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Data Center Direct-to-chip Cooling Market by Type (Single Phase, Two Phase), Coolant Type (Water-Glycol-based Coolants, Dielectric Fluids, Refrigerants), End User (Hyperscale Data Centers, Colocation Providers, Enterprises), and Region - Global Forecast to 2032

出版商 MarketsandMarkets產業別 Chemicals & Materials出版日期 2026-04-28頁數 259報告編號 CH10476

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報告摘要

The data center direct-to-chip cooling market is projected to grow from USD 3.33 billion in 2026 to USD 17.31 billion by 2032, at a CAGR of 26.5% over the forecast period. The global data center direct-to-chip cooling market is also being driven by the increasing need for thermal precision and component-level heat management in advanced computing systems. The compact design of modern processors, together with their increased processing power, results in heat generation at specific points, which prevents traditional room-sized or rack-sized cooling systems from achieving constant temperature control. Direct-to-chip cooling addresses this challenge by delivering coolant directly to heat-generating components, allowing for better temperature control while reducing thermal hotspots that adversely affect performance and hardware lifespan. Data center operators are adopting advanced cooling systems that provide dependable temperature control because their business operations require them to minimize downtime and maintain continuous service. The expansion of edge computing and latency-sensitive applications is further contributing to demand, as smaller and distributed data centers require efficient cooling solutions that can operate within limited space and infrastructure constraints. The combination of these two factors, together with the current need for higher processing efficiency and system reliability, is driving data centers worldwide to implement direct-to-chip cooling solutions. "By type, the single phase segment is estimated to hold the largest share, in terms of value." The data center direct-to-chip cooling market will see its largest share from single-phase systems because they have become widely used, proven reliable, and work well with current data center systems. Single-phase cooling systems are currently the most commercially mature and widely deployed solutions, making them the preferred choice for both hyperscale operators and enterprise data centers transitioning toward liquid cooling. The adoption rate of these products has increased because their design enables simpler installation and easier maintenance, and their components do not require phase changes to function. The systems permit operators to scale their deployments because they can be integrated into existing server architectures and facility designs without major design changes. Their market dominance is further strengthened by standardized components, existing supply chains, and data center engineers who have experience with these products. Single-phase systems now provide computing power, except that they only use basic operational needs, while their single-phase systems provide the basic operational requirements that data centers need to operate their systems. "By coolant type, the water-glycol-based coolants segment is estimated to hold the largest share, in terms of value." The water glycol-based coolants segment is estimated to hold the largest share, in terms of value, in the data center direct-to-chip cooling market due to its widespread industry acceptance, cost-effectiveness, and strong operational reliability across diverse data center environments. The existing use of these coolants in traditional liquid cooling and HVAC systems establishes them as a safe option that operators can trust when they switch to direct-to-chip cooling, leading to rapid adoption in operations. Water glycol mixtures deliver optimal thermal conductivity together with system protection, resulting in benefits that include corrosion resistance, freeze protection, and performance stability across different operating conditions. This makes them suitable for large data center deployments that require both stable operations and dependable performance over extended periods. The product's handling simplicity, existing supply chain networks, and compatibility with current system infrastructure all contribute to reduced implementation challenges, which lower total expenses and enhance their market leadership position. Data centers that need expandable cooling systems that have already proven their effectiveness will encourage operators to select coolant solutions that deliver both performance benefits and operational knowledge, resulting in water glycol coolants maintaining their position as the market leader during the forecast period. "By end user, the hyperscale segment is estimated to hold the largest share, in terms of value." The hyperscale segment is estimated to hold the largest share, in terms of value, in the data center direct to chip cooling market due to the massive scale of investments and the continuous expansion of large cloud and technology companies operating globally. Hyperscale data center operators deploy thousands of high-performance servers within a single facility, producing extreme heat levels that require advanced direct to chip cooling systems for efficient heat management. These operators are at the forefront of adopting liquid cooling technologies as they prioritize performance optimization, energy efficiency, and long-term cost savings at scale. Hyperscale companies possess sufficient financial resources to make substantial investments in next-generation cooling systems, which they will implement in their upcoming facilities instead of utilizing gradual system enhancements. The growing need for cloud computing, artificial intelligence, machine learning, and data-intensive applications has resulted in the expansion of hyperscale facilities, which drives up requirements for premium cooling systems. Hyperscale operators are implementing more efficient cooling technologies to lower energy consumption and enhance their sustainability performance, making direct to chip solutions beneficial. The hyperscale segment reaches its highest market value during the forecast period because it combines extensive system deployments with significant financial investments and the use of cutting-edge technologies. Break-up of primary participants for the report: • By Company Type: Tier 1 – 20%, Tier 2 – 40%, and Tier 3 – 40% • By Designation: C-Level Executives– 10%, Directors– 70%, and Others – 20% • By Region: North America – 45%, Asia Pacific – 25%, Europe – 20%, Middle East & Africa – 5%, and South America – 5% Vertiv Group Corp. (US), Super Micro Computer, Inc. (US), Modine Manufacturing Company (US), DCX Liquid Cooling Systems (Poland), and Schneider Electric (France) are the key players in the data center direct-to-chip cooling market. These players have adopted various strategies, including agreements, joint ventures, and expansions, to increase their market share and business revenue. Research Coverage: The report defines, segments, and projects the size of the data center direct-to-chip cooling market by type, coolant type, end user, and region. It strategically profiles the key players and comprehensively analyzes their market share and core competencies. It also tracks and analyzes competitive developments, such as expansions, agreements, and acquisitions undertaken by them in the market. Reasons to Buy the Report: The report is expected to help market leaders/new entrants by providing the closest approximations of revenue for the data center direct-to-chip cooling market and its segments. This report is also expected to help stakeholders gain a deeper understanding of the market's competitive landscape, acquire valuable insights to enhance their business positions, and develop effective go-to-market strategies. It also enables stakeholders to understand the market's pulse and provides information on key market drivers, restraints, challenges, and opportunities. The report provides insights into the following pointers: • Analysis of critical drivers (Increasing Heat Density from AI & HPC Workloads, Superior Thermal Efficiency Compared to Air Cooling, Growing Demand for Energy-efficient Data Centers, Increasing Rack Power Density in Hyperscale Data Centers), restraints (High Initial Capital Investment, Complex Integration with Existing Infrastructure, Limited Standardization Across Vendors), opportunities (Rapid Growth of AI, Generative AI, and GPU-based Computing, Expansion of Edge Data Centers with High Compute Density, Integration with Waste Heat Recovery Systems), and challenges (Skill Gap in Installation and Maintenance, Infrastructure Complexity and Space Constraints, Reliability and Long-term Maintenance Concerns) influencing the growth of the data center direct-to-chip cooling market • Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities in the data center direct-to-chip cooling market • Market Development: Comprehensive information about lucrative markets – the report analyzes the data center direct-to-chip cooling market across varied regions • Market Diversification: Exhaustive information about new products, various types, untapped geographies, recent developments, and investments in the data center direct-to-chip cooling market. • Competitive Assessment: In-depth assessment of market shares, growth strategies, and product offerings of leading players such as Vertiv Group Corp. (US), Super Micro Computer, Inc. (US), Modine Manufacturing Company (US), DCX Liquid Cooling Systems (Poland), Schneider Electric (France), and others are the key players in the data center direct-to-chip cooling market.
