The Global Thermal Interface Materials Market
報告摘要
Thermal interface materials fill the microscopic voids between a heat-generating component and the surface carrying heat away, and they have moved from a commodity consumable to a rate-limiting factor in electronics design. Demand is set by power density rather than device count. GPUs running AI workloads dissipate heat fluxes on the order of 140 W/cm², while three-dimensional stacked architectures record average fluxes near 300 W/cm² with localised hotspots between 500 and 1,000 W/cm². Filled polymers, adequate when packages dissipated around 100 W, are reaching their ceiling as advanced packages approach 1,000 W. Metal interfaces, indium alloys in particular, are increasingly specified above roughly 400 W, where switching from polymer has been shown to cut junction temperature by more than 10°C — significant given a 10°C rise typically halves die lifetime.
This report provides a comprehensive technical and commercial assessment of thermal interface materials across eleven end markets. The market is analysed from the materials up. Coverage spans greases and pastes, gap pads, dispensed gap fillers, potting compounds and encapsulants, adhesive tapes, phase change materials, metal-based interfaces including solders, sintered silver and copper, and liquid metals, and the full range of carbon-based options from graphite sheet to vertically aligned nanotube arrays and graphene composites. Filler chemistry is treated separately, covering alumina, boron nitride, aluminium nitride, diamond, graphene and boron nitride nanotubes, with pricing and adoption barriers for each.
A dedicated chapter addresses emerging materials and processes, organised by the engineering problem each solves rather than by chemistry. It covers TIM0 through TIM3 nomenclature and the collapse in allowable application pressure for large HPC modules, hybrid and confined liquid metal architectures, warpage-tolerant phase change materials for AI server dies, anchored nanocarbon interfaces, very high density graphite, boron arsenide, liquid-infused nanowire composites, die backside power delivery, immersion cooling compatibility, AI-directed formulation discovery, circularity, and the shift from datasheet-based specification to knowledge-based qualification.
Market forecasts are provided for consumer electronics, electric vehicles, data centres, advanced semiconductor packaging, ADAS sensors, EMI shielding, 5G infrastructure, aerospace and defence, industrial electronics, renewable energy and medical electronics, segmented by material type at annual granularity. Area forecasts in m² are given for server boards, ADAS die attach, 5G antennas, baseband units and power supplies, alongside a 5G power consumption model.
The report profiles 118 companies across the value chain, from multinational formulators to venture-backed materials startups, with recent product launches, partnerships and corporate developments. An accompanying Excel workbook contains all underlying data as live, editable models.
Contents include:
Introduction — active and passive thermal management, TIM types and thermal conductivity, comparative properties, pads versus grease, advantages and disadvantages by type, performance, prices, supply chain, raw material analysis and pricing, environmental regulations and sustainability, system-level performance, thermal conductivity versus thermal resistance, TIM chemistry
Materials — advanced and multi-functional TIMs, fillers and trends, greases and pastes, gap pads, gap fillers, potting compounds and encapsulants, adhesive tapes, phase change materials, metal-based TIMs, carbon-based TIMs, metamaterials, self-healing TIMs, dispensing equipment and methods
