The Global Silicon Photonics and Photonics Integrated Circuits Market
報告摘要
Silicon photonics and photonic integrated circuits (PICs) have moved decisively from a promising technology to a structural necessity of modern computing. The driver is artificial intelligence. AI training and inference require enormous volumes of data to move between accelerators, servers and racks at very low latency, and the copper interconnects that served the industry for decades have reached their physical limits — an "interconnect bottleneck" in which expensive, power-hungry accelerators sit idle waiting for data. Photonics is the industry's answer: photons travel faster, lose less signal over distance, and carry more information per channel. PICs bring those advantages onto silicon chips manufactured with the established CMOS infrastructure of the semiconductor industry.
Optical transceivers remain the engine of the market. The data rate has doubled every few years, and 2026 has seen the commercialisation of 1.6 terabit-per-second transceivers, with 3.2T expected to sample around 2027 and ramp toward 2028. As rates climb, even the short copper trace between an optical engine and a switching or accelerator ASIC limits performance, which is why co-packaged optics (CPO) — relocating the optics onto the ASIC substrate — has become the central packaging story of the decade. Industry forecasts suggest CPO could reach roughly 35% of AI-data-centre optical modules by 2030.
The competitive landscape reflects this momentum. Foundries are central: TSMC's COUPE platform, developed alongside NVIDIA for the Quantum-X and Spectrum-X photonic switches, has become a reference point, while Samsung Foundry has formally entered silicon photonics with a completed process design kit, a 300mm platform, a major optical-module order, and a turnkey CPO roadmap targeted for 2029. Consolidation has been intense. Marvell acquired plasmonics-based modulator developer Polariton Technologies to extend its optical roadmap to 3.2T and beyond; Credo agreed to acquire DustPhotonics for approximately $750 million to bring silicon-photonic PICs in-house; and Ciena acquired Nubis Communications for co-packaged optical engines. Independent design houses remain well funded — OpenLight extended its Series A with an additional $50 million for standards-based 1.6T and 3.2T reference PICs.
Material diversity distinguishes PICs from logic chips. Silicon dominates on CMOS compatibility and scale, but as an indirect-bandgap semiconductor it cannot emit light efficiently, so it is paired with indium phosphide for lasers and detectors. Thin-film lithium niobate, with its low loss and strong electro-optic effect, is emerging for high-performance modulation and quantum systems; barium titanate and silicon nitride add further options. Beyond datacom, telecommunications, sensing and LiDAR, and an increasingly well-funded quantum-photonics segment broaden the demand base.
The supply chain is shifting too: optical-module assembly has concentrated in Southeast Asia, high-value lasers remain with US and Japanese suppliers, and indium-phosphide raw material is concentrated in China, making opportunity and strategic risk tightly coupled. According to industry projections, the silicon photonics and PIC market for transceivers and quantum technologies is set to grow strongly through 2036, led overwhelmingly by AI-driven optical interconnect.
The Global Silicon Photonics and Photonic Integrated Circuits Market 2026-2036 is a comprehensive market and technology assessment of one of the fastest-growing segments of the semiconductor industry. As artificial intelligence and high-performance computing push copper interconnect past its physical limits, silicon photonics has become the structural solution to the data-centre interconnect bottleneck. This report provides an in-depth, independent analysis of the technologies, materials, supply chains, applications and market trajectory of photonic integrated circuits over the coming decade.
The report opens with the fundamentals — what PICs are, how they differ from electronic integrated circuits, their advantages and challenges, and the key components including modulators, lasers, waveguides and detectors. It examines every major material platform, benchmarking silicon and silicon-on-insulator, indium phosphide, silicon nitride, thin-film lithium niobate, barium titanate and electro-optic polymers, and assesses manufacturing, integration and packaging, including a detailed treatment of co-packaged optics and the TSMC COUPE and Samsung Foundry platforms.
A dedicated analysis covers optical transceivers — the industry's killer application — tracing the roadmap from 800G through the 1.6T transceivers commercialised in 2026 to 3.2T and beyond. The report addresses the shift from pluggable optics to co-packaged optics, the divergent NVIDIA and Broadcom CPO ecosystems, and the emerging "wide-and-slow" MicroLED optical interconnect architecture as a response to the chip-edge "beachfront" density crisis. Further chapters examine photonic engines for AI and neuromorphic computing, and a substantial assessment of photonic integrated circuits for quantum computing, quantum communications and quantum sensing.
The report delivers a deep supply-chain analysis from EDA and foundries to OSAT, covering the shift of optical-module assembly to Southeast Asia, indium-phosphide wafer supply, the EML laser shortage, and silicon photonics in Greater China. It includes extensive ten-year market forecasts in units, value and wafers — covering the total PIC market, datacom transceivers, cost-per-gigabit, AI accelerator shipments, co-packaged optics, MicroLED interconnect, the quantum PIC market, and a breakdown by material platform.