目錄 Table of Contents
1 INTRODUCTION 24 1.1 STUDY OBJECTIVES 24 1.2 MARKET DEFINITION 24 1.3 STUDY SCOPE 25 1.3.1 MARKETS COVERED AND REGIONAL SCOPE 25 1.3.2 INCLUSIONS AND EXCLUSIONS 25 1.3.3 YEARS CONSIDERED 26 1.4 CURRENCY CONSIDERED 26 1.5 UNIT CONSIDERED 26 1.6 LIMITATIONS 26 1.7 STAKEHOLDERS 26 2 EXECUTIVE SUMMARY 28 2.1 KEY INSIGHTS AND MARKET HIGHLIGHTS 28 2.2 KEY MARKET PARTICIPANTS: SHARE INSIGHTS AND STRATEGIC DEVELOPMENTS 29 2.3 DISRUPTIVE TRENDS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 30 2.4 HIGH-GROWTH SEGMENTS 30 2.5 REGIONAL SNAPSHOT: MARKET SIZE, GROWTH RATE, AND FORECAST 31 3 PREMIUM INSIGHTS 32 3.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN DATA CENTER DIRECT-TO- CHIP COOLING MARKET 32 3.2 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER 32 3.3 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE 33 3.4 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION 33 3.5 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY 34 4 MARKET OVERVIEW 35 4.1 INTRODUCTION 35 4.2 MARKET DYNAMICS 35 4.2.1 DRIVERS 36 4.2.1.1 Rising AI, HPC, and hyperscale workloads 36 4.2.1.2 Increasing rack power density 37 4.2.1.3 Energy efficiency and sustainability goals 38 4.2.2 RESTRAINTS 39 4.2.2.1 High initial capital investment 39 4.2.2.2 Integration complexity in existing data centers 39 4.2.2.3 Lack of standardization 40   4.2.3 OPPORTUNITIES 40 4.2.3.1 Expansion of edge and modular data centers 40 4.2.3.2 Innovation in coolant technologies and microfluidics 41 4.2.3.3 High-density computing and chip innovation 42 4.2.4 CHALLENGES 42 4.2.4.1 Leakage and reliability risks 42 4.2.4.2 Cooling of non-chip components 43 4.3 UNMET NEEDS AND WHITE SPACES 43 4.3.1 UNMET NEEDS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 43 4.3.2 WHITE SPACE OPPORTUNITIES 44 4.4 INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES 45 4.4.1 INTERCONNECTED MARKETS 45 4.4.2 CROSS SECTOR OPPORTUNITIES 45 4.5 EMERGING BUSINESS MODELS AND ECOSYSTEM SHIFTS 46 4.5.1 EMERGING BUSINESS MODELS 46 4.5.2 ECOSYSTEM SHIFTS 47 4.6 STRATEGIC MOVES BY TIER 1/2/3 PLAYERS 48 4.6.1 KEY MOVES AND STRATEGIC FOCUS 48 5 INDUSTRY TRENDS 49 5.1 PORTER’S FIVE FORCES ANALYSIS 49 5.1.1 THREAT OF NEW ENTRANTS 50 5.1.2 THREAT OF SUBSTITUTES 51 5.1.3 BARGAINING POWER OF SUPPLIERS 51 5.1.4 BARGAINING POWER OF BUYERS 52 5.1.5 INTENSITY OF COMPETITIVE RIVALRY 52 5.2 MACROECONOMICS INDICATORS 53 5.2.1 INTRODUCTION 53 5.2.2 GDP TRENDS AND FORECAST 53 5.2.3 DATA CENTER INDUSTRY 55 5.2.4 TRENDS IN GLOBAL DATA CENTER COOLING INDUSTRY 55 5.2.5 MANUFACTURING INDUSTRY 55 5.2.6 TRENDS IN GLOBAL HYPERSCALE AND AI DATA CENTER INDUSTRY 56 5.3 VALUE CHAIN ANALYSIS 56 5.4 ECOSYSTEM ANALYSIS 58 5.5 ENERGY SUSTAINABILITY FOR DATA CENTERS 59 5.5.1 SUSTAINABLE DATA CENTERS USING DIRECT-TO-CHIP COOLING 59 5.5.2 ISSUES IN DEVELOPING COUNTRIES 60 5.6 KEY CONFERENCES AND EVENTS, 2026–2027 60 5.7 TRENDS AND DISRUPTIONS IMPACTING CUSTOMER BUSINESS 61 5.8 INVESTMENT AND FUNDING SCENARIO 61   5.9 CASE STUDY ANALYSIS 62 5.9.1 CASE STUDY 1: PERFORMANCE EVALUATION OF TWO-PHASE DIRECT-TO-CHIP LIQUID COOLING COMBINED WITH AIR COOLING FOR DATA CENTERS 62 5.9.2 CASE STUDY 2: A PATH TO COMMISSIONING OF DIRECT-TO-CHIP LIQUID COOLING FOR HYPERSCALE DATA CENTERS USING EXPERIMENTAL AND CFD TECHNIQUES 63 6 KEY TECHNOLOGICAL ADVANCEMENTS, AI-DRIVEN IMPACT, AND FUTURE APPLICATIONS 64 6.1 KEY EMERGING TECHNOLOGIES 64 6.1.1 TWO-PHASE DIRECT-TO-CHIP COOLING 64 6.1.2 ADVANCED COLD PLATE DESIGN 64 6.2 ADJACENT TECHNOLOGIES 65 6.2.1 MICROCHANNEL LIQUID COOLING 65 6.2.2 MICROCONVECTIVE LIQUID COOLING 65 6.3 FUTURE APPLICATIONS 65 6.3.1 AI-OPTIMIZED HYPERSCALE DATA CENTERS 66 6.3.2 EDGE & DISTRIBUTED DATA CENTERS 66 6.3.3 HYBRID COOLING IN EXISTING DATA CENTERS 67 6.3.4 HIGH-PERFORMANCE COMPUTING (HPC) & AI CLUSTERS 68 6.3.5 SUSTAINABLE & ENERGY-EFFICIENT DATA CENTERS 68 6.4 IMPACT OF AI/GEN AI ON DATA CENTER DIRECT-TO-CHIP COOLING MARKET 69 6.4.1 TOP USE CASES AND MARKET POTENTIAL 70 6.4.2 BEST MARKET PRACTICES 70 6.4.3 CASE STUDIES OF AI IMPLEMENTATION IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 71 6.4.4 READINESS OF COMPANIES TO ADOPT GENERATIVE AI IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 71 6.5 SUCCESS STORIES AND REAL-WORLD APPLICATIONS 71 6.5.1 VERTIV: AI-READY LIQUID COOLING INFRASTRUCTURE DEPLOYMENT 72 6.5.2 SCHNEIDER ELECTRIC: END-TO-END LIQUID COOLING ECOSYSTEM 72 6.5.3 COMPUDYNAMICS: COMPLEX LIQUID COOLING FOR HIGH DENSITY RACKS AT A HYPERSCALE DATA CENTER IN NC 72 7 SUSTAINABILITY AND REGULATORY LANDSCAPE 73 7.1 REGIONAL REGULATIONS AND COMPLIANCE 73 7.1.