Emerging materials and processes — interface as constraint, TIM0–TIM3 nomenclature, hybrid and confined liquid metals, next-generation PCMs, anchored nanocarbon, graphene and VHD graphite, boron nitride and boron arsenide, liquid-infused and nanowire composites, metal TIM1, heterogeneous integration and backside power, immersion cooling, AI-directed discovery, sustainability and circularity, metrology and qualification, networking silicon
Markets — consumer electronics, electric vehicles, data centres, advanced semiconductor packaging, ADAS sensors, EMI shielding, 5G, aerospace and defence, industrial electronics, renewable energy, medical electronics
118 Company profiles. Companies profiled include 3M, ADA Technologies, Aismalibar, AI Technology, Alpha Assembly, AluChem, AOK Technologies, AOS Thermal Compounds, Arkema, Arieca, ATP Adhesive Systems, Aztrong, Bando Chemical Industries, Bdtronic, BestGraphene, BNNano, BNNT, Boston Materials, Boyd Corporation, BYK, Cambridge Nanotherm, Carbice, Carbon Waters, Carbodeon, CondAlign, Denka, Detakta, Dexerials, Deyang Carbonene Technology, Discovered Materials, Dow Corning, Dowa Electronics Materials, Dymax, Dynex Semiconductor (CRRC), ELANTAS, Elkem Silcones, Enerdyne Thermal Solutions, Epoxies Etc., First Graphene, Fujipoly, Fujitsu Laboratories, GCS Thermal, GLPOLY, Global Graphene Group, Goodfellow, Graphmatech, Green Critical Minerals, GuangDong KingBali New Material, HALA Contec, Hamamatsu Carbonics, H.B. Fuller, Henkel, Hitek Electronic Materials, Honeywell, Hongfucheng New Materials, Huber Martinswerk, HyMet Thermal Interfaces, Indium Corporation, Inkron, KB Element, Kerafol, Kitagawa and more
授權報價
| Single User | $1,100 GBP |
目錄 Table of Contents
1 INTRODUCTION 21
1.1 Thermal Management-active and passive 21
1.2 What are Thermal Interface Materials (TIMs)? 21
1.2.1 Types of TIMs 23
1.2.2 Thermal conductivity 24
1.3 Comparative properties of TIMs 25
1.4 Thermal Pads and Thermal Grease 29
1.5 Advantages and Disadvantages of TIMs, by type 30
1.6 Performance 32
1.7 Prices 35
1.8 Emerging Technologies in TIMs 35
1.9 Supply Chain for TIMs 36
1.10 Raw Material Analysis and Pricing 37
1.11 Environmental Regulations and Sustainability 37
1.12 System Level Performance 38
1.13 Thermal Conductivity vs Thermal Resistance 39
1.14 TIM Chemistry 40
2 MATERIALS 42
2.1 Advanced and Multi-Functional TIMs 43
2.1.1 Carbon-based TIMs 44
2.1.1.1 Overview 44
2.1.2 Thermal Conductivity By Filler Type 45
2.1.3 Thermal Conductivity By Matrix 46
2.2 TIM fillers 47
2.2.1 Trends 48
2.2.2 Pros and Cons 49
2.2.3 Thermal Conductivity 50
2.2.4 Spherical Alumina 51
2.2.5 Alumina Fillers 51
2.2.6 Boron nitride (BN) 52
2.2.6.1 Overview 52
2.2.6.2 Suppliers 53
2.2.6.3 Nano Boron Nitride 55
2.2.7 Filler and polymer TIMs 57
2.2.8 Diamond 58
2.2.9 Filler Sizes 60
2.3 Thermal Greases and Pastes 61
2.3.1 Overview and properties 61
2.3.2 SWOT analysis 65
2.4 Thermal Gap Pads 66
2.4.1 Overview and properties 66
2.4.2 Application in EV Batteries 67
2.4.3 Transitioning to Gap fillers from Pads 67
2.4.4 SWOT analysis 68
2.5 Thermal Gap Fillers 70
2.5.1 Overview and properties 70
2.5.2 Products 70
2.5.3 SWOT analysis 71
2.6 Potting Compounds/Encapsulants 73
2.6.1 Overview and properties 73
2.6.2 SWOT analysis 75
2.7 Adhesive Tapes 77
2.7.1 Overview and properties 77
2.7.2 Application in EV Batteries 78
2.7.3 TCA Requirements 79
2.7.4 SWOT analysis 79
2.8 Phase Change Materials 81
2.8.1 Overview 81
2.8.2 Products 81
2.8.3 Properties 82
2.8.4 Types 83
2.8.4.1 Organic/biobased phase change materials 84
2.8.4.1.1 Advantages and disadvantages 85
2.8.4.1.2 Paraffin wax 85
2.8.4.1.3 Non-Paraffins/Bio-based 86
2.8.4.2 Inorganic phase change materials 86