Based on extensive research and interviews with industry experts, the report also profiles the leading and emerging companies across the value chain, capturing the wave of consolidation reshaping the industry — including the Marvell-Polariton, Credo-DustPhotonics and Ciena-Nubis acquisitions and major fundraising rounds. It offers analyst insight, technology readiness assessments and clear forecasts, providing essential intelligence for component suppliers, foundries, system integrators, hyperscalers, investors and anyone seeking to understand the future of photonic integrated circuits.
Contents include:
Executive summary: major deals, definitions, market opportunity, the copper wall, roadmap for photonics in data centres, analyst opinion
Introduction and key concepts: integrated circuits, photonics versus electronics, advantages and challenges of PICs
Key components of a photonic integrated circuit: component requirements, transceiver component breakdown, TSMC COUPE PDK
Light sources and detectors: compound semiconductor lasers, EELs, VCSELs, CPO ultra-high-power laser requirements, EML shortages, photodetectors
Modulators: Mach-Zehnder, micro-ring and electro-absorption modulators, SiGe EAMs, EO-polymer modulators
Passive devices: PIC architecture, waveguides, optical I/O, coupling and component density
Materials and manufacturing: wafers, integration schemes, SOI, silicon nitride, indium phosphide, organic polymer, thin-film lithium niobate, barium titanate, materials benchmarking
Supply chain and market analysis: photonics and InP supply chains, foundries, optical modules, Southeast Asia shift, NVIDIA and Broadcom CPO ecosystems, Greater China, regulatory considerations
Photonics for data centres: scale-up and scale-out networks, the bottleneck gap, pluggables to co-packaged optics, CPO applications, roadmap
MicroLED optical interconnect: the beachfront crisis, wide-and-slow architecture, GaN-on-silicon, application analysis
Photonic engines and accelerators for AI and neuromorphic compute, programmable photonics
Photonic integrated circuits for quantum computing, quantum networks and quantum sensing
Market forecasts: total PIC market, datacom transceivers, cost per gigabit, AI accelerator shipments, co-packaged optics, MicroLED interconnect, quantum PIC market, market by material
Company profiles including ACCRETECH, AEPONYX, Aledia, ALLOS Semiconductors, Amkor, Analog Photonics, ASE, Avicena, Ayar Labs, Black Semiconductor, Broadcom, Broadex, Cambridge Industries Group, CEA-Leti, Celestial AI, Centera Photonics, Ciena, Cisco, Coherent, CompoundTek, Credo, CyberRidge, DustPhotonics, EFFECT Photonics, EVG, GlobalFoundries, HD Microsystems, Henkel, HyperLight, Infineon, Infleqtion, Intel, iPronics, JCET Group, JSR Corporation, Lightelligence, Lightium, Lightmatter, Lightsynq Technologies, Lightwave Logic, LioniX, LIPAC, LPKF, Lumentum, Lumiphase, MACOM, Marvell and more
授權報價
| Single User | $1,100 GBP |
目錄 Table of Contents
1 PURPOSE AND SCOPE OF THIS REVISION 22
2 EXECUTIVE SUMMARY 23
2.1 Market Overview 23
2.2 Electronic and Photonic Integration Compared 26
2.3 Silicon Photonic Transceiver Evolution 27
2.4 Market Map 28
2.5 Global Market Trends in Silicon Photonics 30
2.6 Competing and Complementary Photonics Technologies 31
2.6.1 Metaphotonics 36
2.6.2 III-V Photonics 36
2.6.3 Lithium Niobate Photonics 36
2.6.4 Polymer Photonics 36
2.6.5 Plasmonic Photonics 36
2.7 Potential of Photonic AI Acceleration 36
2.8 The Copper Wall and the Beachfront-Density Crisis 37
2.9 Manufacturing Capacity Shifts to Southeast Asia 37
2.10 Commercial deployment of silicon photonics 38
2.11 Co-Packaged Optics 39
2.11.1 Divergent CPO Ecosystems: NVIDIA and Broadcom 39
2.11.2 The TSMC COUPE Packaging Platform 40
2.12 Manufacturing challenges 40