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 73 7.1.2 US 75 7.1.3 EUROPE 76 7.1.4 CHINA 76 7.1.5 JAPAN 77   7.1.6 INDIA 77 7.1.7 SINGAPORE 78 7.1.8 OPEN COMPUTE PROJECT (OCP): A STANDARD FOR DATA CENTER BUILDINGS 79 7.2 SUSTAINABILITY INITIATIVES 79 7.2.1 CARBON IMPACT AND ECO APPLICATIONS OF PROPYLENE OXIDE 79 7.3 SUSTAINABILITY IMPACT AND REGULATORY POLICY INITIATIVES 80 7.4 CERTIFICATIONS, LABELING, AND ECO STANDARDS 82 8 CUSTOMER LANDSCAPE & BUYER BEHAVIOR 84 8.1 DECISION-MAKING PROCESS 84 8.2 KEY STAKEHOLDERS AND BUYING CRITERIA 87 8.2.1 KEY STAKEHOLDERS IN BUYING PROCESS 87 8.2.2 BUYING CRITERIA 88 8.3 ADOPTION BARRIERS & INTERNAL CHALLENGES 89 8.4 UNMET NEEDS IN VARIOUS END-USE INDUSTRIES 91 8.5 MARKET PROFITABILITY 91 8.5.1 REVENUE POTENTIAL 92 8.5.2 COST DYNAMICS 92 8.5.3 MARGIN OPPORTUNITIES IN KEY APPLICATIONS 92 9 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COOLANT TYPE 94 9.1 INTRODUCTION 94 9.2 WATER-GLYCOL-BASED COOLANTS 94 9.2.1 INCREASING DEMAND FOR SCALABLE AND EASY-TO-MAINTAIN COOLING SOLUTIONS TO INCREASE DEMAND 94 9.3 DIELECTRIC FLUID 95 9.3.1 RISING NEED FOR SAFE AND HIGH-PERFORMANCE COOLING IN ADVANCED DATA CENTERS TO BOOST MARKET 95 9.4 REFRIGERANTS 95 9.4.1 GROWING FOCUS ON ADVANCED COOLING TECHNOLOGIES FOR HIGH-DENSITY WORKLOADS TO INCREASE DEMAND 95 10 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE 96 10.1 INTRODUCTION 97 10.2 SINGLE-PHASE 98 10.2.1 GROWING PREFERENCE FOR SIMPLER AND COST-EFFECTIVE LIQUID COOLING SOLUTIONS TO BOOST MARKET GROWTH 98 10.3 TWO-PHASE 99 10.3.1 RISING NEED FOR HIGH-EFFICIENCY COOLING IN HIGH-DENSITY COMPUTING ENVIRONMENTS TO SUPPORT MARKET EXPANSION 99   11 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER 101 11.1 INTRODUCTION 102 11.2 HYPERSCALE DATA CENTERS 103 11.2.1 RAPID EXPANSION OF LARGE-SCALE CLOUD INFRASTRUCTURE AND HIGH-DENSITY COMPUTING TO FUEL MARKET GROWTH 103 11.3 COLOCATION PROVIDERS 104 11.3.1 RISING DEMAND FOR SCALABLE AND HIGH-PERFORMANCE SHARED DATA CENTER FACILITIES TO SUPPORT MARKET GROWTH 104 11.4 ENTERPRISES 105 11.4.1 INCREASING DIGITAL TRANSFORMATION AND ADOPTION OF HIGH-PERFORMANCE IT INFRASTRUCTURE TO INCREASE DEMAND 105 12 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION 107 12.1 INTRODUCTION 108 12.2 NORTH AMERICA 109 12.3 US 112 12.3.1 RAPID AI INFRASTRUCTURE EXPANSION TO SUPPORT MARKET GROWTH 112 12.4 CANADA 113 12.4.1 SUSTAINABLE DATA CENTER DEVELOPMENT AND COLD CLIMATE ADVANTAGE DRIVING LIQUID COOLING ADOPTION 113 12.5 MEXICO 114 12.5.1 RISING HYPERSCALE INVESTMENTS AND WATER-EFFICIENT COOLING REQUIREMENTS TO BOOST MARKET 114 12.6 ASIA PACIFIC 115 12.7 CHINA 118 12.7.1 RAPID AI INFRASTRUCTURE EXPANSION AND DOMESTIC SEMICONDUCTOR ECOSYSTEM INTEGRATION TO DRIVE MARKET 118 12.8 JAPAN 120 12.8.1 HIGH DENSITY URBAN DATA CENTER DEPLOYMENTS AND ENERGY EFFICIENCY MANDATES TO DRIVE DEMAND 120 12.9 INDIA 121 12.9.1 EXTREME CLIMATIC CONDITIONS AND LARGE-SCALE HYPERSCALE INVESTMENTS TO INCREASE DEMAND 121 12.10 SOUTH KOREA 123 12.10.1 HYPERSCALE AI DATA CENTER INVESTMENTS AND SEMICONDUCTOR-DRIVEN COMPUTE INTENSITY TO SUPPORT MARKET GROWTH 123 12.11 MALAYSIA 124 12.11.1 RISING HYPERSCALE INVESTMENTS AND TROPICAL CLIMATE-DRIVEN COOLING REQUIREMENTS TO BOOST MARKET 124 12.12 SINGAPORE 125 12.12.1 HYPERSCALE EXPANSION AND STRONG SUSTAINABILITY MANDATES TO FUEL ADOPTION 125 12.13 AUSTRALIA 126 12.13.1 STRONG AI INFRASTRUCTURE GROWTH AND STRICT SUSTAINABILITY REGULATIONS TO SUPPORT MARKET GROWTH 126 12.14 REST OF ASIA PACIFIC 128 12.15 EUROPE 129 12.16 GERMANY 132 12.16.1 STRINGENT ENERGY EFFICIENCY REGULATIONS AND WASTE HEAT REUSE MANDATES DRIVING ADVANCED COOLING ADOPTION 132 12.17 FRANCE 133 12.17.1 STRONG HYPERSCALE INVESTMENTS AND SUSTAINABILITY-DRIVEN DATA CENTER EXPANSION TO BOOST MARKET EXPANSION 133 12.18 UK 134 12.18.1 AI INFRASTRUCTURE DEVELOPMENT AND GOVERNMENT SUPPORT FOR ENERGY-EFFICIENT DATA CENTERS TO INCREASE ADOPTION 134 12.19 REST OF EUROPE 136 12.20 MIDDLE EAST & AFRICA 137 12.20.1 GCC COUNTRIES 139 12.21 SAUDI ARABIA 140 12.21.1 AI INFRASTRUCTURE INVESTMENTS AND EXTREME CLIMATE DRIVING ADOPTION OF ADVANCED COOLING TECHNOLOGIES 140 12.22 REST OF GCC COUNTRIES 141 12.22.1 GROWING DIGITAL INFRASTRUCTURE DEVELOPMENT AND RISING NEED FOR ENERGY-EFFICIENT COOLING TO BOOST MARKET 141 12.23 SOUTH AFRICA 143 12.23.1 RISING HYPERSCALE INVESTMENTS, AI INFRASTRUCTURE EXPANSION, AND FOCUS ON ENERGY AND WATER-EFFICIENT COOLING TO BOOST MARKET 143 12.24 REST OF MIDDLE EAST & AFRICA 144 12.25 SOUTH AMERICA 145 12.26 BRAZIL 147 12.26.1 LARGE-SCALE HYPERSCALE INVESTMENTS AND RENEWABLE ENERGY-DRIVEN DATA CENTER EXPANSION TO BOOST MARKET 147 12.27 REST OF SOUTH AMERICA 148 13 COMPETITIVE LANDSCAPE 150 13.1 INTRODUCTION 150 13.2 KEY PLAYERS' STRATEGIES/RIGHT TO WIN 150 13.3 REVENUE ANALYSIS 152 13.4 MARKET SHARE ANALYSIS, 2025 153 13.4.1 RANKING OF KEY MARKET PLAYERS, 2025 153 13.4.2 MARKET SHARE ANALYSIS, 2025 153 13.4.2.1 Vertiv Group Corp. (US) 154 13.4.2.2 Super Micro Computer, Inc. (US) 154 13.4.2.3 Modine Manufacturing Company (US) 155 13.4.2.4 DCX Liquid Cooling Systems (Poland) 155 13.4.2.5 Schneider Electric (France) 155   13.5 BRAND/PRODUCT COMPARISON 156 13.5.1 VERTIV 156 13.5.2 SUPERMICRO 156 13.5.3 MODINE 157 13.5.4 DCX 157 13.5.5 SCHNEIDER ELECTRIC 157 13.6 COMPANY VALUATION AND FINANCIAL METRICS 157 13.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2025 159 13.7.1 STARS 159 13.7.2 EMERGING LEADERS 159 13.7.3 PERVASIVE PLAYERS 160 13.7.4 PARTICIPANTS 160 13.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2025 161 13.7.5.1 Company footprint 161 13.7.6 REGION FOOTPRINT 162 13.7.7 TYPE FOOTPRINT 163 13.7.8 COOLANT TYPE FOOTPRINT 164 13.7.9 END USER FOOTPRINT 165 13.