2.8.4.2.1 Salt hydrates 86
2.8.4.2.1.1 Advantages and disadvantages 87
2.8.4.2.2 Metal and metal alloy PCMs (High-temperature) 87
2.8.4.3 Eutectic mixtures 88
2.8.4.4 Encapsulation of PCMs 88
2.8.4.4.1 Macroencapsulation 89
2.8.4.4.2 Micro/nanoencapsulation 89
2.8.4.5 Nanomaterial phase change materials 89
2.8.5 Thermal energy storage (TES) 89
2.8.5.1 Sensible heat storage 90
2.8.5.2 Latent heat storage 90
2.8.6 Application in TIMs 91
2.8.6.1 Thermal pads 92
2.8.6.2 Low Melting Alloys (LMAs) 93
2.8.6.3 Thermal storage units 93
2.8.6.4 Thermal energy storage panels 93
2.8.6.5 Space systems 94
2.8.7 SWOT analysis 96
2.9 Metal-based TIMs 97
2.9.1 Overview 97
2.9.1.1 Metal-Based TIM1 and TIM2 97
2.9.1.2 Metal Filled Polymer TIMs 98
2.9.2 Solders and low melting temperature alloy TIMs 98
2.9.2.1 Solder TIM1 100
2.9.2.2 Sintering 101
2.9.3 Liquid metals 103
2.9.3.1 Liquid metal for high-performance GPU 104
2.9.3.2 Challenges 105
2.9.4 Solid liquid hybrid (SLH) metals 105
2.9.4.1 Hybrid liquid metal pastes 105
2.9.4.2 SLH created during chip assembly (m2TIMs) 107
2.9.4.3 Die-attach materials 107
2.9.4.3.1 Solder Alloys and Conductive Adhesives 109
2.9.4.3.2 Silver-Sintered Paste 111
2.9.4.3.3 Copper (Cu) sintered TIMs 112
2.9.4.3.3.1 TIM1 - Sintered Copper 112
2.9.4.3.3.2 Cu Sinter Materials 113
2.9.4.3.3.3 Copper Sintering Challenges 115
2.9.4.3.3.4 Commercial Use 116
2.9.4.3.4 Sintered Copper Die-Bonding Paste 116
2.9.4.3.4.1 Commercial activity 117
2.9.4.3.5 Graphene Enhanced Sintered Copper TIMs 117
2.9.4.4 Laminar Metal Form With High Softness 117
2.9.5 SWOT analysis 118
2.10 Carbon-based TIMs 120
2.10.1 Carbon nanotube (CNT) TIM Fabrication 120
2.10.2 Challenges 121
2.10.3 Market players 122
2.10.4 Multi-walled nanotubes (MWCNT) 123
2.10.4.1 Properties 123
2.10.4.2 Application as thermal interface materials 124
2.10.5 Single-walled carbon nanotubes (SWCNTs) 125
2.10.5.1 Properties 125
2.10.5.2 Application as thermal interface materials 127
2.10.6 Vertically aligned CNTs (VACNTs) 128
2.10.6.1 Properties 128
2.10.6.2 Applications 128
2.10.6.3 Application as thermal interface materials 129
2.10.7 BN nanotubes (BNNT) and nanosheets (BNNS) 129
2.10.7.1 Properties 130
2.10.7.2 Application as thermal interface materials 130
2.10.8 Graphene 131
2.10.8.1 Properties 132
2.10.8.2 Application as thermal interface materials 133
2.10.8.2.1 Graphene fillers 134
2.10.8.2.2 Graphene foam 135
2.10.8.2.3 Graphene aerogel 135
2.10.8.2.4 Graphene Heat Spreaders 135
2.10.8.2.5 Graphene in Thermal Interface Pads 136
2.10.8.3 Advantages of Graphene 137
2.10.8.4 Through-Plane Alignment 138
2.10.9 Nanodiamonds 138
2.10.9.1 Properties 138
2.10.9.2 Application as thermal interface materials 140
2.10.10 Graphite 140
2.10.10.1 Properties 140
2.10.10.2 Natural graphite 141
2.10.10.2.1 Classification 142
2.10.10.2.2 Processing 143
2.10.10.2.3 Flake 143
2.10.10.2.3.1 Grades 144
2.10.10.2.3.2 Applications 144
2.10.10.3 Synthetic graphite 146
2.10.10.3.1 Classification 146
2.10.10.3.1.1 Primary synthetic graphite 146
2.10.10.3.1.2 Secondary synthetic graphite 147
2.10.10.3.1.3 Processing 147
2.10.10.4 Applications as thermal interface materials 147
2.10.10.4.1 Graphite Sheets 148
2.10.10.4.2 Vertical graphite 149
2.10.10.4.3 Graphite pastes 150
2.10.10.5 Challenges 150
2.10.10.5.1 Through-plane thermal conductivity limitations 150
2.10.10.5.2 Interfacing with Heat Source and Disrupting Alignment 151
2.10.11 Hexagonal Boron Nitride 151
2.10.11.1 Properties 152
2.10.11.2 Application as thermal interface materials 153
2.10.12 SWOT analysis 154
2.11 Metamaterials 155
2.11.1 Types and properties 155
2.11.1.1 Electromagnetic metamaterials 156
2.11.1.1.1 Double negative (DNG) metamaterials 156
2.11.1.1.2 Single negative metamaterials 157