2.13 The Market Opportunity 42
2.14 Regional Strengths & Research Focus 43
3 INTRODUCTION TO SILICON PHOTONICS 44
3.1 What is Silicon Photonics? 44
3.1.1 Definition and Principles of Silicon Photonics 44
3.1.2 Comparison with traditional technologies 45
3.1.3 Silicon and Photonic Integrated Circuits 47
3.1.4 Optical IO, Coupling and Couplers 51
3.1.5 Emission and Photon Sources/Lasers 51
3.1.6 Detection and Photodetectors 52
3.1.7 Compound Semiconductor Lasers and Photodetectors (III-V) 52
3.1.8 Modulation, Modulators, and Mach-Zehnder Interferometers 53
3.1.8.1 New modulator technologies 54
3.1.9 Light Propagation and Waveguides 55
3.1.10 Optical Component Density 56
3.2 Advantages of Silicon Photonics 56
3.3 Applications of Silicon Photonics 57
3.4 Comparison with Other Photonic Integration Technologies 58
3.5 Evolution from Electronic to Photonic Integration 59
3.6 Silicon Photonics vs Traditional Electronics 59
3.7 Modern high-performance AI data centers 60
3.8 Core Technology Components 63
3.8.1 Optical IO, Coupling and Couplers 63
3.8.2 Emission and Photon Sources/Lasers 64
3.8.2.1 III-V Integration Challenges 64
3.8.2.2 Laser Integration Approaches 65
3.8.3 Detection and Photodetectors 65
3.8.4 Modulation Technologies 65
3.8.4.1 Mach-Zehnder Interferometers 66
3.8.4.2 Ring Modulators 66
3.8.4.3 Micro-Ring Modulators as a Competitive Differentiator 67
3.8.5 Light Propagation and Waveguides 67
3.8.6 Optical Component Density 68
3.9 Basic Optical Data Transmission 68
3.10 Silicon Photonic Circuit Architecture 69
4 MATERIALS AND COMPONENTS 71
4.1 Silicon 71
4.1.1 Silicon as a Photonic Material 71
4.1.1.1 Optical Properties of Silicon 72
4.1.1.2 Fabrication Processes for Silicon Photonics 72
4.1.2 Silicon-on-insulator (SOI) 73
4.1.2.1 SOI Manufacturing Process 76
4.1.2.2 Key SOI Players 77
4.2 Germanium 78
4.2.1 Germanium Integration in Silicon Photonics 78
4.2.2 Germanium Photodetectors 78
4.2.3 Germanium-on-Silicon Modulators 79
4.3 Silicon Nitride 79
4.3.1 Silicon Nitride (SiN) in Photonics Integrated Circuits 79
4.3.2 Optical Properties and Fabrication of SiN 81
4.3.3 SiN Modulator Technologies 82
4.3.4 SiN Applications in Photonics Integrated Circuits 82
4.3.5 Advances in SiN Modulator Technologies 83
4.3.6 SiN-based Waveguides and Devices 83
4.3.7 SiN Performance Analysis 84
4.3.8 Applications of SiN in Photonics 84
4.3.9 SiN PIC Players 84
4.3.10 SiN Key Foundries 87
4.4 Thin Film Lithium Niobate (TFLN) 90
4.4.1 Overview 90
4.4.2 Lithium Niobate on Insulator (LNOI) 91
4.4.2.1 Overview of LNOI Technology 91
4.4.2.2 Characteristics and Properties of LNOI 92
4.4.2.3 LNOI Fabrication Processes 92
4.4.2.4 LNOI-based Modulator and Switch Technologies 93
4.4.2.5 Trends Toward Higher Speed and Improved Power Efficiency 93
4.4.2.6 High-Speed LNOI Modulators 94
4.4.2.6.1 Energy-Efficient LNOI Devices 95
4.4.2.6.2 Emerging LNOI Device Technologies 95
4.5 Indium Phosphide 95
4.5.1 Indium Phosphide (InP) Integration 95
4.5.1.1 InP as a Direct Bandgap Semiconductor 96
4.5.1.2 InP-based Active Components 96
4.5.1.3 Hybrid Integration of InP with Silicon Photonics 96
4.5.2 InP PIC Players 97
4.6 Barium Titanite and Rare Earth metals 97
4.6.1 Barium Titanate (BTO) Modulators 98
4.7 Organic Polymer on Silicon 99
4.7.1 Polymer-based Modulators 100
4.8 Wafer Processing 100
4.8.1 Wafer Sizes by Platform 100
4.8.2 Processing Challenges 101
4.8.3 Yield Management 101
4.9 Hybrid and Heterogeneous Integration 101
4.9.1 Monolithic Integration 102
4.9.2 Hybrid Integration 102
4.9.3 Heterogeneous Integration 102
4.9.4 III-V-on-Silicon 103
4.9.5 Bonding and Die-Attachment Techniques 103
4.9.6 Monolithic versus Hybrid Integration 103
5 ADVANCED PACKAGING TECHNOLOGIES 105
5.1 Evolution of Packaging Technologies 105
5.1.1 Traditional Packaging Approaches 108
