FMCW LiDAR Photonics Packaging 106
Table 54. Map of Quantum Companies— By Photonics-Based Approach 109
Table 55. Quantum Technology Photonics Packaging Requirements by Platform 117
Table 56. Quantum Photonics Packaging Solutions Landscape 118
Table 57. Other Application Segments — Market Characteristics and Packaging Requirements 118
Table 58. Value Chain Segment — Revenue and Margin Profile 126
Table 59. Supply Chain Segments — Key Players by Tier 147
Table 60. Global Photonics Packaging Market Revenue ($M) 2026–2037 by Segment 153
Table 61. Photonics Packaging Market Revenue Share by Segment (%), 2026 vs 2037 153
Table 62. Photonics Packaging Market Revenue by Technology ($M) 2026–2037 154
Table 63. OT Packaging Revenue by Sub-Segment ($M) 155
Table 64. CPO Revenue by Sub-Segment ($M) 156
Table 65. AR Packaging Revenue by Technology ($M) 157
Table 66. FMCW LiDAR Packaging Revenue by Application ($M) 158
Table 67. Quantum Photonics Packaging Revenue by Platform ($M) 158
Table 68. Other Applications Packaging Revenue ($M) 159
Table 69. Regional Photonics Packaging Market Forecast ($M) 2026–2037 160
Table 70. Market Share by Key Player and Segment 2026 161
Table 71. Notable M&A and Partnership Activity in Photonics Packaging 2023–2026 161
Table 72. Strategic Outlook — Key Competitive Moves by Player Tier 2026–2037 162
Table 73. Glossary of Key Terms and Abbreviations 321
Table 74. Report Scope — Applications, Technologies and Geographies Covered 327
List of Figures
Figure 1. Photonics Packaging Market at a Glance — Revenue ($M) 2026–2037 17
Figure 2. Market Revenue by Application Segment (%), 2026-2037 21
Figure 3. AI Datacenter Network Hierarchy — Scale-Out and Scale-Up Networks 22
Figure 4. Evolution from Hybrid to Heterogeneous Integration in Photonics Packaging 23
Figure 5. Photonics Packaging Ecosystem Map — Key Players by Value Chain Segment 24
Figure 6. Historical Evolution of Photonics Packaging Architectures 27
Figure 7. Generative AI Compute Demand Scaling vs. Electrical Interconnect Capacity 29
Figure 8. Photonics Packaging Standardization Roadmap 34
Figure 9. Integration Approach Spectrum — Hybrid to Monolithic 37
Figure 10. Heterogeneous Light Source Integration on Silicon Photonics 39
Figure 11. Wafer-Level Packaging Process Flow 40
Figure 12. 2.5D vs 3D Packaging Architecture Comparison 42
Figure 13. Hybrid Bonding Architecture and Process 43
Figure 14. V-Groove Pitch Evolution Roadmap 47
Figure 15. Detachable Fiber-to-Chip Coupler Architecture 48
Figure 16. PIC Architecture — Transmit and Receive Path 50
Figure 17. 3D Optical Engine Configuration Examples 52
Figure 18. Optical Transceiver at the Module Level — 400G Architecture 53
Figure 19. Photonics Packaging Technology Trends Roadmap 2026–2037 57
Figure 20. Long-Term CPO Integration Architecture Evolution 59
Figure 21. Optical Engine Architecture and Transmit/Receive Path 61
Figure 22. CPO vs Non-CPO Network Architecture Diagram 67
Figure 23. Copper-to-Optical Migration Roadmap for High-End AI Systems 70
Figure 24. CPO Packaging Structure Types I, II and III 72
Figure 26. CPO System Roadmap for Scale-Out Networks 83
Figure 27. Optical Transceiver at the Module Level — Key Components 87
Figure 28. Optical Transceiver Packaging — Module-Level Anatomy 87
Figure 29. Technology Migration Path — Pluggables to CPO Timeline 90
Figure 30. Current and Future AI System Architecture Comparison 92
Figure 31. Consumer AR Technology Roadmap — LCoS to MicroLED 2026–2037 96
Figure 32. Microdisplay Supply Chain Map — MicroLED Focus 104
Figure 33. Progression of FMCW LiDAR — Technology Architecture 105
Figure 34. Photonics in Quantum Computer Architectures — By Technology Platform 108
Figure 35. Photonics Packaging Value Chain Overview 125
Figure 36. Generic Outline of Optical Modules in the Data Centre Value Chain 126
Figure 37. CPO Industrial Ecosystem — Full Supply Chain Map 146
Figure 38. Taiwanese Photonics Packaging Ecosystem 151
Figure 39. NVIDIA's Photonics Packaging Ecosystem 151
Figure 40. Aeries II LiDAR system. 166
Figure 41. NVIDIA's silicon photonics switches. 269
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