2.11.1.1.3 Electromagnetic bandgap metamaterials (EBG) 157
2.11.1.1.4 Bi-isotropic and bianisotropic metamaterials 157
2.11.1.1.5 Chiral metamaterials 157
2.11.1.1.6 Electromagnetic “Invisibility” cloak 158
2.11.1.2 Terahertz metamaterials 158
2.11.1.3 Photonic metamaterials 158
2.11.1.4 Tunable metamaterials 159
2.11.1.5 Frequency selective surface (FSS) based metamaterials 159
2.11.1.6 Nonlinear metamaterials 159
2.11.1.7 Acoustic metamaterials 160
2.11.2 Application as thermal interface materials 160
2.12 Self-healing thermal interface materials 160
2.12.1 Extrinsic self-healing 162
2.12.2 Capsule-based 162
2.12.3 Vascular self-healing 162
2.12.4 Intrinsic self-healing 162
2.12.5 Healing volume 163
2.12.6 Types of self-healing materials, polymers and coatings 164
2.12.7 Applications in thermal interface materials 165
2.13 TIM Dispensing 165
2.13.1 Low-volume Dispensing Methods 165
2.13.2 High-volume Dispensing Methods 166
2.13.3 Meter, Mix, Dispense (MMD) Systems 166
2.13.4 TIM Dispensing Equipment Suppliers 167
3 MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs) 169
3.1 Consumer Electronics 169
3.1.1 Market overview 169
3.1.1.1 Market drivers 169
3.1.1.2 Applications 170
3.1.1.2.1 Smartphones and tablets 171
3.1.1.2.1.1 Graphitic Heat Spreaders 174
3.1.1.2.1.2 Liquid metals 175
3.1.1.2.2 Wearable electronics 176
3.1.2 Global market 2022-2037, by TIM type 177
3.2 Electric Vehicles (EV) 179
3.2.1 Market overview 179
3.2.1.1 Market drivers 179
3.2.1.2 Applications 179
3.2.1.2.1 EV Battery Packs 180
3.2.1.2.1.1 TIM Pack and Module 180
3.2.1.2.1.2 TIM Application by Cell Format 180
3.2.1.2.1.3 Thermal Interface Material Fillers for EV Batteries 182
3.2.1.2.1.4 TIM Pricing 184
3.2.1.2.1.5 Companies 184
3.2.1.2.2 Lithium-ion batteries 185
3.2.1.2.2.1 Cell-to-pack designs 186
3.2.1.2.2.2 Cell-to-chassis/body 187
3.2.1.2.3 Power electronics 189
3.2.1.2.3.1 Types 190
3.2.1.2.3.2 Trends 190
3.2.1.2.3.3 Properties for TIM2 Properties in EV power electronics 191
3.2.1.2.3.4 TIM1s 194
3.2.1.2.3.5 TIM2 in SiC MOSFET 196
3.2.1.2.4 Charging stations 197
3.2.2 Global market 2022-2037, by TIM type 197
3.3 Data Centers 200
3.3.1 Market overview 200
3.3.1.1 Market drivers 200
3.3.1.2 Applications 201
3.3.1.2.1 Router, switches and line cards 201
3.3.1.2.1.1 Transceivers 203
3.3.1.2.1.2 Server Boards 203
3.3.1.2.1.3 Switches and Routers 205
3.3.1.2.2 AI Servers 206
3.3.1.2.2.1 Overview 206
3.3.1.2.2.2 Trends 206
3.3.1.2.2.3 TRL 209
3.3.1.2.3 Power supply converters 216
3.3.1.2.3.1 Overview 216
3.3.1.2.3.2 Laminar metal form TIMs 216
3.3.1.2.3.3 TIM Consumption in Data Center Power Supplies 217
3.3.1.2.3.4 Immersion cooling 218
3.3.2 Global market 2022-2037, by TIM type 219
3.4 Advanced Semiconductor Packaging 221
3.4.1 Market Overview 221
3.4.2 TIM1 222
3.4.2.1 Indium foil TIM1 222
3.4.2.2 Products 222
3.4.2.2.1 Thermal Gel 223
3.4.2.2.2 Thermal grease 223
3.4.2.2.3 Graphene 224
3.4.2.2.4 Liquid metal 225
3.4.2.2.5 Diamond thermal interface materials in TIM0 applications 226
3.4.2.2.6 Integrated silicon micro-cooler systems 226
3.4.2.2.7 Copper nanowire (CuNWs) 227
3.4.3 Global market 2022-2037, by TIM type 228
3.5 ADAS Sensors 230
3.5.1 Market overview 230
3.5.1.1 Market drivers 230
3.5.1.1.1 Sensor Suite for Autonomous Cars 230
3.5.1.1.2 Thermal Management in ADAS Sensors 231
3.5.1.2 Applications 232
3.5.1.2.1 ADAS Cameras 233
3.5.1.2.1.1 Commercial examples 233
3.5.1.2.2 ADAS Radar 234
3.5.1.2.2.1 Radar technology 234
3.5.1.2.2.2 Radar boards 235
3.5.1.2.2.3 Commercial examples 236
3.5.1.2.3 ADAS LiDAR 237
3.5.1.2.3.1 Role of TIMs 237
3.5.1.2.3.2 Commercial examples 237
3.5.1.2.4 Electronic control units (ECUs) and computers 238
3.5.1.2.4.1 Overview 238