5.1.2 Advanced Packaging Roadmap 108
5.1.3 Key Performance Metrics 110
5.2 2.5D Integration Technologies 111
5.2.1 Silicon Interposer Technology 112
5.2.2 Glass Interposer Solutions 113
5.2.3 Organic Substrate Options 113
5.3 3D Integration Approaches 114
5.3.1 Through-Silicon Via (TSV) 114
5.3.1.1 TSV Manufacturing Process 115
5.3.1.2 TSV Challenges and Solutions 116
5.3.2 Hybrid Bonding Technologies 117
5.3.2.1 Cu-Cu Bonding 118
5.3.2.2 Direct Bonding 119
5.4 Co-Packaged Optics (CPO) 119
5.4.1 CPO Architecture Overview 119
5.4.2 Benefits and Challenges 120
5.4.3 Integration Approaches 121
5.4.3.1 2D Integration 122
5.4.3.2 2.5D Integration 122
5.4.3.3 3D Integration 122
5.4.4 Thermal Management 123
5.4.5 Optical Coupling Solutions 123
5.5 Optical Alignment 124
5.5.1 Active vs Passive Alignment 124
5.5.2 Coupling Efficiency 125
5.6 Manufacturing Challenges 125
6 MARKETS AND APPLICATIONS 128
6.1 Datacom Applications 130
6.1.1 Data Center Architecture Evolution 131
6.1.2 Transceivers 132
6.1.2.1 Integration 133
6.1.3 Artificial intelligence (AI) and machine learning (ML) 134
6.1.4 Pluggable optics 135
6.1.5 Linear drive and linear pluggable optics (LPO) 136
6.1.6 Interconnects 137
6.1.6.1 PIC-based on-device interconnects 138
6.1.6.2 Advanced Packaging and Co-Packaged Optics 141
6.1.6.2.1 Glass materials 141
6.1.6.2.2 Co-Packaged Optics 143
6.1.6.3 Photonic Engines and Accelerators 149
6.1.6.3.1 Photonic processing for AI 150
6.1.6.3.2 Convergence with software 150
6.1.6.3.3 Photonic field-programmable gate arrays (FPGAs) 151
6.1.6.4 Photonic Integrated Circuits for Quantum Computing 152
6.1.6.4.1 Photonic qubits 152
6.1.7 Optical Transceivers 155
6.1.7.1 Architecture and Operation 156
6.1.7.2 Market Players 156
6.1.7.3 Technology Roadmap 157
6.1.8 Co-Packaged Optics for Switches 157
6.1.8.1 CPO vs Pluggable Solutions 157
6.1.8.2 Power and Performance Benefits 158
6.1.8.3 Implementation Challenges 158
6.1.9 Data Center Networks 158
6.1.10 High-Performance Computing 159
6.1.10.1 On-Device Interconnects 160
6.1.10.2 Chip-to-Chip Communication 160
6.1.10.3 System Architecture Impact 160
6.1.11 Chip-to-Chip and Board-to-Board Interconnects 161
6.1.12 Ethernet Networking 161
6.2 Telecommunications 162
6.2.1 5G/6G Infrastructure 163
6.2.2 Bandwidth Requirements 163
6.2.3 Long-Haul and Metro Networks 164
6.2.4 5G and Fiber-to-the-X (FTTx) Applications 164
6.2.5 Optical Transceivers and Transponders 165
6.3 Sensing Applications 165
6.3.1 Lidar and Automotive Sensing 166
6.3.1.1 Photonic Integrated Circuit-based LiDAR 167
6.3.2 Chemical and Biological Sensing 170
6.3.3 Optical Coherence Tomography 172
6.4 Artificial Intelligence and Machine Learning 172
6.4.1 AI Data Traffic Requirements 173
6.4.2 Silicon Photonics for AI Accelerators 173
6.4.3 Photonic Processors 174
6.4.4 Photonic Processing for AI 174
6.4.5 Programmable Photonics 175
6.4.6 Neural Network Applications 176
6.4.7 Future AI Architecture Requirements 177
6.5 Quantum Computing and Communication 177
6.5.1 Quantum Photonic Requirements 177
6.5.2 Integration Challenges 178
6.5.3 Photonic Platform Quantum Computing 178
6.5.4 PICs for Quantum systems 179
6.5.5 Operational cycle of photonic quantum computers 180
6.5.6 Market Players and Development 183
6.6 Biophotonics and Medical Diagnostics 183
6.7 Future Applications 184
7 MICROLED OPTICAL INTERCONNECT 186
7.1 Introduction and the Beachfront Crisis 186
7.1.1 Why density, not speed, is the new constraint 186
7.1.2 The link dilemma 186
7.2 The MicroLED Interconnect Architecture 187
7.2.1 Wide-and-slow versus narrow-and-fast 187
7.2.2 Operational mechanism and link architecture 187
7.2.3 Challenges of the MicroLED approach 188
7.3 MicroLEDs and the GaN-on-Silicon Materials Question 189
7.4 Application Analysis 189
7.5 MicroLED Interconnect Market Forecast 190