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024 166 13.8.1 PROGRESSIVE COMPANIES 166 13.8.2 RESPONSIVE COMPANIES 166 13.8.3 DYNAMIC COMPANIES 166 13.8.4 STARTING BLOCKS 166 13.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2025 168 13.8.5.1 Detailed list of key startups/SMEs 168 13.8.5.2 Competitive benchmarking of key startups/SMEs 168 13.9 COMPETITIVE SCENARIO 169 13.9.1 PRODUCT LAUNCHES 169 13.9.2 DEALS 170 13.9.3 EXPANSIONS 171 14 COMPANY PROFILES 173 14.1 MAJOR PLAYERS 173 14.1.1 VERTIV GROUP CORP. 173 14.1.1.1 Business overview 173 14.1.1.2 Products offered 174 14.1.1.3 Recent developments 175 14.1.1.3.1 Product launches 175 14.1.1.3.2 Deals 176 14.1.1.3.3 Expansions 177   14.1.1.4 MnM view 178 14.1.1.4.1 Key strengths 178 14.1.1.4.2 Strategic choices 178 14.1.1.4.3 Weaknesses and competitive threats 178 14.1.2 SUPER MICRO COMPUTER, INC. 179 14.1.2.1 Business overview 179 14.1.2.2 Products offered 180 14.1.2.3 Recent developments 181 14.1.2.3.1 Deals 181 14.1.2.3.2 Expansions 181 14.1.2.4 MnM view 182 14.1.2.4.1 Key strengths 182 14.1.2.4.2 Strategic choices 182 14.1.2.4.3 Weaknesses and competitive threats 183 14.1.3 MODINE MANUFACTURING COMPANY 184 14.1.3.1 Business overview 184 14.1.3.2 Products offered 185 14.1.3.3 Recent developments 186 14.1.3.3.1 Product launches 186 14.1.3.3.2 Deals 186 14.1.3.3.3 Expansions 187 14.1.4 DCX LIQUID COOLING SYSTEMS 188 14.1.4.1 Business overview 188 14.1.4.2 Products offered 188 14.1.4.3 Recent developments 189 14.1.4.3.1 Product launches 189 14.1.4.4 MnM view 189 14.1.4.4.1 Key strengths 189 14.1.4.4.2 Strategic choices 190 14.1.4.4.3 Weaknesses and competitive threats 190 14.1.5 SCHNEIDER ELECTRIC 191 14.1.5.1 Business overview 191 14.1.5.2 Products offered 192 14.1.5.3 Recent developments 193 14.1.5.3.1 Deals 193 14.1.5.3.2 Expansions 194 14.1.5.4 MnM view 194 14.1.5.4.1 Key strengths 194 14.1.5.4.2 Strategic choices 195 14.1.5.4.3 Weaknesses and competitive threats 195   14.1.6 FLEX LTD. 196 14.1.6.1 Business overview 196 14.1.6.2 Products offered 197 14.1.6.3 Recent developments 198 14.1.6.3.1 Deals 198 14.1.7 COOLIT SYSTEMS 199 14.1.7.1 Business overview 199 14.1.7.2 Products offered 199 14.1.7.3 Recent developments 200 14.1.7.3.1 Product launches 200 14.1.7.3.2 Deals 201 14.1.7.3.3 Expansions 202 14.1.8 NVENT 203 14.1.8.1 Business overview 203 14.1.8.2 Products offered 204 14.1.8.3 Recent developments 205 14.1.8.3.1 Deals 205 14.1.8.3.2 Expansions 205 14.1.9 KAORI HEAT TREATMENT CO., LTD. 206 14.1.9.1 Business overview 206 14.1.9.2 Products offered 207 14.1.10 ZUTACORE, INC. 208 14.1.10.1 Business overview 208 14.1.10.2 Products offered 208 14.1.10.3 Recent developments 208 14.1.10.3.1 Product launches 208 14.1.10.3.2 Deals 209 14.1.11 ICEOTOPE PRECISION LIQUID COOLING 211 14.1.11.1 Business overview 211 14.1.11.2 Products offered 211 14.1.11.3 Recent developments 212 14.1.11.3.1 Product launches 212 14.1.11.3.2 Deals 213 14.1.11.3.3 Expansions 214 14.1.12 BOYD 215 14.1.12.1 Business overview 215 14.1.12.2 Products offered 215 14.1.13 TAISOL ELECTRONICS CO., LTD. 216 14.1.13.1 Business overview 216 14.1.13.2 Products offered 217 14.1.14 WIWYNN CORPORATION 218 14.1.14.1 Business overview 218 14.1.14.2 Products offered 218 14.1.15 INSPUR CO., LTD. 219 14.1.15.1 Business overview 219 14.1.15.2 Products offered 220 14.1.16 LENOVO 221 14.1.16.1 Business overview 221 14.1.16.2 Products offered 222 14.1.16.3 Recent developments 224 14.1.16.3.1 Product launches 224 14.1.16.3.2 Deals 225 14.1.17 ACCELSIUS LLC 226 14.1.17.1 Business overview 226 14.1.17.2 Recent developments 227 14.1.17.2.1 Product launches 227 14.1.18 STULZ GMBH 228 14.1.18.1 Business overview 228 14.1.18.2 Products offered 228 14.1.18.3 Recent developments 229 14.1.18.3.1 Product launches 229 14.1.19 RITTAL GMBH & CO. KG (FRIEDHELM LOH GROUP) 230 14.1.19.1 Business overview 230 14.1.19.2 Products offered 230 14.1.19.3 Recent developments 231 14.1.19.3.1 Product launches 231 14.1.19.3.2 Deals 231 14.1.20 DELTA POWER SOLUTIONS 232 14.1.20.1 Business overview 232 14.1.20.2 Products offered 233 14.1.20.3 Recent developments 233 14.1.20.3.1 Deals 233 14.1.21 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES) 234 14.1.21.1 Business overview 234 14.1.21.2 Products/Solutions/Services offered 234 14.1.21.3 Recent developments 235 14.1.21.3.1 Product launches 235 14.1.21.3.2 Deals 235 14.1.21.3.3 Expansions 236 14.1.21.3.4 Other developments 236 14.1.22 CHILLDYNE, INC. 237 14.1.22.1 Business overview 237 14.1.22.2 Products/Solutions/Services offered 237 14.1.22.3 Recent developments 238 14.1.22.3.1 Product launches 238 14.1.22.3.2 Deals 239 14.1.23 MALICO INC. 240 14.1.23.1 Business overview 240 14.1.23.2 Products/Solutions/Services offered 240 14.2 OTHER PLAYERS 241 14.2.1 KOOLANCE, INC. 241 14.2.2 GIGA-BYTE TECHNOLOGY CO., LTD. 241 14.2.3 OPTICOOL TECHNOLOGIES 242 14.2.4 SEGUENTE INC. 242 14.2.5 COOLCENTRIC 243 15 RESEARCH METHODOLOGY 244 15.1 RESEARCH DATA 244 15.1.1 SECONDARY DATA 245 15.1.1.1 List of key secondary sources 245 15.1.1.2 Key data from secondary sources 245 15.1.2 PRIMARY DATA 246 15.1.2.1 Key data from primary sources 246 15.1.2.2 Key industry insights 247 15.1.2.3 List of primary participants 247 15.1.2.4 Breakdown of primary interviews 247 15.2 MARKET SIZE ESTIMATION 248 15.2.1 BOTTOM-UP APPROACH 248 15.2.2 TOP-DOWN APPROACH 249 15.3 DEMAND-SIDE ANALYSIS 249 15.4 SUPPLY-SIDE ANALYSIS 250 15.4.1 CALCULATIONS FOR SUPPLY-SIDE ANALYSIS 250 15.5 GROWTH FORECAST 250 15.6 DATA TRIANGULATION 251 15.7 RESEARCH ASSUMPTIONS 252 15.8 RESEARCH LIMITATIONS 252 15.9 RISK ASSESSMENT 253 15.10 FACTOR ANALYSIS 253 16 APPENDIX 254 16.1 DISCUSSION GUIDE 254 16.