3.5.1.2.4.2 Commercial examples 239
3.5.1.2.5 Die attach materials 240
3.5.1.2.5.1 Overview 240
3.5.1.2.5.2 Commercial examples 241
3.5.1.3 Companies 243
3.5.2 Global market 2022-2037, by TIM type 244
3.6 EMI shielding 246
3.6.1 Market overview 246
3.6.1.1 Market drivers 246
3.6.1.2 Applications 246
3.6.1.2.1 Dielectric Constant 247
3.6.1.2.2 ADAS 248
3.6.1.2.2.1 Radar 249
3.6.1.2.2.2 5G 249
3.6.1.2.3 Commercial examples 250
3.7 5G 251
3.7.1 Market overview 251
3.7.1.1 Market drivers 251
3.7.1.2 Applications 251
3.7.1.2.1 EMI shielding and EMI gaskets 252
3.7.1.2.2 Antenna 252
3.7.1.2.3 Base Band Unit (BBU) 255
3.7.1.2.4 Liquid TIMs 258
3.7.1.2.5 Power supplies 258
3.7.1.2.5.1 Increased power consumption in 5G 259
3.7.2 Market players 260
3.7.3 Global market 2022-2037, by TIM type 260
3.8 Aerospace & Defense 262
3.8.1 Market overview 262
3.8.1.1 Market drivers 262
3.8.1.2 Applications 262
3.8.1.2.1 Satellite thermal management 262
3.8.1.2.1.1 Temperature range 263
3.8.1.2.1.2 Heat Spreaders 264
3.8.1.2.1.3 Carbon fiber reinforced TIM 264
3.8.1.2.1.4 Thermal pads 265
3.8.1.2.1.5 Thermal straps 266
3.8.1.2.1.6 Graphene 266
3.8.1.2.1.7 Challenges 267
3.8.1.2.2 Avionics cooling 269
3.8.1.2.3 Military electronics 269
3.8.1.3 Global market 2022-2037, by TIM type 269
3.9 Industrial Electronics 271
3.9.1 Market overview 271
3.9.1.1 Market drivers 271
3.9.1.2 Applications 272
3.9.1.2.1 Industrial automation 272
3.9.1.2.2 Power supplies 272
3.9.1.2.3 Motor drives 272
3.9.1.2.4 LED lighting 273
3.9.2 Global market 2022-2037, by TIM type 273
3.10 Renewable Energy 274
3.10.1 Market overview 274
3.10.1.1 Market drivers 274
3.10.1.2 Applications 275
3.10.1.2.1 Solar inverters 275
3.10.1.2.2 Wind power electronics 275
3.10.1.2.3 Energy storage systems 275
3.10.2 Global market 2022-2037, by TIM type 276
3.11 Medical Electronics 278
3.11.1 Market overview 278
3.11.1.1 Market drivers 278
3.11.1.2 Applications 278
3.11.1.2.1 Diagnostic equipment 278
3.11.1.2.2 Medical imaging systems 279
3.11.1.2.3 Patient monitoring devices 279
3.11.2 Global market 2022-2037, by TIM type 279
4 COMPANY PROFILES 281 (116 company profiles)
5 RESEARCH METHODOLOGY 366
6 REFERENCES 367
圖表清單 List of Tables & Figures
List of Tables
Table 1. Thermal conductivities (κ) of common metallic, carbon, and ceramic fillers employed in TIMs. 25
Table 2. Commercial TIMs and their properties. 26
Table 3. Advantages and disadvantages of TIMs, by type. 30
Table 4. Key Factors in System Level Performance for TIMs. 32
Table 5. TIM Materials by Thermal, Mechanical, and Application Properties 33
Table 6. Thermal interface materials prices. 35
Table 7. Comparisons of Price and Thermal Conductivity for TIMs. 35
Table 8. Price Comparison of TIM Fillers. 35
Table 9. Raw Material Analysis and Pricing. 37
Table 10. System Level Performance Comparison. 38
Table 11. Thermal Conductivity vs Thermal Resistance Comparison. 39
Table 12. TIM Chemistry Comparison 40
Table 13. Characteristics of some typical TIMs. 42
Table 14. Carbon-Based TIM Performance. 44
Table 15. Thermal Conductivity By Filler Type 46
Table 16. Thermal Conductivity By Matrix. 47
Table 17. Trends on TIM Fillers. 49
Table 18. Pros and Cons of TIM Fillers. 49
Table 19. Thermal Conductivity Comparison ATH and Al2O3. 52
Table 20. BNNT Companies and Prices. 55
Table 21.BNNT Property Variation. 56
Table 22. Diamond fillers with varied sizes for thermal interface materials. 59
Table 23. Commercial thermal paste products. 63
Table 24.Commercial thermal gap pads (thermal interface materials). 66
Table 25. Commercial thermal gap fillers products. 70
Table 26. Types of Potting Compounds/Encapsulants. 74
Table 27. TIM adhesives tapes. 77