8 GLOBAL MARKET SIZE 192
8.1 Global Silicon Photonics and Photonic Integrated Circuits Market Overview 192
8.1.1 Market Size and Growth Trends 192
8.1.2 Market Segmentation by Application 192
8.1.3 Server Boards, CPUs and Accelerators 193
8.1.4 Modules & PICs (Dies) Market Forecast 2023-2035 193
8.1.5 SOI Wafers for Silicon Photonics 194
8.1.6 LPO & New Modulator Materials Market Forecast 2023-2035 194
8.2 Datacom Applications 194
8.2.1 Market Forecast 194
8.2.1.1 Datacom and Telecom Modules and PICs 195
8.2.1.2 PIC Transceivers for AI 195
8.2.1.3 PIC Transceiver Pricing 196
8.2.2 PIC Transceiver Cost per Gigabit 196
8.2.3 PIC Datacom Transceiver Market 197
8.2.4 Datacom Transceiver Revenue by Customer Type 197
8.2.5 Key Drivers and Restraints 198
8.3 Co-Packaged Optics 199
8.4 Telecom Applications 199
8.4.1 Market Forecast 199
8.4.1.1 PIC-based Transceivers for 5G and 6G 200
8.4.2 Key Drivers and Restraints 200
8.5 Sensing Applications 201
8.5.1 Market Forecast 201
8.5.2 Key Drivers and Restraints 201
8.6 Photonic Integrated Circuit Market, by Material 202
9 SUPPLY CHAIN ANALYSIS 204
9.1 Foundries and Wafer Suppliers 204
9.1.1 CMOS Foundries 204
9.1.2 Specialty Photonics Foundries 205
9.1.3 Indium Phosphide Wafer Supply 206
9.2 Integrated Device Manufacturers (IDMs) 206
9.2.1 Fabless Companies 206
9.2.2 Fully Integrated Photonics Companies 207
9.3 Foundries and Wafer Suppliers 208
9.4 Packaging and Testing 209
9.4.1 Chip-Scale Packaging 209
9.4.2 Module-Level Packaging 209
9.4.3 Testing and Characterization 210
9.4.4 Optical Module Assembly: The Shift to Southeast Asia 210
9.4.5 The EML Laser Shortage 210
9.5 System Integrators and End-Users 211
9.5.1 CPO Partner Ecosystems: NVIDIA and Broadco 212
10 TECHNOLOGY TRENDS 213
10.1 Laser Integration Techniques 213
10.1.1 Direct Epitaxial Growth 213
10.1.2 Flip-Chip Bonding 214
10.1.3 Hybrid Integration 214
10.1.4 Advances and Challenges 214
10.2 Modulator Technologies 215
10.2.1 Silicon Modulators 216
10.2.2 Germanium Modulators 216
10.2.3 Lithium Niobate Modulators 216
10.2.4 Polymer Modulators 217
10.2.4.1 Tower Semiconductor and Lightwave Logic EO-Polymer 217
10.3 Photodetector Technologies 217
10.3.1 Silicon Photodetectors 217
10.3.2 Germanium Photodetectors 218
10.3.3 III-V Photodetectors 218
10.4 Waveguide and Coupling Innovations 218
10.4.1 Silicon Waveguides 219
10.4.2 Silicon Nitride Waveguides 219
10.4.3 Coupling Techniques 219
10.5 Packaging and Integration Advancements 219
10.5.1 Chip-Scale Packaging 219
10.5.2 Wafer-Scale Integration 220
10.5.3 3D Integration and Interposer Technologies 221
11 CHALLENGES AND FUTURE TRENDS 222
11.1 CMOS-Foundry-Compatible Devices and Integration 222
11.1.1 Scaling and Miniaturization 223
11.1.2 Process Complexity and Yield Improvement 223
11.2 Power Consumption and Thermal Management 224
11.2.1 Energy-Efficient Photonic Devices 225
11.2.2 Thermal Optimization Techniques 226
11.3 Packaging and Testing 226
11.3.1 Advanced Packaging Solutions 226
11.3.2 Automated Testing and Characterization 227
11.4 Scalability and Cost-Effectiveness 228
11.4.1 Wafer-Scale Integration 228
11.4.2 Outsourced Semiconductor Assembly and Test (OSAT) 229
11.5 Emerging Materials and Hybrid Integration 230
11.5.1 Novel Semiconductor Materials 230
11.5.2 Heterogeneous Integration Approaches 231
11.6 Technology Readiness Assessment 232
12 COMPANY PROFILES 234 (192 company profiles)
13 APPENDICES 367
13.1 Glossary of Terms 367
13.2 List of Abbreviations 368
13.3 Research Methodology 370
14 REFERENCES 371
圖表清單 List of Tables & Figures
List of Tables
Table 1. Headline forecast changes, prior edition vs. 2026-2036 edition 22
Table 2. Photonic Integrated Circuits Applications 24
Table 3. Silicon Photonics vs. Electronics: Key Metrics Comparison. 27