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 256 16.3 CUSTOMIZATION OPTIONS 258 16.4 RELATED REPORTS 258
圖表清單 List of Tables & Figures
TABLE 1 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: IMPACT OF PORTER’S FIVE FORCES 50 TABLE 2 GDP PERCENTAGE CHANGE, BY KEY COUNTRIES, 2021–2029 53 TABLE 3 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: ROLES OF COMPANIES IN ECOSYSTEM 58 TABLE 4 DATA CENTER COOLING LIQUID MARKET: LIST OF CONFERENCES AND EVENTS, 2026–2027 60 TABLE 5 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: TOP USE CASES AND MARKET POTENTIAL 70 TABLE 6 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: BEST PRACTICES 70 TABLE 7 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: CASE STUDIES OF GEN AI IMPLEMENTATION 71 TABLE 8 NORTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 73 TABLE 9 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 74 TABLE 10 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 74 TABLE 11 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 75 TABLE 12 CERTIFICATIONS, LABELING, AND ECO STANDARDS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 82 TABLE 13 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY END USER (%) 87 TABLE 14 KEY BUYING CRITERIA, BY END USER 88 TABLE 15 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: UNMET NEEDS IN KEY END-USE INDUSTRIES 91 TABLE 16 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 97 TABLE 17 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 97 TABLE 18 SINGLE-PHASE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2021–2025 (USD MILLION) 98 TABLE 19 SINGLE-PHASE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2026–2032 (USD MILLION) 99 TABLE 20 TWO-PHASE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2021–2025 (USD MILLION) 100 TABLE 21 TWO-PHASE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2026–2032 (USD MILLION) 100 TABLE 22 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2021–2025 (USD MILLION) 102 TABLE 23 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2026–2032 (USD MILLION) 103 TABLE 24 HYPERSCALE DATA CENTERS: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2021–2025 (USD MILLION) 104 TABLE 25 HYPERSCALE DATA CENTERS: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2026–2032 (USD MILLION) 104 TABLE 26 COLOCATION PROVIDERS: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2021–2025 (USD MILLION) 105 TABLE 27 COLOCATION PROVIDERS: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2026–2032 (USD MILLION) 105 TABLE 28 ENTERPRISES: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2021–2025 (USD MILLION) 106 TABLE 29 ENTERPRISES: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2026–2032 (USD MILLION) 106 TABLE 30 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2021–2025 (USD MILLION) 109 TABLE 31 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2026–2032 (USD MILLION) 109 TABLE 32 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2021–2025 (USD MILLION) 110 TABLE 33 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2026–2032 (USD MILLION) 110 TABLE 34 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 111 TABLE 35 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 111 TABLE 36 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2021–2025 (USD MILLION) 111 TABLE 37 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2026–2032 (USD MILLION) 111 TABLE 38 US: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 112 TABLE 39 US: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 113 TABLE 40 CANADA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 114 TABLE 41 CANADA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 114 TABLE 42 MEXICO: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 115 TABLE 43 MEXICO: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 115 TABLE 44 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2021–2025 (USD MILLION) 117 TABLE 45 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2026–2032 (USD MILLION) 117 TABLE 46 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 117 TABLE 47 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 118 TABLE 48 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2021–2025 (USD MILLION) 118 TABLE 49 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2026–2032 (USD MILLION) 118 TABLE 50 CHINA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 119 TABLE 51 