Table 28. Commercial phase change materials (PCM) thermal interface materials (TIMs) products. 81
Table 29. Properties of PCMs. 82
Table 30. PCM Types and properties. 84
Table 31. Advantages and disadvantages of organic PCMs. 85
Table 32. Advantages and disadvantages of organic PCM Fatty Acids. 86
Table 33. Advantages and disadvantages of salt hydrates 87
Table 34. Advantages and disadvantages of low melting point metals. 88
Table 35. Advantages and disadvantages of eutectics. 88
Table 36. Benefits and drawbacks of PCMs in TIMs. 91
Table 37. PCM Selection Criteria and Considerations for Space Systems. 94
Table 38. PCM selection criteria and considerations for space systems. 95
Table 39. Liquid Metal Challenges. 105
Table 40. Copper Sintering Technical Challenges. 115
Table 41. Technology Readiness Level (TRL) for Carbon Materials in Thermal Management 120
Table 42. Challenges with CNT-TIMs. 121
Table 43. Market players in CNT-TIMs. 122
Table 44. Properties of CNTs and comparable materials. 123
Table 45. Typical properties of SWCNT and MWCNT. 125
Table 46. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive. 127
Table 47. Thermal conductivity of CNT-based polymer composites. 129
Table 48. Comparative properties of BNNTs and CNTs. 130
Table 49. Properties of graphene, properties of competing materials, applications thereof. 132
Table 50. Graphene Heat Spreaders Performance. 136
Table 51. Comparison of Conventional and Graphene-Enhanced Thermal Pads. 137
Table 52. Advantages of Graphene in Thermal Interface Materials 137
Table 53. Properties of nanodiamonds. 139
Table 54. Comparison between Natural and Synthetic Graphite. 140
Table 55. Thermal Conductivity Comparison of Graphite TIMs. 141
Table 56. Classification of natural graphite with its characteristics. 142
Table 57. Characteristics of synthetic graphite. 146
Table 58. Thermal Conductivity Comparison of Graphite TIMs. 150
Table 59. Properties of hexagonal boron nitride (h-BN). 153
Table 60. Comparison of self-healing systems. 163
Table 61. Types of self-healing coatings and materials. 164
Table 62. Comparative properties of self-healing materials. 165
Table 63. Challenges for Dispensing TIM. 165
Table 64. Thermal Management Application Areas in Consumer Electronics. 169
Table 65. Thermal Management Differences: 4G vs 5G Smartphones. 170
Table 66. Trends in Smartphone Thermal Materials. 171
Table 67. Thermal Management approaches in commercial Smartphones. 173
Table 68. Global market in consumer electronics 2022-2037, by TIM type (millions USD). 177
Table 69. Material Options and Market Comparison. 181
Table 70. TIM Filler Comparison and Adoption. 183
Table 71. Thermal Conductivity Comparison of Suppliers for EV Batteries. 183
Table 72. TIM Pricing by Supplier. 184
Table 73. Thermal Conductivity Comparison of TIM1s. 194
Table 74. Global market in electric vehicles 2022-2037, by TIM type (millions USD). 198
Table 75. Types of TIMs in Data Centers. 200
Table 76. Area of TIM per Switch. 203
Table 77. Leaf and Spine Switch TIM Areas. 204
Table 78. Novel TIM Technologies in Data Centers. 204
Table 79. Emerging Trends in TIM Materials for AI Servers. 206
Table 80. Applications of TIM Materials in AI Servers with Technology Readiness Levels (TRL). 209
Table 81. Companies Utilizing and Providing TIM Materials for AI Servers 212
Table 82. TIM Trends in Data Centers. 217
Table 83. TIM Area Forecast in Server Boards: 2022-2037 (m2). 218
Table 84. Global market in data centers 2022-2037, by TIM type (millions USD). 219
Table 85. Global market in advanced semiconductor packaging 2022-2037, by TIM type (millions USD). 228
Table 86. Autonomous Vehicle Sensor Suite TIM Requirements. 231
Table 87. TIM Players in ADAS. 232
Table 88. TIM Players in ADAS. 233