Table 4. Photonic Technologies Comparative Analysis. 33
Table 5. Comparison between electronic and photonic computing. 37
Table 6. Silicon Photonics technical achievements. 38
Table 7. Electronics companies silicon photonics commercial activities. 38
Table 8. Manufacturing Metrics & Challenges. 40
Table 9. Manufacturing Targets vs Current State. 41
Table 10. Regional Strengths & Research Focus. 43
Table 11. Comparative cost analysis. 45
Table 12. Challenges for CMOS-Foundry-Compatible Photonic Devices. 46
Table 13. Silicon Photonics Integration Schemes. 47
Table 14. Benefits of PICs. 48
Table 15. Current & Future Photonic Integrated Circuits Applications. 49
Table 16. Photodetector Performance. 52
Table 17. III-V Device Performance. 52
Table 18. Optical Modulator Performance Comparison. 53
Table 19. Silicon Photonic Waveguide Characteristics. 55
Table 20. Optical Component Integration Metrics. 56
Table 21. Advantages of Silicon Photonics. 56
Table 22. Applications of Silicon Photonics. 57
Table 23. Comparison with Other Photonic Integration Technologies. 58
Table 24. Silicon Photonics vs Traditional Electronics: Performance Metrics. 59
Table 25. Switch IC Bandwidth and CPO Technology Evolution. 61
Table 26. Challenges in data center architectures. 62
Table 27. Key Trends of Optical Transceivers in High-End Data Centers. 62
Table 28. Core Components Specifications and Requirements 63
Table 29. Types of Emission and Photon Sources/Lasers. 64
Table 30. III-V Integration Challenges. 64
Table 31. Laser Integration Approaches Comparison. 65
Table 32. Modulator Types and Configurations. 66
Table 33. Waveguide Specifications and Requirements. 68
Table 34. Data Transmission Parameters and Specifications. 68
Table 35. Circuit Architecture Building Blocks. 69
Table 36. Integration Approaches. 70
Table 37. Technology Platforms. 71
Table 38. Silicon Photonics Component Specifications. 72
Table 39. Optical Properties of Silicon. 72
Table 40. Fabrication Processes for Silicon Photonics. 72
Table 41. Silicon Semiconductor Foundry In-House Technologies. 73
Table 42. SOI Platform Benchmarking. 74
Table 43. Silicon Foundry Technology Comparison. 76
Table 44. Silicon-on-insulator (SOI) Platform Benchmarking. 77
Table 45. Key SOI Players. 77
Table 46. Germanium Integration Methods and Applications. 78
Table 47. SiN Key Foundries. 81
Table 48. SiN Modulator Technologies. 82
Table 49. Silicon (SOI and SiN) Device Heterogeneous Integration. 82
Table 50. SiN Benchmarking. 84
Table 51. Applications of SiN in Photonics. 84
Table 52. SiN PIC Players. 85
Table 53. SiN Foundry Analysis. 87
Table 54. Benchmarking of TFLN. 91
Table 55. Characteristics and Properties of LNOI. 92
Table 56. LNOI Fabrication Processes. 92
Table 57. LNOI-based Modulator and Switch Technologies. 93
Table 58. Emerging LNOI Device Technologies. 95
Table 59. InP Benchmarking. 96
Table 60. Integration Technologies. 97
Table 61. InP PIC Players. 97
Table 62. BTO Benchmarking. 98
Table 63. Comparative analysis of materials. 98
Table 64. Benchmarking of Polymer on Insulator. 99
Table 65. Wafer Size Comparison by Platform. 100
Table 66. Wafer Processing Challenges. 101
Table 67. Yield Analysis by Process Step. 101
Table 68. Integration Scheme Comparison. 101
Table 69. Bonding and Die-Attachment Techniques. 103
Table 70. Monolithic versus Hybrid Integration. 104
Table 71. Packaging Technology Comparison Matrix. 105
Table 72. Evolution of semiconductor packaging. 105
Table 73. Summary of key advanced semiconductor packaging approaches. 109
Table 74. Key Performance Metrics for Advanced Packaging Technologies. 110
Table 75. Glass Interposer Solutions. 113
Table 76. Organic Substrate Options. 114
Table 77. TSV Specifications by Application. 115
Table 78. TSV Challenges and Solutions. 116