CHINA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 120 TABLE 52 JAPAN: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 121 TABLE 53 JAPAN: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 121 TABLE 54 INDIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 122 TABLE 55 INDIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 122 TABLE 56 SOUTH KOREA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 124 TABLE 57 SOUTH KOREA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 124 TABLE 58 MALAYSIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 125 TABLE 59 MALAYSIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 125 TABLE 60 SINGAPORE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 126 TABLE 61 SINGAPORE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 126 TABLE 62 AUSTRALIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 127 TABLE 63 AUSTRALIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 127 TABLE 64 REST OF ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 129 TABLE 65 REST OF ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 129 TABLE 66 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2021–2025 (USD MILLION) 130 TABLE 67 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2026–2032 (USD MILLION) 131 TABLE 68 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 131 TABLE 69 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 131 TABLE 70 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2021–2025 (USD MILLION) 131 TABLE 71 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2026–2032 (USD MILLION) 132 TABLE 72 GERMANY: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 133 TABLE 73 GERMANY: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 133 TABLE 74 FRANCE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 134 TABLE 75 FRANCE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 134 TABLE 76 UK: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 135 TABLE 77 UK: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 135 TABLE 78 REST OF EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 137 TABLE 79 REST OF EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 137 TABLE 80 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2021–2025 (USD MILLION) 138 TABLE 81 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2026–2032 (USD MILLION) 138 TABLE 82 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 138 TABLE 83 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 139 TABLE 84 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2021–2025 (USD MILLION) 139 TABLE 85 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2026–2032 (USD MILLION) 139 TABLE 86 SAUDI ARABIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 141 TABLE 87 SAUDI ARABIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 141 TABLE 88 REST OF GCC COUNTRIES: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 142 TABLE 89 REST OF GCC COUNTRIES: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 142 TABLE 90 SOUTH AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 143 TABLE 91 SOUTH AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 144 TABLE 92 REST OF MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 145 TABLE 93 REST OF MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 145 TABLE 94 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2021–2025 (USD MILLION) 146 TABLE 95 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2026–2032 (USD MILLION) 146 TABLE 96 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 146 TABLE 97 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 146 TABLE 98 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2021–2025 (USD MILLION) 147 TABLE 99 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2026–2032 (USD MILLION) 147 TABLE 100 BRAZIL: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 148 TABLE 101 BRAZIL: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 148 TABLE 102 REST OF SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 149 TABLE 103 REST OF SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 149 TABLE 104 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, 2021–2026 150 TABLE 105 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DEGREE OF COMPETITION, 2025 154 TABLE 106 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: REGION FOOTPRINT 162 TABLE 107 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: TYPE FOOTPRINT 163 TABLE 108 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: COOLANT TYPE FOOTPRINT 164 TABLE 109 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: END USER FOOTPRINT 165 TABLE 110 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DETAILED LIST OF KEY STARTUPS/SMES 168 TABLE 111 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES 168 TABLE 112 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: PRODUCT LAUNCHES, JANUARY 2021–MARCH 2026 169 TABLE 113 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DEALS, JANUARY 2021–MARCH 2026 170 TABLE 114 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: EXPANSIONS, JANUARY 2021–MARCH 2026 171 TABLE 