Table 89. Die Attach for ADAS Sensors. 242
Table 90. Die Attach Area Forecast for Key Components Within ADAS Sensors: 2022-2037 (m2). 242
Table 91. TIM Players in ADAS 243
Table 92. Global market in ADAS sensors 2022-2037, by TIM type (millions USD). 244
Table 93. Applications of TIMs in EMI Shielding for ADAS Radars. 248
Table 94. TIM Area Forecast for 5G Antennas by Station Size: 2022-2037 (m2). 254
Table 95. TIM Area Forecast for 5G Antennas by Station Frequency: 2022-2037 (m2). 254
Table 96. TIMS in BBU. 255
Table 97. 5G BBY models. 257
Table 98. TIM Area Forecast for 5G BBU: 2022-2037 (m2). 257
Table 99. Power Consumption Forecast for 5G: 2022-2037 (GW). 259
Table 100. TIM Area Forecast for Power Supplies: 2022-2037 (m2). 259
Table 101. TIM market players in 5G. 260
Table 102. Global market in 5G 2022-2037, by TIM type (millions USD). 261
Table 103. Market Drivers for TIMS in aerospace and defense. 262
Table 104. Applications for TIMS in aerospace and defense. 262
Table 105. Temperature range of space subsystems and passive cooling approaches. 263
Table 106. TIMs for space satellites - challenges and considerations. 267
Table 107. Global Market for TIMs in aerospace and defense 2022-2037, by TIM Type (Millions USD). 270
Table 108. Market Drivers for TIMs in industrial electronics. 271
Table 109. Applications for TIMs in industrial electronics. 272
Table 110. Global Market 2022-2037, by TIM Type in Industrial Electronics (Millions USD). 273
Table 111. Market Drivers for TIMs in renewable energy. 274
Table 112. Applications for TIMs in renewable energy. 275
Table 113. Global Market for TIMs in Renewable Energy 2022-2037 (Millions USD). 276
Table 114. Market Drivers for TIMs in medical electronics. 278
Table 115. Applications for TIMs in medical electronics. 278
Table 116. Global Market 2022-2037 for TIMs in Medical Electronics (Millions USD). 279
List of Figures
Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material. 22
Figure 2. Schematic of thermal interface materials used in a flip chip package. 23
Figure 3. Thermal grease. 24
Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module. 24
Figure 5. Supply Chain for TIMs. 36
Figure 6. Commercial thermal paste products. 61
Figure 7. Application of thermal silicone grease. 62
Figure 8. A range of thermal grease products. 62
Figure 9. SWOT analysis for thermal greases and pastes. 65
Figure 10. Thermal Pad. 66
Figure 11. SWOT analysis for thermal gap pads. 69
Figure 12. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module. 70
Figure 13. SWOT analysis for thermal gap fillers. 72
Figure 14. SWOT analysis for Potting compounds/encapsulants. 76
Figure 15. Thermal adhesive products. 77
Figure 16. SWOT analysis for TIM adhesives tapes. 80
Figure 17. Phase-change TIM products. 81
Figure 18. PCM mode of operation. 83
Figure 19. Classification of PCMs. 83
Figure 20. Phase-change materials in their original states. 84
Figure 21. Thermal energy storage materials. 90
Figure 22. Phase Change Material transient behaviour. 90
Figure 23. PCM TIMs. 92
Figure 24. Phase Change Material - die cut pads ready for assembly. 92
Figure 25. SWOT analysis for phase change materials. 96
Figure 26. Typical IC package construction identifying TIM1 and TIM2 99
Figure 27. Liquid metal TIM product. 104
Figure 28. Pre-mixed SLH. 106
Figure 29. HLM paste and Liquid Metal Before and After Thermal Cycling. 106
Figure 30. SLH with Solid Solder Preform. 107
Figure 31. Automated process for SLH with solid solder preforms and liquid metal. 107
Figure 32. SWOT analysis for metal-based TIMs. 119
Figure 33. Schematic of single-walled carbon nanotube. 125
Figure 34. Types of single-walled carbon nanotubes. 127
Figure 35. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment. 129