Table 79. Comparative benchmark overview table of key semiconductor interconnection technologies 117
Table 80. CPO Benefits and Challenges. 120
Table 81. Performance Metrics Comparison. 121
Table 82. CPO Integration Approaches Comparison. 121
Table 83. Manufacturing Process Comparison. 122
Table 84. Thermal Management Approaches. 123
Table 85. Optical Coupling Solutions. 123
Table 86. Alignment Tolerance Analysis. 124
Table 87. Active vs Passive Alignment Comparison. 124
Table 88. Coupling Efficiency Analysis. 125
Table 89. Advanced packaging manufacturing challenges. 125
Table 90.Silicon Photonics & Photonic Integrated Circuits Market and Applications 128
Table 91. Energy Consumption Analysis. 131
Table 92. Key Metrics for Advanced Semiconductor Packaging Performance. 142
Table 93. Pluggable Optics vs. Co-Packaged Optics (CPO). 145
Table 94. Future Challenges in Co-Packaged Optics (CPO). 146
Table 95. Key Technology Building Blocks for Co-Packaged Optics. 147
Table 96. Key Packaging Components for Co-Packaged Optics. 147
Table 97. Key Players in Photonic Quantum Computing. 152
Table 98. Comparison of PICs vs Traditional Optical Systems. 153
Table 99. Future PIC Requirements of the Quantum Industry. 154
Table 100. Optical Transceivers Market Players. 156
Table 101. Power and Performance Benefits. 158
Table 102. Implementation Challenges. 158
Table 103. Silicon Photonics in HPC: Technical Parameters 159
Table 104. Applications of Silicon Photonics in Telecommunications. 162
Table 105. Bandwidth Requirements by Segment. 164
Table 106. 5G and FTTx Applications Technical Parameters. 165
Table 107. Opportunities for PIC Sensors in LiDAR Applications. 167
Table 108. Challenges of PIC-based FMCW LiDARs. 168
Table 109. Companies Developing PIC-based LiDAR. 168
Table 110. Companies Developing PIC Biosensors. 170
Table 111. Companies Developing PIC-based Gas Sensors. 170
Table 112. Companies Developing Spectroscopy PICs. 171
Table 113. AI Data Traffic Requirements. 173
Table 114. Neural Network Applications. 176
Table 115. Future AI Architecture Requirements. 177
Table 116. Quantum Photonic Requirements. 177
Table 117. Integration Challenges in Quantum Computing and Communication. 178
Table 118. Future PIC Requirements of the Quantum Industry. 181
Table 119. Roadmap for Photonic Quantum Hardware. 182
Table 120. Market players and development. 183
Table 121. Biophotonics Applications. 184
Table 122. Future Applications. 184
Table 123. MicroLED optical interconnect: advantages and challenges 189
Table 124. MicroLED optical interconnect: application landscape 189
Table 125. MicroLED Optical Interconnect Market Forecast, 2026–2036 (US$ million) 190
Table 126. Global Silicon Photonics and PIC Market, 2026-2036 (US$ billion) 192
Table 127. Market Segmentation by Application 2026-2036 (Billions USD). 192
Table 128. Silicon Photonics on Server Boards, CPUs and Accelerators, 2026-2036 193
Table 129. Modules and PICs (Dies) Market Forecast, 2026-2036 (US$ billion) 193
Table 130. SOI Wafers for Silicon Photonics Market Forecast, 2026-2036 194
Table 131. LPO and New Modulator Materials Market Forecast, 2026-2036 (US$ billion) 194
Table 132. Silicon Photonics in Datacom Applications, 2026-2036 (US$ billion) 195
Table 133. Datacom and Telecom Modules Market Forecast, 2026-2036 (US$ billion) 195
Table 134. Datacom and Telecom PICs (Dies) Market Forecast, 2026-2036 (US$ billion) 195
Table 135. PIC Transceivers for AI, Units Forecast, 2026-2036 196
Table 136. PIC Transceiver Pricing, 2026-2036 (US$ per unit) 196
Table 137. PIC Transceiver Cost per Gigabit, 2026-2036 (US$ per Gb/s) 196
Table 138. PIC Datacom Transceiver Market Forecast, 2026-2036 197
Table 139. PIC Datacom Transceiver Revenue by Customer Type, 2026-2036 (US$ billion) 197
Table 140. Key market drivers and restraints for silicon photonics in Datacom Applications. 198