115 VERTIV GROUP CORP.: COMPANY OVERVIEW 173 TABLE 116 VERTIV GROUP CORP.: PRODUCTS OFFERED 174 TABLE 117 VERTIV GROUP CORP.: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 175 TABLE 118 VERTIV GROUP CORP.: DEALS, JANUARY 2021-MARCH 2026 176 TABLE 119 VERTIV GROUP CORP: EXPANSIONS, JANUARY 2021-MARCH 2026 177 TABLE 120 SUPER MICRO COMPUTER, INC.: COMPANY OVERVIEW 179 TABLE 121 SUPER MICRO COMPUTER, INC.: PRODUCTS OFFERED 180 TABLE 122 SUPER MICRO COMPUTER, INC.: DEALS, JANUARY 2021-MARCH 2026 181 TABLE 123 SUPER MICRO COMPUTER, INC.: EXPANSIONS, JANUARY 2021-MARCH 2026 181 TABLE 124 MODINE MANUFACTURING COMPANY: COMPANY OVERVIEW 184 TABLE 125 MODINE MANUFACTURING COMPANY: PRODUCTS OFFERED 185 TABLE 126 MODINE MANUFACTURING COMPANY: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 186 TABLE 127 MODINE MANUFACTURING COMPANY: DEALS, JANUARY 2021-MARCH 2026 186 TABLE 128 MODINE MANUFACTURING COMPANY: EXPANSIONS, JANUARY 2021-MARCH 2026 187 TABLE 129 DCX LIQUID COOLING SYSTEMS: COMPANY OVERVIEW 188 TABLE 130 DCX LIQUID COOLING SYSTEMS: PRODUCTS OFFERED 188 TABLE 131 DCX LIQUID COOLING SYSTEMS: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 189 TABLE 132 SCHNEIDER ELECTRIC: COMPANY OVERVIEW 191 TABLE 133 SCHNEIDER ELECTRIC: PRODUCTS OFFERED 192 TABLE 134 SCHNEIDER ELECTRIC: DEALS, JANUARY 2021-MARCH 2026 193 TABLE 135 SCHNEIDER ELECTRIC: EXPANSIONS, JANUARY 2021-MARCH 2026 194 TABLE 136 FLEX LTD.: COMPANY OVERVIEW 196 TABLE 137 FLEX LTD.: PRODUCTS OFFERED 197 TABLE 138 FLEX LTD.: DEALS, JANUARY 2021-MARCH 2026 198 TABLE 139 COOLIT SYSTEMS: COMPANY OVERVIEW 199 TABLE 140 COOLIT SYSTEMS: PRODUCTS OFFERED 199 TABLE 141 COOLIT SYSTEMS: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 200 TABLE 142 COOLIT SYSTEMS: DEALS, JANUARY 2021-MARCH 2026 201 TABLE 143 COOLIT SYSTEMS: EXPANSIONS, JANUARY 2021-MARCH 2026 202 TABLE 144 NVENT: COMPANY OVERVIEW 203 TABLE 145 NVENT: PRODUCTS OFFERED 204 TABLE 146 NVENT: DEALS, JANUARY 2021-MARCH 2026 205 TABLE 147 NVENT: EXPANSIONS, JANUARY 2021-MARCH 2026 205 TABLE 148 KAORI HEAT TREATMENT CO., LTD.: COMPANY OVERVIEW 206 TABLE 149 KAORI HEAT TREATMENT CO., LTD.: PRODUCTS OFFERED 207 TABLE 150 ZUTACORE, INC: COMPANY OVERVIEW 208 TABLE 151 ZUTACORE, INC.: PRODUCTS OFFERED 208 TABLE 152 ZUTACORE, INC.: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 208 TABLE 153 ZUTACORE, INC.: DEALS, JANUARY 2021-MARCH 2026 209 TABLE 154 ICEOTOPE PRECISION LIQUID COOLING: COMPANY OVERVIEW 211 TABLE 155 ICEOTOPE PRECISION LIQUID COOLING: PRODUCTS OFFERED 211 TABLE 156 ICEOTOPE PRECISION LIQUID COOLING: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 212 TABLE 157 ICEOTOPE PRECISION LIQUID COOLING: DEALS, JANUARY 2021-MARCH 2026 213 TABLE 158 ICEOTOPE PRECISION LIQUID COOLING: EXPANSIONS, JANUARY 2021-MARCH 2026 214 TABLE 159 BOYD: COMPANY OVERVIEW 215 TABLE 160 BOYD: PRODUCTS OFFERED 215 TABLE 161 TAISOL ELECTRONICS CO., LTD.: COMPANY OVERVIEW 216 TABLE 162 TAISOL ELECTRONICS CO., LTD.: PRODUCTS OFFERED 217 TABLE 163 WIWYNN CORPORATION: COMPANY OVERVIEW 218 TABLE 164 WIWYNN CORPORATION: PRODUCTS OFFERED 218 TABLE 165 INSPUR CO., LTD.: COMPANY OVERVIEW 219 TABLE 166 INSPUR CO., LTD.: PRODUCTS OFFERED 220 TABLE 167 LENOVO: COMPANY OVERVIEW 221 TABLE 168 LENOVO: PRODUCTS OFFERED 222 TABLE 169 LENOVO: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 224 TABLE 170 LENOVO: DEALS, JANUARY 2021-MARCH 2026 225 TABLE 171 ACCELSIUS LLC: COMPANY OVERVIEW 226 TABLE 172 ACCELSIUS LLC: PRODUCTS OFFERED 226 TABLE 173 ACCELSIUS LLC: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 227 TABLE 174 STULZ GMBH: COMPANY OVERVIEW 228 TABLE 175 STULZ GMBH: PRODUCTS OFFERED 228 TABLE 176 STULZ GMBH: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 229 TABLE 177 RITTAL GMBH & CO. KG: COMPANY OVERVIEW 230 TABLE 178 RITTAL GMBH & CO. KG: PRODUCTS OFFERED 230 TABLE 179 RITTAL GMBH & CO. KG: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 231 TABLE 180 RITTAL GMBH & CO. KG: DEALS, JANUARY 2021-MARCH 2026 231 TABLE 181 DELTA POWER SOLUTIONS: COMPANY OVERVIEW 232 TABLE 182 DELTA POWER SOLUTIONS: PRODUCTS OFFERED 233 TABLE 183 DELTA POWER SOLUTIONS: DEALS, JANUARY 2021-MARCH 2026 233 TABLE 184 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): COMPANY OVERVIEW 234 TABLE 185 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): PRODUCTS/SOLUTIONS/SERVICES OFFERED 234 TABLE 186 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 235 TABLE 187 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): DEALS, JANUARY 2021-MARCH 2026 235 TABLE 188 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): EXPANSIONS, JANUARY 2021-MARCH 2026 236 TABLE 189 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): OTHER DEVELOPMENTS, JANUARY 2021-MARCH 2026 236 TABLE 190 CHILLDYNE, INC.: COMPANY OVERVIEW 237 TABLE 191 CHILLDYNE, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 237 TABLE 192 CHILLDYNE, INC.: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 238 TABLE 193 CHILLDYNE, INC.: DEALS, JANUARY 2021-MARCH 2026 239 TABLE 194 MALICO INC.: COMPANY OVERVIEW 240 TABLE 195 MALICO INC: PRODUCTS/SOLUTIONS/SERVICES OFFERED 240 TABLE 196 KOOLANCE, INC.: COMPANY OVERVIEW 241 TABLE 197 GIGA-BYTE TECHNOLOGY CO., LTD.: COMPANY OVERVIEW 241 TABLE 198 OPTICOOL TECHNOLOGIES: COMPANY OVERVIEW 242 TABLE 199 SEGUENTE INC.: COMPANY OVERVIEW 242 TABLE 200 COOLCENTRIC: COMPANY OVERVIEW 243 FIGURE 1 DATA CENTER DIRECT-TO-CHIP COOLING MARKET SEGMENTATION AND REGIONAL SCOPE 25 FIGURE 2 KEY INSIGHTS AND MARKET HIGHLIGHTS 28 FIGURE 3 GLOBAL DATA CENTER DIRECT-TO-CHIP COOLING MARKET, 2026–2032 29 FIGURE 4 MAJOR STRATEGIES ADOPTED BY KEY PLAYERS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET (2020–2025) 29 FIGURE 5 DISRUPTIVE TRENDS IMPACTING GROWTH OF DATA CENTER DIRECT-TO-CHIP COOLING MARKET 30 FIGURE 6 HIGH-GROWTH SEGMENTS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 30 FIGURE 7 ASIA PACIFIC TO EXHIBIT FASTEST GROWTH DURING FORECAST PERIOD 31 FIGURE 8 RAPID ADOPTION OF AI, ML, AND BLOCKCHAIN TECHNOLOGIES TO CREATE LUCRATIVE OPPORTUNITIES FOR MARKET PLAYERS 32 FIGURE 9 HYPERSCALE DATA CENTERS TO BE LARGEST SEGMENT DURING FORECAST PERIOD 32 FIGURE 10 SINGLE PHASE TO LEAD OVERALL MARKET DURING FORECAST PERIOD 33 FIGURE 11 NORTH AMERICA TO DOMINATE GLOBAL DATA CENTER DIRECT-TO-CHIP COOLING MARKET 33 FIGURE 12 CHINA TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD 34 FIGURE 13 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES 35 FIGURE 14 ESTIMATED GLOBAL DATA CENTER CAPACITY DEMAND 36 FIGURE 15 INCREASE IN POWER DENSITIES IN DATA CENTERS (KW PER RACK) 37 FIGURE 16 DATA CENTER POWER DENSITIES, BY DEPLOYMENT TYPE (KW PER RACK) 38 FIGURE 17 POWER USAGE EFFECTIVENESS 39 FIGURE 18 GROWTH OF GLOBAL EDGE DATA CENTERS MARKET 41 FIGURE 19 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: PORTER’S FIVE FORCES ANALYSIS 49 FIGURE 20 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: VALUE CHAIN ANALYSIS 56 FIGURE 21 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: ECOSYSTEM ANALYSIS 58 FIGURE 22 TRENDS AND DISRUPTIONS IMPACTING CUSTOMER BUSINESS 61 FIGURE 23 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: INVESTMENT AND FUNDING SCENARIO, 2019–2024 62 FIGURE 24 FUTURE APPLICATIONS OF DATA CENTER DIRECT-TO-CHIP COOLING MARKET 65 FIGURE 25 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DECISION-MAKING FACTORS 86 FIGURE 26 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY END USER 87 FIGURE 27 KEY BUYING CRITERIA, BY END USER 88 FIGURE 28 ADOPTION BARRIERS & INTERNAL CHALLENGES 90 FIGURE 29 SINGLE-PHASE TO BE FASTER-GROWING SEGMENT DURING FORECAST PERIOD 97 FIGURE 30 HYPERSCALE DATA CENTERS TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD 102 FIGURE 31 NORTH AMERICA TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD 108 FIGURE 32 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET SNAPSHOT 110 FIGURE 33 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET SNAPSHOT 116 FIGURE 34 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET SNAPSHOT 130 FIGURE 35 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: REVENUE ANALYSIS OF KEY COMPANIES, 2020–2024 152 FIGURE 36 RANKING OF KEY PLAYERS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 153 FIGURE 37 DATA CENTER DIRECT-TO-CHIP COOLING MARKET SHARE ANALYSIS, 2025 153 FIGURE 38 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: BRAND/PRODUCT COMPARISON 156 FIGURE 39 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: EV/EBITDA 158 FIGURE 40 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: EV/REVENUE 158 FIGURE 41 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: YEAR-TO-DATE (YTD) PRICE TOTAL RETURN AND FIVE-YEAR STOCK BETA OF KEY MANUFACTURERS 159 FIGURE 42 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: COMPANY EVALUATION MATRIX (KEY PLAYERS), 2025 160 FIGURE 43 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: COMPANY FOOTPRINT 161 FIGURE 44 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: COMPANY EVALUATION MATRIX (STARTUPS/SMES), 2025 167 FIGURE 45 VERTIV GROUP CORP.: COMPANY SNAPSHOT 174 FIGURE 46 SUPER MICRO COMPUTER, INC.: COMPANY SNAPSHOT 180 FIGURE 47 MODINE MANUFACTURING COMPANY: COMPANY SNAPSHOT 185 FIGURE 48 SCHNEIDER ELECTRIC: COMPANY SNAPSHOT 192 FIGURE 49 FLEX LTD.: COMPANY SNAPSHOT 197 FIGURE 50 NVENT: COMPANY SNAPSHOT 204 FIGURE 51 KAORI HEAT TREATMENT CO., LTD.: COMPANY SNAPSHOT 206 FIGURE 52 TAISOL ELECTRONICS CO., LTD.: COMPANY SNAPSHOT 217 FIGURE 53 WIWYNN CORPORATION: COMPANY SNAPSHOT 218 FIGURE 54 INSPUR CO., LTD.: COMPANY SNAPSHOT 219 FIGURE 55 LENOVO: COMPANY SNAPSHOT 222 FIGURE 56 DELTA POWER SOLUTIONS: COMPANY SNAPSHOT 232 FIGURE 57 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: RESEARCH DESIGN 244 FIGURE 58 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 248 FIGURE 59 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 249 FIGURE 60 MAIN MATRIX CONSIDERED TO ASSESS DEMAND FOR DATA CENTER DIRECT-TO-CHIP COOLING 249 FIGURE 61 STEPS CONSIDERED TO ANALYZE SUPPLY OF DATA CENTER DIRECT- TO-CHIP COOLING 250 FIGURE 62 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DATA TRIANGULATION 251

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