Figure 36. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red. 130
Figure 37. Graphene layer structure schematic. 131
Figure 38. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG. 131
Figure 39. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene. 133
Figure 40. Graphene Thermal Management Applications Roadmap. 134
Figure 41. Flake graphite. 144
Figure 42. Applications of flake graphite. 145
Figure 43. Graphite-based TIM products. 148
Figure 44. Structure of hexagonal boron nitride. 152
Figure 45. SWOT analysis for carbon-based TIMs. 154
Figure 46. Classification of metamaterials based on functionalities. 155
Figure 47. Electromagnetic metamaterial. 156
Figure 48. Schematic of Electromagnetic Band Gap (EBG) structure. 157
Figure 49. Schematic of chiral metamaterials. 158
Figure 50. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer. 160
Figure 51. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials. Red and blue colours indicate chemical species which react (purple) to heal damage. 161
Figure 52. Stages of self-healing mechanism. 161
Figure 53. Self-healing mechanism in vascular self-healing systems. 162
Figure 54. Schematic of TIM operation in electronic devices. 170
Figure 55. Schematic of Thermal Management Materials in smartphone. 173
Figure 56. Wearable technology inventions. 176
Figure 57. Global market in consumer electronics 2022-2037, by TIM type (millions USD). 178
Figure 58. Application of thermal interface materials in automobiles. 179
Figure 59. EV battery components including TIMs. 186
Figure 60. Battery pack with a cell-to-pack design and prismatic cells. 187
Figure 61. Cell-to-chassis battery pack. 189
Figure 62. TIMS in EV charging station. 197
Figure 63. Global market in electric vehicles 2022-2037, by TIM type (millions USD). 199
Figure 64. Image of data center layout. 201
Figure 65. Application of TIMs in line card. 202
Figure 66. Global market in data centers 2022-2037, by TIM type (millions USD). 220
Figure 67. Global market in advanced semiconductor packaging 2022-2037, by TIM type (millions USD). 229
Figure 68. ADAS radar unit incorporating TIMs. 235
Figure 69. Global market in ADAS sensors 2022-2037, by TIM type (millions USD). 245
Figure 70. Coolzorb 5G. 247
Figure 71. TIMs in Base Band Unit (BBU). 256
Figure 72. Global market in 5G 2022-2037, by TIM type (millions USD). 261
Figure 73. Global Market for TIMs in aerospace and defense 2022-2037, by TIM Type (Millions USD). 271
Figure 74. Global Market 2022-2037, by TIM Type in Industrial Electronics (Millions USD). 274
Figure 75. Global Market for TIMs in Renewable Energy 2022-2037 (Millions USD). 277
Figure 76. Global Market 2022-2037 for TIMs in Medical Electronics (Millions USD). 280
Figure 77. Boron Nitride Nanotubes products. 291
Figure 78. Transtherm® PCMs. 292
Figure 79. Carbice carbon nanotubes. 295
Figure 80. Internal structure of carbon nanotube adhesive sheet. 311
Figure 81. Carbon nanotube adhesive sheet. 311
Figure 82. HI-FLOW Phase Change Materials. 318
Figure 83. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface. 330
Figure 84. Parker Chomerics THERM-A-GAP GEL. 343
Figure 85. Metamaterial structure used to control thermal emission. 344
Figure 86. Shinko Carbon Nanotube TIM product. 353
Figure 87. The Sixth Element graphene products. 357
Figure 88. Thermal conductive graphene film. 358
Figure 89. VB Series of TIMS from Zeon. 364
提及公司
常見問題
這份報告可以先索取樣本嗎？
可以。建議購買前先申請樣本，提出申請後約 2 個工作天內提供，您可以先確認內容涵蓋範圍是否符合需求。
報告價格如何計算？
報告以美元標價，台幣報價依當日匯率換算並加計 5% 營業稅。不同授權版本（單人／多人／企業全站）價格不同，量子訊息會評估您的使用情境後提供最優惠報價。
下單後多久交付？如何付款？
一般 3–7 個工作天交付，實際依出版商狀況於下單前確認。收到報告確認無誤後開立台幣發票，30 天內電匯付款即可。
量子訊息有限公司為 Future Markets 在台灣的授權代理，提供報告購買、樣本申請與授權諮詢。電話 +886 2 7751 5192 ・ 聯絡我們