Table 141. Co-Packaged Optics Market Forecast, 2026-2036 (US$ million) 199
Table 142. Silicon Photonics in Telecom Applications, 2026-2036 (US$ billion) 199
Table 143. PIC-based Transceivers for 5G and 6G, Units and Market, 2026-2036 200
Table 144. Key market drivers and restraints for silicon photonics in Telecom Applications. 200
Table 145. Silicon Photonics in Sensing Applications, 2026-2036 (US$ billion) 201
Table 146. Key market drivers and restraints for silicon photonics in Sensing Applications. 201
Table 147. PIC Market by Material Platform, 2026-2036 (US$ billion) 203
Table 148. CMOS Foundries. 204
Table 149. Specialty Photonics Foundries. 205
Table 150. Fabless Companies. 207
Table 151. Fully Integrated Photonics Companies. 207
Table 152. Foundries and Wafer Suppliers. 208
Table 153. System Integrators and End-Users. 211
Table 154. Laser Integration Methods Comparison. 213
Table 155. Advanced Techniques and Challenges. 214
Table 156. Modulator Technology Benchmarking. 215
Table 157. Photodetector Performance Metrics . 217
Table 158. Novel semiconductor materials for silicon photonics. 230
Table 159. Technology readiness of silicon photonics technologies, 2026 232
Table 160. Glossary of terms. 367
Table 161. List of abbreviations. 368
List of Figures
Figure 1. Silicon Photonic Transceiver Evolution Timeline. 28
Figure 2. Silicon Photonics Player Market Map. 30
Figure 3. Basic Silicon Photonic Circuit Architecture. 44
Figure 4. High Performance AI data center. 61
Figure 5. Optical IO Coupling Mechanisms Diagram. 63
Figure 6. Optical Component Density Evolution. 68
Figure 7. Basic Optical Data Transmission Diagram. 69
Figure 8. SOI Wafer Structure. 73
Figure 9. Manufacturing Process Flow. 76
Figure 10. Germanium Photodetector. 79
Figure 11. Silicon Nitride Layer Stack. 80
Figure 12. AEPONYX SiN PICs. 81
Figure 13. SiN Waveguide Cross-sections. 84
Figure 14. LNOI Device Structures . 92
Figure 15. Timeline of different packaging technologies. 107
Figure 16. Advanced Packaging Roadmap. 109
Figure 17. 2D chip packaging. 111
Figure 18. Typical structure of 2.5D IC package utilizing interposer. 113
Figure 19. TSV Structure and Implementation. 116
Figure 20. Hybrid Bonding Process Flow. 118
Figure 21. Co-Packaged Optics Architecture. 120
Figure 22. Optical module with pluggable fibre interconnect. 135
Figure 23. Roadmap for PIC-Based Transceivers. 137
Figure 24. Evolution Roadmap for Semiconductor Packaging. 141
Figure 25. Roadmap for photonic quantum hardware. 155
Figure 26. Optical Transceivers Technology Roadmap. 157
Figure 27. 5G/6G Implementation Roadmap. 163
Figure 28. LiDAR System Design. 167
Figure 29. Narrow-and-fast versus wide-and-slow interconnect architectures. 187
Figure 30. MicroLED optical interconnect link architecture. 188
Figure 31. Indicative link energy by interconnect technology (pJ/bit). 191
Figure 31. MicroLED Optical Interconnect Market Forecast, 2026–2036 (US$ million). 191
Figure 32. Silicon Photonics Supply Chain and Ecosystem. 204
Figure 33. Concept for advanced packaging for integrated photonics. 220
Figure 34. Aeries II LiDAR system. 235
Figure 35. NVIDIA's silicon photonics switches. 308
Figure 36. PhotoniSol optical isolator chip. 318
Figure 37. PsiQuantum’s modularized quantum computing system networks. 321
Figure 38. Q.ANT Native Processing Unit (NPU). 322
Figure 39. QuiX low-loss photonic quantum processors. 327
Figure 40. A prototype of Taara’s silicon photonics chip device. 363
常見問題
這份報告可以先索取樣本嗎？
可以。建議購買前先申請樣本，提出申請後約 2 個工作天內提供，您可以先確認內容涵蓋範圍是否符合需求。
報告價格如何計算？
報告以美元標價，台幣報價依當日匯率換算並加計 5% 營業稅。不同授權版本（單人／多人／企業全站）價格不同，量子訊息會評估您的使用情境後提供最優惠報價。
下單後多久交付？如何付款？
一般 3–7 個工作天交付，實際依出版商狀況於下單前確認。收到報告確認無誤後開立台幣發票，30 天內電匯付款即可。
量子訊息有限公司為 Future Markets 在台灣的授權代理，提供報告購買、樣本申請與授權諮詢。電話 +886 2 7751 5192 ・ 聯絡我們